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    Printed Circuit Board With Integral Radio-Frequency Shields
    1.
    发明申请
    Printed Circuit Board With Integral Radio-Frequency Shields 有权
    具有整体射频屏蔽的印刷电路板

    公开(公告)号：US20120140423A1

    公开(公告)日：2012-06-07

    申请号：US12958293

    申请日：2010-12-01

    Applicant: Joseph Fisher, JR. ,  Sean Mayo ,  Dennis R. Pyper ,  Paul Nangeroni ,  Jose Mantovani

    Inventor： Joseph Fisher, JR. ,  Sean Mayo ,  Dennis R. Pyper ,  Paul Nangeroni ,  Jose Mantovani

    IPC: H05K7/00

    CPC classification number: H05K9/0084 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/15192 ,  H05K3/284 ,  H05K9/0092 ,  H05K2201/0715 ,  H05K2201/09509 ,  H01L2924/00

    Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

    Abstract translation: 诸如集成电路的电气部件可以安装在印刷电路板上。 为了防止电气部件受到电磁干扰，可以在部件上形成射频屏蔽结构。 射频屏蔽结构可以由一层金属涂料形成。 组件可以被一层电介质覆盖。 可以在电路块之间的电介质中形成通道。 金属涂料可用于涂覆电介质的表面并填充通道。 可以在金属涂料的表面中形成开口以将射频屏蔽彼此分开。 印刷电路板表面上的导电迹线可用于将金属漆层连接到内部印刷电路板迹线。

    Printed circuit board with integral radio-frequency shields
    3.
    发明授权
    Printed circuit board with integral radio-frequency shields 有权
    具有集成射频屏蔽的印刷电路板

    公开(公告)号：US08654537B2

    公开(公告)日：2014-02-18

    申请号：US12958293

    申请日：2010-12-01

    Applicant: Joseph Fisher, Jr. ,  Sean Mayo ,  Dennis R. Pyper ,  Paul Nangeroni ,  Jose Mantovani

    Inventor： Joseph Fisher, Jr. ,  Sean Mayo ,  Dennis R. Pyper ,  Paul Nangeroni ,  Jose Mantovani

    IPC: H05K1/00

    CPC classification number: H05K9/0084 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/15192 ,  H05K3/284 ,  H05K9/0092 ,  H05K2201/0715 ,  H05K2201/09509 ,  H01L2924/00

    Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

    Abstract translation: 诸如集成电路的电气部件可以安装在印刷电路板上。 为了防止电气部件受到电磁干扰，可以在部件上形成射频屏蔽结构。 射频屏蔽结构可以由一层金属涂料形成。 组件可以被一层电介质覆盖。 可以在电路块之间的电介质中形成通道。 金属涂料可用于涂覆电介质的表面并填充通道。 可以在金属涂料的表面中形成开口以将射频屏蔽彼此分开。 印刷电路板表面上的导电迹线可用于将金属漆层连接到内部印刷电路板迹线。

    Mounting of Components Using Solder Paste Fiducials
    6.
    发明申请
    Mounting of Components Using Solder Paste Fiducials 审中-公开
    使用焊膏基准安装组件

    公开(公告)号：US20130125392A1

    公开(公告)日：2013-05-23

    申请号：US13298818

    申请日：2011-11-17

    Applicant: Dennis R. Pyper ,  Hong Wang ,  Wyeman Chen

    Inventor： Dennis R. Pyper ,  Hong Wang ,  Wyeman Chen

    IPC: H05K3/30

    CPC classification number: H05K1/0269 ,  H05K3/1216 ,  H05K3/303 ,  H05K3/3484 ,  H05K2201/09918 ,  Y02P70/613 ,  Y10T29/49133

    Abstract: A printed circuit board may have patterned traces. Components may be mounted to the printed circuit board using solder. Solder paste may be printed onto the printed circuit board using a stencil. Following reflow operations, the solder paste may form solder bumps that connect component leads to traces on the printed circuit board. Misalignment between the mounted components and printed circuit board traces can be minimized by forming fiducials from solder paste. During the process of printing solder paste patterns on the printed circuit board, solder paste printing equipment may form the solder paste fiducials. Component mounting equipment may use cameras or other imaging equipment to gather information on the location of the solder paste fiducials. The component mounting equipment may then mount the components on the printed circuit using the information on the location of the solder paste fiducials.

    Abstract translation: 印刷电路板可以具有图案迹线。 组件可以使用焊料安装到印刷电路板。 可以使用模板将焊膏印刷到印刷电路板上。 在回流操作之后，焊膏可以形成将组件引线连接到印刷电路板上的迹线的焊料凸块。 通过从焊膏形成基准，可以最小化安装部件和印刷电路板走线之间的对准。 在印刷电路板上印刷焊膏图案的过程中，焊膏印刷设备可能形成焊膏基准。 组件安装设备可以使用相机或其他成像设备来收集有关焊膏基准点位置的信息。 然后，部件安装设备可以使用关于焊膏基准的位置的信息将组件安装在印刷电路板上。

    PCB MANUFACTURING PROCESS AND STRUCTURE
    8.
    发明申请
    PCB MANUFACTURING PROCESS AND STRUCTURE 审中-公开
    PCB制造工艺和结构

    公开(公告)号：US20140008110A1

    公开(公告)日：2014-01-09

    申请号：US13541427

    申请日：2012-07-03

    Applicant: Shawn X. Arnold ,  Dennis R. Pyper

    Inventor： Shawn X. Arnold ,  Dennis R. Pyper

    IPC: H05K3/46 ,  H05K1/09 ,  H05K1/11

    CPC classification number: H05K3/462 ,  H05K3/4623 ,  H05K2201/10234 ,  Y10T156/10 ,  Y10T156/1002

    Abstract: The described embodiment relates generally to the field of PCB fabrication. More specifically conductive spheres are used in a bonding sheet to enable inter-layer communication in a multi-layer printed circuit board (PCB). The conductive spheres in the bonding sheet can be used in place of or in conjunction with conventional electroplated vias. This allows the following advantages in multi-layer PCB fabrication: dielectric substrate layers made of varying types of material; PCBs with higher resilience to stress and shock; and PCBs that are more flexible.

    Abstract translation: 所描述的实施例一般涉及PCB制造领域。 在粘合片中使用更具体的导电性球体以实现多层印刷电路板（PCB）中的层间连通。 粘合片中的导电球可用于代替常规电镀通孔或与常规电镀通孔结合使用。 这允许在多层PCB制造中具有以下优点：由不同类型的材料制成的电介质基底层; 对应力和冲击具有较高弹性的PCB; 和PCB更灵活。

    Antenna structures and shield layers on packaged wireless circuits
    9.
    发明授权
    Antenna structures and shield layers on packaged wireless circuits 有权
    封装无线电路上的天线结构和屏蔽层

    公开(公告)号：US09196958B2

    公开(公告)日：2015-11-24

    申请号：US13559509

    申请日：2012-07-26

    Applicant: Shawn Xavier Arnold ,  Dennis R. Pyper ,  Jeffrey M. Thoma ,  Scott P. Mullins

    Inventor： Shawn Xavier Arnold ,  Dennis R. Pyper ,  Jeffrey M. Thoma ,  Scott P. Mullins

    IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q1/24

    CPC classification number: H01Q1/526 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/243 ,  H01L2924/00014

    Abstract: An electronic device may be provided with antenna structures. Circuitry such as radio-frequency transceiver circuitry and impedance matching and filter circuitry may be implemented using one or more circuit components and embedded within an insulator to form packaged circuitry. The insulator may be formed from multiple layers of printed circuit board material or from plastic molded onto a printed circuit board substrate over the circuitry. A metal shield layer may be interposed between the packaged circuitry and the antenna structures. The metal shield layer may be mounted on the surface of the packaged circuitry using a layer of adhesive. A layer of polymer may be interposed between the layer of adhesive and the metal shielding layer. The metal shield layer may have an opening through which conductive paths may pass to couple the packaged circuitry to antenna terminals on the antenna structures.

    Abstract translation: 电子设备可以设置有天线结构。 诸如射频收发器电路和阻抗匹配和滤波器电路之类的电路可以使用一个或多个电路部件实现，并且嵌入在绝缘体内以形成封装的电路。 绝缘体可以由多层印刷电路板材料形成，或者由塑料模制在电路上的印刷电路板基板上。 金属屏蔽层可以插入在封装电路和天线结构之间。 金属屏蔽层可以使用一层粘合剂安装在封装电路的表面上。 聚合物层可以插入在粘合剂层和金属屏蔽层之间。 金属屏蔽层可以具有导电路径可以通过的开口，以将封装电路耦合到天线结构上的天线端子。

    Antenna Structures and Shield Layers on Packaged Wireless Circuits
    10.
    发明申请
    Antenna Structures and Shield Layers on Packaged Wireless Circuits 有权
    封装无线电路上的天线结构和屏蔽层

    公开(公告)号：US20140028518A1

    公开(公告)日：2014-01-30

    申请号：US13559509

    申请日：2012-07-26

    Applicant: Shawn Xavier Arnold ,  Dennis R. Pyper ,  Jeffrey M. Thoma ,  Scott P. Mullins

    Inventor： Shawn Xavier Arnold ,  Dennis R. Pyper ,  Jeffrey M. Thoma ,  Scott P. Mullins

    IPC: H01Q1/52

    CPC classification number: H01Q1/526 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/243 ,  H01L2924/00014

    Abstract: An electronic device may be provided with antenna structures. Circuitry such as radio-frequency transceiver circuitry and impedance matching and filter circuitry may be implemented using one or more circuit components and embedded within an insulator to form packaged circuitry. The insulator may be formed from multiple layers of printed circuit board material or from plastic molded onto a printed circuit board substrate over the circuitry. A metal shield layer may be interposed between the packaged circuitry and the antenna structures. The metal shield layer may be mounted on the surface of the packaged circuitry using a layer of adhesive. A layer of polymer may be interposed between the layer of adhesive and the metal shielding layer. The metal shield layer may have an opening through which conductive paths may pass to couple the packaged circuitry to antenna terminals on the antenna structures.

    Abstract translation: 电子设备可以设置有天线结构。 诸如射频收发器电路和阻抗匹配和滤波器电路之类的电路可以使用一个或多个电路部件实现，并且嵌入在绝缘体内以形成封装的电路。 绝缘体可以由多层印刷电路板材料形成，或者由塑料模制在电路上的印刷电路板基板上。 金属屏蔽层可以插入在封装电路和天线结构之间。 金属屏蔽层可以使用一层粘合剂安装在封装电路的表面上。 聚合物层可以插入在粘合剂层和金属屏蔽层之间。 金属屏蔽层可以具有导电路径可以通过的开口，以将封装电路耦合到天线结构上的天线端子。

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