公开(公告)号：US20080202981A1

公开(公告)日：2008-08-28

申请号：US12036742

申请日：2008-02-25

Applicant: Yuuzou HAMANAKA ,  Yukio ANDO ,  Keiichi SASAMURA ,  Kenichi YAZAKI ,  Yuuji HASEGAWA ,  Kouichi SHINYA

Inventor： Yuuzou HAMANAKA ,  Yukio ANDO ,  Keiichi SASAMURA ,  Kenichi YAZAKI ,  Yuuji HASEGAWA ,  Kouichi SHINYA

IPC: B65D85/00

CPC classification number: H05K13/0084

Abstract: The invention provides carrier tapes in which, when the carrier tapes are wound up, regardless of the positions of accommodating portions of the upper and lower carrier tapes that overlap each other, electronic components accommodated in the accommodating portions can be reliably secured, so that the electronic components can be prevented from becoming dislodged from the accommodating portions; and electronic-component accommodating members including the carrier tapes.In each carrier tape having the plurality of accommodating portions that accommodate the electronic components and that are formed in a longitudinal direction, a plurality of protrusions are disposed at the bottom surfaces of the accommodating portions, and surfaces of interval portions provided between the accommodating portions that are adjacent to each other are formed lower than surfaces of guides of the carrier tapes.

Abstract translation: 本发明提供了一种载带，其中当载带缠绕时，不管彼此重叠的上和下载带的容纳部分的位置如何，可以可靠地确保容纳在容纳部分中的电子部件， 可以防止电子部件从容纳部移除; 以及包括载带的电子部件容纳部件。 在具有容纳电子部件并且沿纵向形成的多个容纳部的每个载带中，在容纳部的底面设置有多个突起，在容纳部之间设置间隔部的表面， 彼此相邻形成为比载带的引导件的表面低。

公开(公告)号：US20070146926A1

公开(公告)日：2007-06-28

申请号：US11361059

申请日：2006-02-24

Applicant: Hideyasu Hashiba ,  Yukio Ando ,  Keiichi Sasamura ,  Kenichi Yazaki ,  Yuuzou Hamanaka

Inventor： Hideyasu Hashiba ,  Yukio Ando ,  Keiichi Sasamura ,  Kenichi Yazaki ,  Yuuzou Hamanaka

IPC: G11B5/027

CPC classification number: B65B15/04 ,  H05K13/0419

Abstract: An electronic device receiving apparatus having a sealed structure, includes a tape whereby an electronic device is received in the electronic device receiving apparatus. The tape elastically holds the electronic device and runs inside of the electronic device receiving apparatus. An opening part for loading/unloading and a tape extending mechanism are provided inside of the electronic device receiving apparatus. The opening part for loading/unloading is provided above the tape so that the electronic device is loaded onto and unloaded from the tape. The opening part for loading/unloading has an opening part configured to open the electronic device receiving apparatus. The tape extending part extends the tape in a direction substantially perpendicular to a running direction of the tape.

Abstract translation: 一种具有密封结构的电子设备接收设备，包括一个电子设备接收在电子设备接收设备中的带子。 胶带弹性地保持电子装置并在电子装置接收装置的内部运行。 在电子设备接收设备内部设置有用于装载/卸载的开口部分和带延伸机构。 用于装载/卸载的开口部分设置在带的上方，使得电子装置被装载到带上并从带上卸载。 用于装载/卸载的开启部分具有打开电子装置接收装置的开口部分。 带延伸部分沿着与带的运行方向基本垂直的方向延伸带。

公开(公告)号：US08033397B2

公开(公告)日：2011-10-11

申请号：US11541727

申请日：2006-10-03

Applicant: Keiichi Sasamura ,  Kenichi Yazaki ,  Yuuzou Hamanaka ,  Yukio Ando ,  Hideyasu Hashiba

Inventor： Keiichi Sasamura ,  Kenichi Yazaki ,  Yuuzou Hamanaka ,  Yukio Ando ,  Hideyasu Hashiba

IPC: B65D85/00 ,  H01L23/02

CPC classification number: H01L21/67356 ,  H01L21/6835 ,  H01L2221/68313 ,  H01L2924/19041 ,  H05K13/0084

Abstract: The present invention provides a cover tape for packaging a semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for the semiconductor device using the cover tape for packaging the semiconductor device. The cover tape for packaging the semiconductor device has a net-shaped structure at least in a portion, and the cover tape for packaging the semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices. The package for the semiconductor device contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging the semiconductor device.

Abstract translation: 本发明提供了一种用于封装半导体器件的覆盖带，其保护半导体器件的外形，并且能够通过在带中的装运来提高半导体器件的安装速度，以及使用覆盖带的半导体器件的封装 用于封装半导体器件。 用于封装半导体器件的覆盖带至少部分地具有网状结构，并且用于封装半导体器件的覆盖带被粘贴到具有多个包含半导体器件的凹坑的压纹带上。 用于半导体器件的封装包含具有多个包含半导体器件的凹穴的压花带，以及用于封装半导体器件的盖带。

公开(公告)号：US07828152B2

公开(公告)日：2010-11-09

申请号：US12036742

申请日：2008-02-25

Applicant: Yuuzou Hamanaka ,  Yukio Ando ,  Keiichi Sasamura ,  Kenichi Yazaki ,  Yuuji Hasegawa ,  Kouichi Shinya

Inventor： Yuuzou Hamanaka ,  Yukio Ando ,  Keiichi Sasamura ,  Kenichi Yazaki ,  Yuuji Hasegawa ,  Kouichi Shinya

IPC: B65D85/00

CPC classification number: H05K13/0084

Abstract: The invention provides carrier tapes in which, when the carrier tapes are wound up, regardless of the positions of accommodating portions of the upper and lower carrier tapes that overlap each other, electronic components accommodated in the accommodating portions can be reliably secured, so that the electronic components can be prevented from becoming dislodged from the accommodating portions; and electronic-component accommodating members including the carrier tapes.In each carrier tape having the plurality of accommodating portions that accommodate the electronic components and that are formed in a longitudinal direction, a plurality of protrusions are disposed at the bottom surfaces of the accommodating portions, and surfaces of interval portions provided between the accommodating portions that are adjacent to each other are formed lower than surfaces of guides of the carrier tapes.

Abstract translation: 本发明提供了一种载带，其中当载带缠绕时，不管彼此重叠的上和下载带的容纳部分的位置如何，可以可靠地确保容纳在容纳部分中的电子部件， 可以防止电子部件从容纳部移除; 以及包括载带的电子部件容纳部件。 在具有容纳电子部件并且沿纵向形成的多个容纳部的每个载带中，在容纳部的底面设置有多个突起，在容纳部之间设置间隔部的表面， 彼此相邻形成为比载带的引导件的表面低。

公开(公告)号：US20070216000A1

公开(公告)日：2007-09-20

申请号：US11541727

申请日：2006-10-03

Applicant: Keiichi Sasamura ,  Kenichi Yazaki ,  Yuuzou Hamanaka ,  Yukio Ando ,  Hideyasu Hashiba

Inventor： Keiichi Sasamura ,  Kenichi Yazaki ,  Yuuzou Hamanaka ,  Yukio Ando ,  Hideyasu Hashiba

IPC: H01L23/02

CPC classification number: H01L21/67356 ,  H01L21/6835 ,  H01L2221/68313 ,  H01L2924/19041 ,  H05K13/0084

Abstract: The purpose of the present invention is to provide a cover tape for packaging semiconductor device which protects the outer shape of the semiconductor device, and is capable of improving the mounting speed of the semiconductor device by shipment in tape, and a package for semiconductor device using the cover tape for packaging semiconductor device. The cover tape for packaging semiconductor device of the present invention has a net-like structure 20 at least in a portion, and the cover tape for packaging semiconductor device is pasted onto an embossed tape which has a number of pockets containing semiconductor devices so as to cover the pockets. The package for semiconductor device of the present invention contains an embossed tape which has a number of pockets which contain semiconductor devices, and the cover tape for packaging semiconductor device of the present invention.

Abstract translation: 本发明的目的是提供一种保护半导体器件的外形的半导体器件封装带，并且能够通过在带中的装运来提高半导体器件的安装速度，以及使用半导体器件的封装 用于封装半导体器件的封条。 本发明的包装用半导体装置用胶带至少部分具有网状结构体20，将半导体装置用封装胶带贴合在具有多个包含半导体装置的袋的压花带上，以便 盖口袋 本发明的半导体装置用封装体，具有包含半导体器件的多个凹部的压纹带以及本发明的半导体装置用封装带。