Abstract:
Seed holes (h) are formed by discharging a pressure medium (G) in a resin body (R) injected in a cavity (4) of a die (MS1). By expanding the cavity (4), supplying the pressure medium (G) to the seed holes (h), a size of the resin body (R) is increased, making the seed holes grow, to have a molded resin plate (Vr1) made of the resin body increased in the size and formed with the seed holes grown to internal voids (Vd).
Abstract:
An acrylic resin composition comprises an organic silicon based compound that can be copolymerised with or mixed with acryl monomer or methacryl monomer in the acrylic resin. The acrylic resin composition may contain inorganic fine grains of which the hydroxyl group or the methyl group is bonded to their surface. A painted-film molded resin plate and a coating member for a solar cell panel use the above acrylic resin composition.
Abstract:
A resin composition to be used as a material for a various part of an automotive vehicle. The resin composition comprises a copolymer (A) formed by copolymerization of a first unsaturated monomer (a) and a second mononer (b). The first unsaturated monomer has a functional group which is bondable by hydrogen bond to a hydroxyl group. The second monomer is copolymerizable with the first unsaturated monomer. A metal oxide (B) is dispersed in the copolymer and having hydroxyl groups and hydrophobic groups at surface of the metal oxide.
Abstract:
A plastic window panel for an automotive vehicle comprises a plastic panel of a transparent noncrystalline organic high polymer. Silica particulate is dispersed in the plastic panel and has a particle size not larger than wavelengths of visible light. The plastic window panel is produced by one of a first method and a second method. The first method comprises (a) providing a first solvent in which the silica particulate having the particle size not larger than wavelengths of visible light is dispersed, and a second solvent in which the transparent noncrystalline organic high polymer is dissolved; (b) mixing the first solvent and the second solvent to obtain a resin composition; and (c) molding the resin composition under heating. The second method comprises (a) providing the silica particulate having the particle size not larger than wavelengths of visible light; (b) mixing the silica particulate into the organic high polymer which is in a process of formation of the organic high polymer, to obtain a resin composition; and (c) molding the resin composition under heating.