SEMICONDUCTOR DEVICES INCLUDING APPLICATION PROCESSOR CONNECTED TO HIGH-BANDWIDTH MEMORY AND LOW-BANDWIDTH MEMORY, AND CHANNEL INTERLEAVING METHOD THEREOF
    2.
    发明申请
    SEMICONDUCTOR DEVICES INCLUDING APPLICATION PROCESSOR CONNECTED TO HIGH-BANDWIDTH MEMORY AND LOW-BANDWIDTH MEMORY, AND CHANNEL INTERLEAVING METHOD THEREOF 有权
    包括连接到高带宽存储器和低带宽存储器的应用处理器的半导体器件及其通道交换方法

    公开(公告)号:US20150081989A1

    公开(公告)日:2015-03-19

    申请号:US14307994

    申请日:2014-06-18

    IPC分类号: G06F12/06

    CPC分类号: G06F12/0607 Y02D10/13

    摘要: A memory system includes a high-bandwidth memory device, the high-bandwidth memory device having a relatively high operation bandwidth, the high-bandwidth memory device having a plurality of access channels. A low-bandwidth memory device has a relatively low operation bandwidth relative to the high-bandwidth memory device, the low-bandwidth memory device having one or more access channels. An interleaving unit performs a memory interleave operation among the plurality of access channels of the high-bandwidth memory device and an access channel of the one or more access channels of the low-bandwidth memory device.

    摘要翻译: 存储器系统包括高带宽存储器件,具有相对高的操作带宽的高带宽存储器件,高带宽存储器件具有多个存取通道。 低带宽存储器件相对于高带宽存储器件具有相对低的操作带宽,低带宽存储器件具有一个或多个存取通道。 交织单元在高带宽存储装置的多个接入信道和低带宽存储装置的一个以上的接入信道的接入信道之间进行存储器交织操作。