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    Method for producing propylene oxide
    1.
    发明授权
    Method for producing propylene oxide 有权
    生产环氧丙烷的方法

    公开(公告)号：US07973184B2

    公开(公告)日：2011-07-05

    申请号：US12720185

    申请日：2010-03-09

    Applicant: Masatake Haruta ,  Jiahui Huang ,  Takashi Takei ,  Tomoki Akita

    Inventor： Masatake Haruta ,  Jiahui Huang ,  Takashi Takei ,  Tomoki Akita

    IPC: C07D301/03 ,  C07D301/06

    CPC classification number: C07D301/10 ,  B01J23/52 ,  B01J29/89 ,  Y02P20/52 ,  Y02P20/582

    Abstract: Disclosed is a method for producing propylene oxide wherein propylene is directly oxidized with oxygen, as required, water and a catalytic amount of hydrogen in a gas phase in the presence of a gold cluster catalyst supported on an alkali-treated titanosilicalite or mesoporous titanosilicate support, which is produced by an alkaline treatment of titanosilicalite or mesoporous titanosilicate with aqueous solution of NaOH, KOH or CsOH.

    Abstract translation: 公开了一种生产环氧丙烷的方法，其中丙烯在负载在碱处理的钛硅硅酸盐或中孔硅酸钠载体上的金簇催化剂存在下，根据需要在气相中根据需要直接氧化水和催化量的氢气， 其通过用NaOH，KOH或CsOH的水溶液碱处理钛硅酸盐或中孔钛硅酸盐而产生。

    METHOD FOR PRODUCING PROPYLENE OXIDE
    2.
    发明申请
    METHOD FOR PRODUCING PROPYLENE OXIDE 有权
    生产丙烯氧化物的方法

    公开(公告)号：US20100234623A1

    公开(公告)日：2010-09-16

    申请号：US12720185

    申请日：2010-03-09

    Applicant: Masatake Haruta ,  Jiahui Huang ,  Takashi Takei ,  Tomoki Akita

    Inventor： Masatake Haruta ,  Jiahui Huang ,  Takashi Takei ,  Tomoki Akita

    IPC: C07D301/06 ,  C07D301/04

    CPC classification number: C07D301/10 ,  B01J23/52 ,  B01J29/89 ,  Y02P20/52 ,  Y02P20/582

    Abstract: Disclosed is a method for producing propylene oxide wherein propylene is directly oxidized with oxygen, as required, water and a catalytic amount of hydrogen in a gas phase in the presence of a gold cluster catalyst supported on an alkali-treated titanosilicalite or mesoporous titanosilicate support, which is produced by an alkaline treatment of titanosilicalite or mesoporous titanosilicate with aqueous solution of NaOH, KOH or CsOH.

    Abstract translation: 公开了一种生产环氧丙烷的方法，其中丙烯在负载在碱处理的钛硅硅酸盐或中孔硅酸钠载体上的金簇催化剂存在下，根据需要在气相中根据需要直接氧化水和催化量的氢气， 其通过用NaOH，KOH或CsOH的水溶液碱处理钛硅酸盐或中孔钛硅酸盐而产生。

    Controlled release granules comprising porous silica core
    3.
    发明申请
    Controlled release granules comprising porous silica core 审中-公开
    包含多孔二氧化硅核心的控制释放颗粒

    公开(公告)号：US20060073205A1

    公开(公告)日：2006-04-06

    申请号：US10958048

    申请日：2004-10-04

    Applicant: Kotoe Ohta ,  Masayoshi Fuji ,  Takashi Takei ,  Masatoshi Chikazawa ,  Kenzo Toyoshima

    Inventor： Kotoe Ohta ,  Masayoshi Fuji ,  Takashi Takei ,  Masatoshi Chikazawa ,  Kenzo Toyoshima

    IPC: A61K9/24

    CPC classification number: A61K9/143 ,  A61K9/5047

    Abstract: The present invention relates to controlled release granules for medical use comprising a drug loaded porous silica particle, and at least one layer of a controlled release coating material, characterized in that the drug loaded porous silica core is prepared by immersing dry porous silica particles with a solution, suspension or emulsion comprising at least one pharmacologically active drug and the resulting wet drug loaded porous silica core is subsequently dried again. Furthermore, the invention concerns a method for preparing the controlled release composition.

    Abstract translation: 本发明涉及用于医疗用途的控制释放颗粒，其包含负载药物的多孔二氧化硅颗粒，以及至​​少一层控释包衣材料，其特征在于，通过将干燥的多孔二氧化硅颗粒浸入 包含至少一种药理学活性药物的溶液，悬浮液或乳液，然后再次干燥所得的湿药物加载的多孔二氧化硅核心。 此外，本发明涉及一种制备控释组合物的方法。

    Dispensing device and mounting system
    4.
    发明授权
    Dispensing device and mounting system 失效
    点胶装置和安装系统

    公开(公告)号：US07753253B2

    公开(公告)日：2010-07-13

    申请号：US11594766

    申请日：2006-11-09

    Applicant: Katsumi Terada ,  Takashi Takei

    Inventor： Katsumi Terada ,  Takashi Takei

    IPC: B29C31/00 ,  H01L23/29 ,  B23K1/012

    CPC classification number: H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01082

    Abstract: A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

    Abstract translation: 用于将底部填充剂填充到基板（K）和芯片（C）之间的间隙中的分配装置（4）包括用于存储底部填充剂（66,67）的装置，用于容纳基板（K）的室（52） 装有底部填充剂并且能够打开/关闭;设置在室（52）中的分配器（73），并将从存储装置（66,67）引入的底部填充剂排放到基板（K）和 以及用于在由分配器（73）排出底部填充剂之前以预定的真空压力减小腔室（52）中的压力的​​第一减压装置（46）。 分配装置（4）可以向衬底（K）提供没有气泡的底部填充剂。 本发明还提供使用该分配装置（4）的安装系统。

    Dispensing device and mounting system
    5.
    发明申请
    Dispensing device and mounting system 失效
    点胶装置和安装系统

    公开(公告)号：US20070111400A1

    公开(公告)日：2007-05-17

    申请号：US11594766

    申请日：2006-11-09

    Applicant: Katsumi Terada ,  Takashi Takei

    Inventor： Katsumi Terada ,  Takashi Takei

    IPC: H01L21/00

    CPC classification number: H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/75 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01082

    Abstract: A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.

    Abstract translation: 用于将底部填充剂填充到基板（K）和芯片（C）之间的间隙中的分配装置（4）包括用于存储底部填充剂（66,67）的装置，用于容纳基板（K）的室（52） 装有底部填充剂并且能够打开/关闭;设置在室（52）中的分配器（73），并将从存储装置（66,67）引入的底部填充剂排放到基板（K）和 以及用于在由分配器（73）排出底部填充剂之前以预定的真空压力减小腔室（52）中的压力的​​第一减压装置（46）。 分配装置（4）可以向衬底（K）提供没有气泡的底部填充剂。 本发明还提供使用该分配装置（4）的安装系统。

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