公开(公告)号：US20100080115A1

公开(公告)日：2010-04-01

申请号：US12258855

申请日：2008-10-27

申请人： Chen-Yui Yang ,  Paritosh Bajpay ,  Wen-Jui Li ,  Peter Wanda ,  Ken Yeh ,  Carolyn V. Bekampis

发明人： Chen-Yui Yang ,  Paritosh Bajpay ,  Wen-Jui Li ,  Peter Wanda ,  Ken Yeh ,  Carolyn V. Bekampis

IPC分类号： G08C15/00

CPC分类号： H04L45/28 ,  H04L41/0681 ,  H04L43/16 ,  H04L45/04

摘要： Example methods and apparatus to monitor border gateway protocol sessions are disclosed. A disclosed example method includes detecting a failure of a first border gateway protocol (BGP) session and initiating a session-down timer in response to detecting the failure. The example method also includes generating a sustained-down alarm when a threshold time value of the session-down timer is exceeded before the first BGP session is re-established.

摘要翻译： 公开了监控边界网关协议会话的示例方法和设备。 所公开的示例性方法包括响应于检测到故障来检测第一边界网关协议（BGP）会话的故障并启动会话关闭定时器。 该示例方法还包括在重新建立第一BGP会话之前超过会话切换定时器的阈值时间值时产生缓存告警。

公开(公告)号：US20090137113A1

公开(公告)日：2009-05-28

申请号：US11946831

申请日：2007-11-28

申请人： Sheng Hung Li ,  Siew-Seong Tan ,  Cheng-Yen Liu ,  Li-Ken Yeh

发明人： Sheng Hung Li ,  Siew-Seong Tan ,  Cheng-Yen Liu ,  Li-Ken Yeh

IPC分类号： H01L21/4763

CPC分类号： B81C1/00801 ,  B81C2201/0107 ,  B81C2201/014

摘要： A method for fabricating a microstructure is to form at least one insulation layer including a micro-electro-mechanical structure therein over an upper surface of a silicon substrate. The micro-electro-mechanical structure includes at least one microstructure and a metal sacrificial structure that are independent with each other. In the metal sacrificial structure are formed a plurality of metal layers and a plurality of metal via layers connected to the respective metal layers. A barrier layer is formed over an upper surface of the insulation layer, and an etching stop layer is subsequently formed over a lower surface of the silicon substrate. An etching operation is carried out from the lower surface of the silicon substrate to form a space corresponding to the micro-electro-mechanical structure, and then the metal sacrificial structure is etched, thus achieving a microstructure suspension.

摘要翻译： 用于制造微结构的方法是在硅衬底的上表面上形成包括微​​电子机械结构的至少一个绝缘层。 微电子机械结构包括彼此独立的至少一个微结构和金属牺牲结构。 在金属牺牲结构中形成多个金属层和连接到各个金属层的多个金属通孔层。 在绝缘层的上表面上形成阻挡层，随后在硅衬底的下表面上形成蚀刻停止层。 从硅衬底的下表面进行蚀刻操作以形成与微电子机械结构相对应的空间，然后蚀刻金属牺牲结构，从而实现微结构悬浮。

公开(公告)号：US20160273891A1

公开(公告)日：2016-09-22

申请号：US15050055

申请日：2016-02-22

申请人： PEI-KEN YEH

发明人： PEI-KEN YEH

IPC分类号： F42B6/08

CPC分类号： F42B6/08 ,  F42B6/02 ,  F42B6/04

摘要： An arrowhead assembly structure is connected with a front end of an arrow rod and includes: an arrowhead member, a first end of the arrowhead member being fitted on a front end of the arrow rod, the arrowhead member having a support flange and a hub section, the hub section axially extending from the support flange toward a second end of the arrowhead member, the hub section having a diameter smaller than outer diameter of the support flange; at least one first cushion member formed with a central through hole, by means of the central through hole, the first cushion member being fitted around the hub section, one end of the first cushion member being adhered to the support flange of the arrowhead member; and at least one second cushion member, a first end of the second cushion member being adhered to a second end of the first cushion member.

摘要翻译： 箭头组件结构与箭头杆的前端连接，并且包括：箭头构件，箭头构件的第一端装配在箭头杆的前端上，箭头构件具有支撑凸缘和毂部分 所述毂部分从所述支撑凸缘朝向所述箭头构件的第二端轴向延伸，所述毂部分的直径小于所述支撑凸缘的外径; 至少一个第一缓冲构件，其形成有中心通孔，借助于所述中心通孔，所述第一缓冲构件围绕所述毂部嵌合，所述第一缓冲构件的一端粘附到所述箭头构件的所述支撑凸缘; 和至少一个第二缓冲构件，所述第二缓冲构件的第一端粘附到所述第一缓冲构件的第二端。

公开(公告)号：US09435621B1

公开(公告)日：2016-09-06

申请号：US15050055

申请日：2016-02-22

申请人： Pei-Ken Yeh

发明人： Pei-Ken Yeh

IPC分类号： F42B6/08 ,  A63B65/02 ,  F42B6/02 ,  F42B6/04

CPC分类号： F42B6/08 ,  F42B6/02 ,  F42B6/04

摘要： An arrowhead assembly structure is connected with a front end of an arrow rod and includes: an arrowhead member, a first end of the arrowhead member being fitted on a front end of the arrow rod, the arrowhead member having a support flange and a hub section, the hub section axially extending from the support flange toward a second end of the arrowhead member, the hub section having a diameter smaller than outer diameter of the support flange; at least one first cushion member formed with a central through hole, by means of the central through hole, the first cushion member being fitted around the hub section, one end of the first cushion member being adhered to the support flange of the arrowhead member; and at least one second cushion member, a first end of the second cushion member being adhered to a second end of the first cushion member.

摘要翻译： 箭头组件结构与箭头杆的前端连接，并且包括：箭头构件，箭头构件的第一端装配在箭头杆的前端上，箭头构件具有支撑凸缘和毂部分 所述毂部分从所述支撑凸缘朝向所述箭头构件的第二端轴向延伸，所述毂部分的直径小于所述支撑凸缘的外径; 至少一个第一缓冲构件，其形成有中心通孔，借助于所述中心通孔，所述第一缓冲构件围绕所述毂部嵌合，所述第一缓冲构件的一端粘附到所述箭头构件的所述支撑凸缘; 和至少一个第二缓冲构件，所述第二缓冲构件的第一端粘附到所述第一缓冲构件的第二端。

公开(公告)号：US20120213091A1

公开(公告)日：2012-08-23

申请号：US13459611

申请日：2012-04-30

申请人： Chen-Yul Yang ,  Paritosh Bajpay ,  Wen-Jui Li ,  Peter Wanda ,  Ken Yeh ,  Carolyn V. Bekampis

发明人： Chen-Yul Yang ,  Paritosh Bajpay ,  Wen-Jui Li ,  Peter Wanda ,  Ken Yeh ,  Carolyn V. Bekampis

IPC分类号： H04L12/26

CPC分类号： H04L45/28 ,  H04L41/0681 ,  H04L43/16 ,  H04L45/04

摘要： Example methods and apparatus to monitor border gateway protocol sessions are disclosed. A disclosed example method includes detecting a failure of a first BGP session, initiating a sustained-down timer and a reset-timer in response to detecting the failure, identifying a sustained-down condition in response to the sustained-down timer exceeding a first time threshold, identifying a flapping condition in response to counting a threshold number of BGP failures and corresponding BGP re-establishments during a second time threshold of the reset-timer, and identifying a continuous flapping condition in response to detecting the flapping condition consecutively for a threshold number of instances.

摘要翻译： 公开了监控边界网关协议会话的示例方法和设备。 所公开的示例性方法包括响应于检测到故障来检测第一BGP会话的故障，启动缓慢定时器和复位定时器，响应于持续下降定时器超过第一时间来识别持续状态 阈值，响应于在复位定时器的第二时间阈值期间计数阈值数量的BGP故障和相应的BGP重建，识别振荡条件，以及响应于连续检测阈值的阈值来识别连续拍摄条件 实例数。

公开(公告)号：US08476910B2

公开(公告)日：2013-07-02

申请号：US12821135

申请日：2010-06-23

申请人： Li-Ken Yeh ,  Siew-Seong Tan

发明人： Li-Ken Yeh ,  Siew-Seong Tan

IPC分类号： G01R35/00 ,  G01R27/26

CPC分类号： G01R27/2605 ,  G01D5/24 ,  G01D18/004 ,  G01P15/125 ,  G01P21/00 ,  G06F3/0418 ,  G06F3/044

摘要： A capacitive sensor with a calibration mechanism is provided. The capacitive sensor includes a set of sensing capacitors to generate a capacitance variation, a subtraction circuit and an integration circuit. The subtraction circuit includes a first capacitor array to generate offset-adjusting charges and a second capacitor array to generate subtraction charges according to an initial offset and a sensitivity of the sensing capacitors respectively. The integration circuit includes two input ends, wherein one of them is connected to the sensing capacitors and the subtraction circuit. During a sensing period, the integration circuit performs integration according to the capacitance variation and performs cancellation of the effect of the initial offset according to the offset-adjusting charges to generate an integration output signal that is continuously subtracted by the subtraction charges during a computing period to generate a subtraction count. A capacitive sensing method is disclosed herein as well.

摘要翻译： 提供具有校准机构的电容传感器。 电容传感器包括一组感测电容器，用于产生电容变化，减法电路和积分电路。 减法电路包括产生偏移调整电荷的第一电容器阵列和分别根据感测电容器的初始偏移和灵敏度产生减法电荷的第二电容器阵列。 积分电路包括两个输入端，其中一个输入端连接到感测电容器和减法电路。 在感测期间，积分电路根据电容变化进行积分，并且根据偏移调整电荷来执行初始偏移的影响的消除，以产生在计算周期期间被减法电荷连续减去的积分输出信号 以产生减法计数。 本文还公开了一种电容感测方法。

公开(公告)号：US20100109121A1

公开(公告)日：2010-05-06

申请号：US12652736

申请日：2010-01-05

申请人： Li-Ken YEH ,  I-Hsiang CHIU

发明人： Li-Ken YEH ,  I-Hsiang CHIU

IPC分类号： H01L29/00

CPC分类号： B81C1/00246 ,  B81C2203/0728

摘要： A micro electromechanical system and a fabrication method thereof, which has trenches formed on a substrate to prevent circuits from interfering each other, and to prevent over-etching of the substrate when releasing a microstructure.

摘要翻译： 一种微机电系统及其制造方法，其具有形成在基板上的沟槽，以防止电路彼此干扰，并且在释放微结构时防止基板过度蚀刻。

公开(公告)号：US07935556B2

公开(公告)日：2011-05-03

申请号：US11845780

申请日：2007-08-27

申请人： Li-Ken Yeh ,  I-Hsiang Chiu

发明人： Li-Ken Yeh ,  I-Hsiang Chiu

IPC分类号： H01L21/00

CPC分类号： B81C1/00246 ,  B81C2203/0728

摘要： A micro electromechanical system and a fabrication method thereof, which has trenches formed on a substrate to prevent circuits from interfering each other, and to prevent over-etching of the substrate when releasing a microstructure.

摘要翻译： 一种微机电系统及其制造方法，其具有形成在基板上的沟槽，以防止电路彼此干扰，并且在释放微结构时防止基板过度蚀刻。

公开(公告)号：US07666702B2

公开(公告)日：2010-02-23

申请号：US11946831

申请日：2007-11-28

申请人： Sheng-Hung Li ,  Siew-Seong Tan ,  Cheng-Yen Liu ,  Li-Ken Yeh

发明人： Sheng-Hung Li ,  Siew-Seong Tan ,  Cheng-Yen Liu ,  Li-Ken Yeh

IPC分类号： H01L21/00 ,  H01L21/4763 ,  G02B26/00

CPC分类号： B81C1/00801 ,  B81C2201/0107 ,  B81C2201/014

摘要： A method for fabricating a microstructure is to form at least one insulation layer including a micro-electro-mechanical structure therein over an upper surface of a silicon substrate. The micro-electro-mechanical structure includes at least one microstructure and a metal sacrificial structure that are independent with each other. In the metal sacrificial structure are formed a plurality of metal layers and a plurality of metal via layers connected to the respective metal layers. A barrier layer is formed over an upper surface of the insulation layer, and an etching stop layer is subsequently formed over a lower surface of the silicon substrate. An etching operation is carried out from the lower surface of the silicon substrate to form a space corresponding to the micro-electro-mechanical structure, and then the metal sacrificial structure is etched, thus achieving a microstructure suspension.

摘要翻译： 用于制造微结构的方法是在硅衬底的上表面上形成包括微​​电子机械结构的至少一个绝缘层。 微电子机械结构包括彼此独立的至少一个微结构和金属牺牲结构。 在金属牺牲结构中形成多个金属层和连接到各个金属层的多个金属通孔层。 在绝缘层的上表面上形成阻挡层，随后在硅衬底的下表面上形成蚀刻停止层。 从硅衬底的下表面进行蚀刻操作以形成与微电子机械结构相对应的空间，然后蚀刻金属牺牲结构，从而实现微结构悬浮。

公开(公告)号：US20090057817A1

公开(公告)日：2009-03-05

申请号：US11845780

申请日：2007-08-27

申请人： Li-Ken YEH ,  I-Hsiang CHIU

发明人： Li-Ken YEH ,  I-Hsiang CHIU

IPC分类号： H01L29/00 ,  H01L21/311

CPC分类号： B81C1/00246 ,  B81C2203/0728

摘要： A micro electromechanical system and a fabrication method thereof, which has trenches formed on a substrate to prevent circuits from interfering each other, and to prevent over-etching of the substrate when releasing a microstructure.

摘要翻译： 一种微机电系统及其制造方法，其具有形成在基板上的沟槽，以防止电路彼此干扰，并且在释放微结构时防止基板过度蚀刻。