POWER MODULE WITH DETECTION OF AGING
    2.
    发明公开

    公开(公告)号:US20240160233A1

    公开(公告)日:2024-05-16

    申请号:US18548435

    申请日:2022-03-02

    申请人: Robert Bosch GmbH

    IPC分类号: G05D23/24 H05K7/20

    CPC分类号: G05D23/24 H05K7/20945

    摘要: A power module. The power module has a substrate and at least one power transistor situated on a lower side of the substrate, and at least one temperature sensor situated in the power module. At least one primary temperature sensor is situated on an upper side opposite the at least one power transistor or in an inner substrate layer situated above the at least one power transistor. At least one reference temperature sensor for providing a comparison temperature is situated at a distance from all power transistors, on the upper side or on one of the inner substrate layers. As a result, the transistor temperature can be measured closer to the source of the heat and a reference temperature is provided for detecting resistance changes due to material aging.

    TEMPERATURE-CONTROLLED MODULE FOR ELECTRONIC DEVICES AND TESTING APPARATUS PROVIDED WITH THE SAME

    公开(公告)号:US20180024162A1

    公开(公告)日:2018-01-25

    申请号:US15628069

    申请日:2017-06-20

    申请人: CHROMA ATE INC.

    IPC分类号: G01R1/04 G05D23/19 G01R31/28

    摘要: A temperature-controlled module for electronic devices and a testing apparatus provided with the same mainly include a temperature-controlled tray, an upper board and a dry-air supply device. The temperature-controlled tray includes holding cavities for accommodating electronic devices and a fluid chamber for cooling fluid. The upper board is furnished with through holes, while the upper board and the temperature-controlled tray are spaced by a predetermined distance. The dry-air supply device provides dry air to a space between the temperature-controlled tray and the upper board. Thereupon, by having cooling fluid to flow inside the temperature-controlled tray, the temperature-controlled tray can be kept in a lower predetermined temperature so as to rapidly cool down the electronic device. In addition, by providing the upper board and the dry-air supply device to allow dry air to flow through the surface of the electronic device, then the water-condensation phenomenon and air leakage can avoided.