公开(公告)号：US10115702B2

公开(公告)日：2018-10-30

申请号：US14823322

申请日：2015-08-11

申请人： Ki Hun Yu ,  Tae Young Oh ,  Nam Jong Kim ,  Kwang Il Park ,  Chul Sung Park

发明人： Ki Hun Yu ,  Tae Young Oh ,  Nam Jong Kim ,  Kwang Il Park ,  Chul Sung Park

IPC分类号： G01K7/00 ,  G01K3/00 ,  H01L25/065 ,  H01L23/34

摘要： In one example embodiment, a semiconductor system includes a first chip configured to generate first temperature information of the first chip, the first temperature information being based on at least one temperature measurement using at least one first temperature sensor. The semiconductor system further includes a second chip including a second temperature sensor configured to be controlled based on at least the first temperature information.

公开(公告)号：US20160148905A1

公开(公告)日：2016-05-26

申请号：US14823322

申请日：2015-08-11

申请人： Ki Hun YU ,  Tae Young OH ,  Nam Jong KIM ,  Kwang II PARK ,  Chul Sung PARK

发明人： Ki Hun YU ,  Tae Young OH ,  Nam Jong KIM ,  Kwang II PARK ,  Chul Sung PARK

IPC分类号： H01L25/065 ,  G01N25/72 ,  H01L27/108

CPC分类号： H01L25/0657 ,  H01L23/34 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： In one example embodiment, a semiconductor system includes a first chip configured to generate first temperature information of the first chip, the first temperature information being based on at least one temperature measurement using at least one first temperature sensor. The semiconductor system further includes a second chip including a second temperature sensor configured to be controlled based on at least the first temperature information.

摘要翻译： 在一个示例实施例中，半导体系统包括被配置为产生第一芯片的第一温度信息的第一芯片，第一温度信息基于使用至少一个第一温度传感器的至少一个温度测量。 半导体系统还包括第二芯片，其包括被配置为基于至少第一温度信息来控制的第二温度传感器。