公开(公告)号：US08426315B2

公开(公告)日：2013-04-23

申请号：US11525658

申请日：2006-09-22

申请人： Shouji Tochishita ,  Kenji Nishihara ,  Tohru Haruki ,  Tadao Uehara ,  Kiyotaka Ishibushi

发明人： Shouji Tochishita ,  Kenji Nishihara ,  Tohru Haruki ,  Tadao Uehara ,  Kiyotaka Ishibushi

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/31144

摘要： A method of manufacturing a semiconductor device is disclosed that includes a semiconductor wafer having a main surface including a device chip area, a peripheral area encompassing the device chip area, and a blank area situated between the device chip area and the peripheral area. The method includes the steps of coating the entire main surface of the semiconductor wafer with a positive photosensitive resist, defining an additional exposure area in the blank area, conducting a first exposure process on the peripheral area and the additional exposure area, conducting a second exposure process on the device chip area, removing resist remaining on predetermined areas of the device chip area, the peripheral area and the blank area after conducting the first and second exposure processes for forming a resist pattern, and dry-etching the main surface of the semiconductor wafer by using the resist pattern as a mask.

摘要翻译： 公开了一种制造半导体器件的方法，其包括具有包括器件芯片区域的主表面，包围器件芯片区域的外围区域以及位于器件芯片区域和周边区域之间的空白区域的半导体晶片。 该方法包括以下步骤：用正光敏抗蚀剂涂覆半导体晶片的整个主表面，在空白区域中限定额外的曝光区域，对外围区域和附加曝光区域进行第一曝光处理，进行第二曝光 在进行用于形成抗蚀剂图案的第一和第二曝光处理之后，在器件芯片区域上处理残留在器件芯片区域的预定区域上的抗蚀剂，外围区域和空白区域，以及干法蚀刻半导体的主表面 通过使用抗蚀剂图案作为掩模。

公开(公告)号：US08051631B2

公开(公告)日：2011-11-08

申请号：US12051815

申请日：2008-03-19

申请人： Kenji Nishihara ,  Takashi Kuramoto ,  Masashi Osuga ,  Takashi Shibata ,  Satoshi Ogata ,  Hironobu Nishihara ,  Hiroshi Kawabata

发明人： Kenji Nishihara ,  Takashi Kuramoto ,  Masashi Osuga ,  Takashi Shibata ,  Satoshi Ogata ,  Hironobu Nishihara ,  Hiroshi Kawabata

IPC分类号： A01D34/66

CPC分类号： A01D43/063

摘要： A rear discharge mower comprising: a first shaft; a first blade that is rotated in unison with the first shaft; a second shaft that is configured to be rotated in a direction opposite from a rotational direction of the first shaft; a second blade that is rotated in unison with the second shaft, wherein a grass-clippings discharge path is formed through which grass clippings are discharged in a rearward direction from the area between the first shaft and second shaft; an enclosing casing that supports the blade shafts; and a power train that is accommodated in the enclosing casing and that transmits power to the first and second blade shafts.

摘要翻译： 一种后排式割草机，包括：第一轴; 与第一轴一致地旋转的第一叶片; 第二轴，其构造成在与所述第一轴的旋转方向相反的方向上旋转; 与所述第二轴一致地旋转的第二叶片，其中形成一个草屑排出路径，草屑从第一轴和第二轴之间的区域沿向后方向排出; 支撑叶片轴的封闭壳体; 以及容纳在所述封闭壳体中并将动力传递到所述第一和第二叶片轴的动力传动系。

公开(公告)号：US07755207B2

公开(公告)日：2010-07-13

申请号：US11363841

申请日：2006-02-28

申请人： Koichi Sogawa ,  Kiyoshi Yano ,  Tohru Haruki ,  Hidetsugu Miyake ,  Shouji Tochishita ,  Minoru Ohtomo ,  Kenji Nishihara

发明人： Koichi Sogawa ,  Kiyoshi Yano ,  Tohru Haruki ,  Hidetsugu Miyake ,  Shouji Tochishita ,  Minoru Ohtomo ,  Kenji Nishihara

IPC分类号： H01L23/544

CPC分类号： H01L23/544 ,  G03F7/70633 ,  G03F9/7084 ,  H01L2223/5442 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor wafer is disclosed that includes a substrate; a plurality of device chip areas formed on the substrate; a plurality of scribe lines formed in a lattice-like manner on the substrate, the scribe lines being provided so as to separate the device chip areas from each other; a blank area in which at least one alignment mark formed of a metal film for alignment of the semiconductor wafer is formed, the blank area being provided in an area different from the device chip areas; and a scribe area in which the alignment mark is prevented from existing, the scribe area being provided in each area where the blank area crosses the scribe lines.

摘要翻译： 公开了一种半导体晶片，其包括基板; 形成在所述基板上的多个器件芯片区域; 在基板上形成为格子状的多个划痕线，划线被设置为将装置芯片区域彼此分开; 形成由用于半导体晶片对准的金属膜形成的至少一个对准标记的空白区域，所述空白区域设置在与所述器件芯片区域不同的区域中; 以及防止对准标记存在的划片区域，划线区域设置在空白区域穿过划线的每个区域中。

公开(公告)号：US08056306B2

公开(公告)日：2011-11-15

申请号：US12544647

申请日：2009-08-20

申请人： Kenji Nishihara ,  Takashi Kuramoto ,  Masashi Osuga ,  Takashi Shibata ,  Satoshi Ogata ,  Hironobu Nishihara ,  Hiroshi Kawabata

发明人： Kenji Nishihara ,  Takashi Kuramoto ,  Masashi Osuga ,  Takashi Shibata ,  Satoshi Ogata ,  Hironobu Nishihara ,  Hiroshi Kawabata

IPC分类号： A01D34/66

CPC分类号： A01D43/063

摘要： A rear discharge mower comprising: a first shaft; a first blade that is rotated in unison with the first shaft; a second shaft that is configured to be rotated in a direction opposite from a rotational direction of the first shaft; a second blade that is rotated in unison with the second shaft, wherein a grass-clippings discharge path is formed through which grass clippings are discharged in a rearward direction from the area between the first shaft and second shaft; an enclosing casing that supports the blade shafts; and a power train that is accommodated in the enclosing casing and that transmits power to the first and second blade shafts.

公开(公告)号：US20110063964A1

公开(公告)日：2011-03-17

申请号：US12562045

申请日：2009-09-17

申请人： Yuji Omura ,  Kenji Nishihara

发明人： Yuji Omura ,  Kenji Nishihara

IPC分类号： G11B3/58

CPC分类号： G11B19/2009 ,  Y10T29/49025 ,  Y10T29/49034 ,  Y10T29/53096

摘要： A method of manufacturing a disk drive device including: assembling a subassembly by fixing at least a bearing unit, a drive unit and a hub to a base member in a first clean room; cleaning the subassembly in a second clean room; and sealing the subassembly by a sealing member. The first clean room and the second clean room are communicated with each other by a communicating opening for transferring the subassembly, and an atmospheric pressure in the second clean room is equal to or higher than that in the first clean room.

摘要翻译： 一种制造磁盘驱动装置的方法，包括：通过将至少一个轴承单元，一个驱动单元和一个毂固定在第一个洁净室中的底座部件上来组装一个组件; 在第二个洁净室中清洁子组件; 并且通过密封构件密封所述子组件。 第一洁净室和第二洁净室通过用于传送子组件的连通开口彼此连通，第二洁净室中的大气压力等于或高于第一洁净室中的大气压。

公开(公告)号：US20090170323A1

公开(公告)日：2009-07-02

申请号：US12340208

申请日：2008-12-19

申请人： MASANORI MIYATA ,  Taro Usami ,  Koichi Sogawa ,  Kenji Nishihara ,  Tadao Uehara ,  Shisyo Chin ,  Hiroaki Teratani ,  Akinori Suzuki ,  Yuuichi Kohno ,  Tetsuya Okada ,  Tohru Haruki

发明人： MASANORI MIYATA ,  Taro Usami ,  Koichi Sogawa ,  Kenji Nishihara ,  Tadao Uehara ,  Shisyo Chin ,  Hiroaki Teratani ,  Akinori Suzuki ,  Yuuichi Kohno ,  Tetsuya Okada ,  Tohru Haruki

IPC分类号： H01L21/304

CPC分类号： H01L22/20 ,  B24B37/042 ,  H01L21/31053

摘要： A chemical mechanical polishing method including a step of forming a plurality of interlayer insulating films so as to coat a plurality of projecting patterns, at least one of the plurality of projecting patterns being formed on each of a plurality of substrates, whereby the plurality of projection patterns have different area ratios R with respect to the corresponding substrates, and performing a flattening process on the interlayer insulating films before linear approximation; a step of obtaining a linear approximation formula R=aT+b expressing a relationship between the area ratio R and a polishing time T, where R1, R2, R3, . . . , Rx represent the area ratio R of each of the projecting patterns with respect to the corresponding substrates, and T1, T2, T3, . . . , Tx represent the polishing time T required for achieving a target film thickness when performing the flattening process by polishing each of the interlayer insulating films coating the projecting patterns; and a step of calculating, with the use of a formula T=(R−b)/a, the polishing time T for the interlayer insulating films coating the projecting patterns having the area ratio R.

摘要翻译： 一种化学机械抛光方法，包括形成多个层间绝缘膜以涂覆多个突起图案的步骤，所述多个突起图案中的至少一个形成在多个基板中的每一个上，由此所述多个突起 图案相对于相应的基板具有不同的面积比R，并且在线性近似之前对层间绝缘膜进行平坦化处理; 获得表示面积比R和研磨时间T之间的关系的线性近似公式R = aT + b的步骤，其中R1，R2，R3，...。 。 。 ，Rx表示每个投影图案相对于相应基板的面积比R，以及T1，T2，T3。 。 。 Tx表示通过抛光涂覆突出图案的每个层间绝缘膜进行平坦化处理时达到目标膜厚所需的抛光时间T; 以及使用公式T =（R-b）/ a计算涂覆具有面积比R的投影图案的层间绝缘膜的研磨时间T的步骤。

公开(公告)号：US20080276588A1

公开(公告)日：2008-11-13

申请号：US12051815

申请日：2008-03-19

申请人： Kenji Nishihara ,  Takashi Kuramoto ,  Masashi Osuga ,  Takashi Shibata ,  Satoshi Ogata ,  Hironobu Nishihara ,  Hiroshi Kawabata

发明人： Kenji Nishihara ,  Takashi Kuramoto ,  Masashi Osuga ,  Takashi Shibata ,  Satoshi Ogata ,  Hironobu Nishihara ,  Hiroshi Kawabata

IPC分类号： A01D34/412

CPC分类号： A01D43/063

摘要： A rear discharge mower comprising: a first shaft; a first blade that is rotated in unison with the first shaft; a second shaft that is configured to be rotated in a direction opposite from a rotational direction of the first shaft; a second blade that is rotated in unison with the second shaft, wherein a grass-clippings discharge path is formed through which grass clippings are discharged in a rearward direction from the area between the first shaft and second shaft; an enclosing casing that supports the blade shafts; and a power train that is accommodated in the enclosing casing and that transmits power to the first and second blade shafts.

摘要翻译： 一种后排式割草机，包括：第一轴; 与第一轴一致地旋转的第一叶片; 第二轴，其构造成在与所述第一轴的旋转方向相反的方向上旋转; 与所述第二轴一致地旋转的第二叶片，其中形成一个草屑排出路径，通过所述第二叶片从所述第一轴和第二轴之间的区域沿向后方向排出草屑; 支撑叶片轴的封闭壳体; 以及容纳在所述封闭壳体中并将动力传递到所述第一和第二叶片轴的动力传动系。

公开(公告)号：US20070023932A1

公开(公告)日：2007-02-01

申请号：US11363841

申请日：2006-02-28

申请人： Koichi Sogawa ,  Kiyoshi Yano ,  Tohru Haruki ,  Hidetsugu Miyake ,  Shouji Tochishita ,  Minoru Ohtomo ,  Kenji Nishihara

发明人： Koichi Sogawa ,  Kiyoshi Yano ,  Tohru Haruki ,  Hidetsugu Miyake ,  Shouji Tochishita ,  Minoru Ohtomo ,  Kenji Nishihara

IPC分类号： H01L23/544

CPC分类号： H01L23/544 ,  G03F7/70633 ,  G03F9/7084 ,  H01L2223/5442 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor wafer is disclosed that includes a substrate; a plurality of device chip areas formed on the substrate; a plurality of scribe lines formed in a lattice-like manner on the substrate, the scribe lines being provided so as to separate the device chip areas from each other; a blank area in which at least one alignment mark formed of a metal film for alignment of the semiconductor wafer is formed, the blank area being provided in an area different from the device chip areas; and a scribe area in which the alignment mark is prevented from existing, the scribe area being provided in each area where the blank area crosses the scribe lines.

摘要翻译： 公开了一种半导体晶片，其包括基板; 形成在所述基板上的多个器件芯片区域; 在基板上形成为格子状的多个划痕线，划线被设置为将装置芯片区域彼此分开; 形成由用于半导体晶片对准的金属膜形成的至少一个对准标记的空白区域，所述空白区域设置在与所述器件芯片区域不同的区域中; 以及防止对准标记存在的划片区域，划线区域设置在空白区域穿过划线的每个区域中。

公开(公告)号：US20130000106A1

公开(公告)日：2013-01-03

申请号：US13612783

申请日：2012-09-12

申请人： Yuji Omura ,  Kenji Nishihara

发明人： Yuji Omura ,  Kenji Nishihara

IPC分类号： G11B5/23

CPC分类号： G11B19/2009 ,  Y10T29/49025 ,  Y10T29/49034 ,  Y10T29/53096

摘要： A method of manufacturing a disk drive device including: assembling a subassembly by fixing at least a bearing unit, a drive unit and a hub to a base member in a first clean room; cleaning the subassembly in a second clean room; and sealing the subassembly by a sealing member. The first clean room and the second clean room are communicated with each other by a communicating opening for transferring the subassembly, and an atmospheric pressure in the second clean room is equal to or higher than that in the first clean room.

摘要翻译： 一种制造磁盘驱动装置的方法，包括：通过将至少一个轴承单元，一个驱动单元和一个毂固定在第一个洁净室中的底座部件上来组装一个组件; 在第二个洁净室中清洁子组件; 并且通过密封构件密封所述子组件。 第一洁净室和第二洁净室通过用于传送子组件的连通开口彼此连通，第二洁净室中的大气压力等于或高于第一洁净室中的大气压。

公开(公告)号：US08312617B2

公开(公告)日：2012-11-20

申请号：US12562045

申请日：2009-09-17

申请人： Yuji Omura ,  Kenji Nishihara

发明人： Yuji Omura ,  Kenji Nishihara

IPC分类号： G11B5/41 ,  B08B9/30

CPC分类号： G11B19/2009 ,  Y10T29/49025 ,  Y10T29/49034 ,  Y10T29/53096

摘要： A method of manufacturing a disk drive device including: assembling a subassembly by fixing at least a bearing unit, a drive unit and a hub to a base member in a first clean room; cleaning the subassembly in a second clean room; and sealing the subassembly by a sealing member. The first clean room and the second clean room are communicated with each other by a communicating opening for transferring the subassembly, and an atmospheric pressure in the second clean room is equal to or higher than that in the first clean room.

摘要翻译： 一种制造磁盘驱动装置的方法，包括：通过将至少一个轴承单元，一个驱动单元和一个毂固定在第一个洁净室中的底座部件上来组装一个组件; 在第二个洁净室中清洁子组件; 并且通过密封构件密封所述子组件。 第一洁净室和第二洁净室通过用于传送子组件的连通开口彼此连通，第二洁净室中的大气压力等于或高于第一洁净室中的大气压。