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公开(公告)号：US08942002B2
公开(公告)日：2015-01-27
申请号：US13595976
申请日：2012-08-27
Applicant: Shawn X. Arnold , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
Inventor： Shawn X. Arnold , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
IPC: H05K1/18
CPC classification number: G06F1/183 , H01L2224/16227 , H01L2924/19106 , H05K1/0231 , H05K1/141 , H05K1/181 , H05K1/185 , H05K3/403 , H05K2201/10378 , H05K2201/10515 , H05K2201/1053 , H05K2201/10545 , Y02P70/611 , Y10T29/4913
Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.
Abstract translation: 公开了堆叠的组件阵列。 在一个实施例中，第一和第二层部件电气和机械耦合到设置在第一和第二层之间的薄插入件。 第一层可以被配置为将堆叠的阵列附接到主机印刷电路板。 插入器可以将组件彼此绝缘，并且还可以在第一层和第二层之间的组件之间耦合信号。 在一个实施例中，第一和第二层中的部件是无源部件。
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公开(公告)号：US08767408B2
公开(公告)日：2014-07-01
申请号：US13592037
申请日：2012-08-22
Applicant: Shawn X. Arnold , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
Inventor： Shawn X. Arnold , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
IPC: H05K1/18
CPC classification number: G06F1/183 , H01L2224/16227 , H01L2924/19106 , H05K1/0231 , H05K1/141 , H05K1/181 , H05K1/185 , H05K3/403 , H05K2201/10378 , H05K2201/10515 , H05K2201/1053 , H05K2201/10545 , Y02P70/611 , Y10T29/4913
Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.
Abstract translation: 公开了堆叠的组件阵列。 在一个实施例中，第一和第二层组件通过电介质和机械耦合到具有设置在第一层和第二层之间的被封装的第三层组件的中介层。 第一层可以被配置为将堆叠的阵列附接到主机印刷电路板。 插入器可以在第一层和第二层之间的组件之间耦合信号。
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公开(公告)号：US20130201616A1
公开(公告)日：2013-08-08
申请号：US13595976
申请日：2012-08-27
Applicant: Shawn X. ARNOLD , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
Inventor： Shawn X. ARNOLD , Douglas P. Kidd , Sean A. Mayo , Scott P. Mullins , Dennis R. Pyper , Jeffrey M. Thoma , Kenyu Tojima
CPC classification number: G06F1/183 , H01L2224/16227 , H01L2924/19106 , H05K1/0231 , H05K1/141 , H05K1/181 , H05K1/185 , H05K3/403 , H05K2201/10378 , H05K2201/10515 , H05K2201/1053 , H05K2201/10545 , Y02P70/611 , Y10T29/4913
Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.
Abstract translation: 公开了堆叠的组件阵列。 在一个实施例中，第一和第二层部件电气和机械耦合到设置在第一和第二层之间的薄插入件。 第一层可以被配置为将堆叠的阵列附接到主机印刷电路板。 插入器可以将组件彼此绝缘，并且还可以在第一层和第二层之间的组件之间耦合信号。 在一个实施例中，第一和第二层中的部件是无源部件。
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公开(公告)号：US20130201615A1
公开(公告)日：2013-08-08
申请号：US13592037
申请日：2012-08-22
Applicant: Shawn X. ARNOLD , Douglas P. KIDD , Sean A. MAYO , Scott P. MULLINS , Dennis R. PYPER , Jeffrey M. THOMA , Kenyu TOJIMA
Inventor： Shawn X. ARNOLD , Douglas P. KIDD , Sean A. MAYO , Scott P. MULLINS , Dennis R. PYPER , Jeffrey M. THOMA , Kenyu TOJIMA
CPC classification number: G06F1/183 , H01L2224/16227 , H01L2924/19106 , H05K1/0231 , H05K1/141 , H05K1/181 , H05K1/185 , H05K3/403 , H05K2201/10378 , H05K2201/10515 , H05K2201/1053 , H05K2201/10545 , Y02P70/611 , Y10T29/4913
Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.
Abstract translation: 公开了堆叠的组件阵列。 在一个实施例中，第一和第二层组件通过电介质和机械耦合到具有设置在第一层和第二层之间的被封装的第三层组件的中介层。 第一层可以被配置为将堆叠的阵列附接到主机印刷电路板。 插入器可以在第一层和第二层之间的组件之间耦合信号。
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