METHODS FOR FABRICATING CAPACITOR AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR
    2.
    发明申请
    METHODS FOR FABRICATING CAPACITOR AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR 审中-公开
    制造电容器的方法和制造包括电容器的半导体器件的方法

    公开(公告)号:US20120100687A1

    公开(公告)日:2012-04-26

    申请号:US13274695

    申请日:2011-10-17

    CPC classification number: H01L28/90 H01L27/10814 H01L27/10855

    Abstract: Example embodiments relate to methods for fabricating a capacitor and methods for fabricating a semiconductor device including the capacitor. The methods for fabricating a capacitor may include forming a preliminary lower electrode with a first area on a substrate; implanting ions in the preliminary lower electrode to form a lower electrode with a second area that is larger or substantially larger than the first area; and forming a dielectric layer and an upper electrode on the lower electrode.

    Abstract translation: 示例性实施例涉及用于制造电容器的方法和用于制造包括该电容器的半导体器件的方法。 制造电容器的方法可以包括在基板上形成具有第一区域的预备下电极; 在所述预备下电极中注入离子以形成具有比所述第一区域更大或显着大的第二区域的下电极; 并在下电极上形成电介质层和上电极。

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