公开(公告)号：US07515238B2

公开(公告)日：2009-04-07

申请号：US11516341

申请日：2006-09-06

Applicant: Kuan-Hsin Chen ,  Keng-Ming Lai ,  Chih-Hung Hsiao ,  Min-Cheng Wang

Inventor： Kuan-Hsin Chen ,  Keng-Ming Lai ,  Chih-Hung Hsiao ,  Min-Cheng Wang

IPC: G02F1/1345

CPC classification number: H05K3/323 ,  G02F1/13452 ,  H05K1/142 ,  H05K3/361 ,  H05K2201/10674

Abstract: An exemplary liquid crystal panel (100) includes a first substrate (110), a second substrate (120) opposite to the first substrate, a liquid crystal layer (130) sandwiched between the first and second substrates, a plurality of drive integrated circuits (ICs) (114), and a plurality of anisotropic conductive film (ACF) units (115). The first substrate includes a source bonding region (117) and a gate bonding region (118) at the periphery thereof. Each of the source bonding region and the gate bonding region includes a plurality of connecting regions and a plurality of spacing regions each between two connecting regions. The ACF units are disposed on the connecting regions of the source bonding region and the gate bonding region, and are configured for bonding the drive ICs onto the first substrate.

Abstract translation: 示例性液晶面板（100）包括第一基板（110），与第一基板相对的第二基板（120），夹在第一和第二基板之间的液晶层（130），多个驱动集成电路 IC）（114）和多个各向异性导电膜（ACF）单元（115）。 第一基板在其周边包括源极接合区域（117）和栅极接合区域（118）。 源极接合区域和栅极接合区域中的每一个包括在两个连接区域之间的多个连接区域和多个间隔区域。 ACF单元设置在源极接合区域和栅极接合区域的连接区域上，并被配置为将驱动IC接合到第一基板上。

公开(公告)号：US11712682B2

公开(公告)日：2023-08-01

申请号：US17402284

申请日：2021-08-13

Applicant: Kuan-Hsin Chen ,  Chien-Fa Huang ,  Kuan-Yu Chen ,  Kuan-Ta Chen

Inventor： Huang-Chuan Chen ,  Kuan-Hsin Chen ,  Yi-Yu Wang ,  Chien-Fa Huang ,  Kuan-Yu Chen ,  Kuan-Ta Chen

IPC: B01J29/06 ,  B01J21/06 ,  B01J21/04 ,  B01J23/04 ,  B01J23/745 ,  B01J29/072 ,  B01J35/00 ,  C10B57/06 ,  C10B3/02 ,  C10B27/06 ,  C10B7/00 ,  C10B53/00 ,  C10G1/04 ,  C10G1/10 ,  B01J21/16

CPC classification number: B01J29/06 ,  B01J21/04 ,  B01J21/063 ,  B01J21/16 ,  B01J23/04 ,  B01J23/745 ,  B01J29/072 ,  B01J35/0006 ,  C10B3/02 ,  C10B7/00 ,  C10B27/06 ,  C10B53/00 ,  C10B57/06 ,  C10G1/04 ,  C10G1/10 ,  C10G2300/1003 ,  C10G2300/301 ,  C10G2300/308 ,  C10G2300/70

Abstract: A catalyst is illustrated, which has 70-90 parts by weight of mica, 1-10 parts by weight of zeolite, 5-15 parts by weight of titanium dioxide, 1-10 parts by weight of aluminum oxide, 1-5 parts by weight of sodium oxide and 1-5 parts by weight of potassium oxide. The present disclosure also illustrates a pyrolysis device using the catalyst, and further illustrates a pyrolysis method using the catalyst and/or the pyrolysis device for thermally cracking an organic polymer.

公开(公告)号：US20210066132A1

公开(公告)日：2021-03-04

申请号：US17098786

申请日：2020-11-16

Applicant: Tsung-Yu CHIANG ,  Kuan-Hsin CHEN ,  Hsin-Lung CHAO ,  Chen CHU-HSUAN

Inventor： Tsung-Yu CHIANG ,  Kuan-Hsin CHEN ,  Hsin-Lung CHAO ,  Chen CHU-HSUAN

IPC: H01L21/8234 ,  H01L29/78 ,  H01L29/10 ,  H01L21/308 ,  H01L29/66 ,  H01L27/088 ,  H01L23/544 ,  H01L21/762

Abstract: Among other things, one or semiconductor arrangements, and techniques for forming such semiconductor arrangements are provided. An etch sequence is performed to form a first etched region over a planar region of a semiconductor arrangement. The first etched region exposes a planar structure, such as an alignment mark used for alignment during semiconductor fabrication. The etch sequence forms a second etched region over a semiconductor fin region of the semiconductor arrangement. In an embodiment, the etch sequence forms a first trench, a first fin nub and a first pillar in the semiconductor fin region, where the first trench is formed in a semiconductor substrate of the semiconductor fin region. A multi-depth STI structure is formed over at least one of the first trench, the first fin nub, or the first pillar.

公开(公告)号：US20110246282A1

公开(公告)日：2011-10-06

申请号：US13006533

申请日：2011-01-14

Applicant: Kuan-Hsin Chen

Inventor： Kuan-Hsin Chen

IPC: G06Q30/00

CPC classification number: G06Q30/0234 ,  G06Q30/02

Abstract: A business transaction method enables customers to purchase products from vendors, and is implemented using a business transaction system that includes a membership module, an allocation module, and a rebate module. The business transaction method includes: a) configuring the membership module to enable the vendors to become alliance members and the customers to become club members, and to set a recruiter of each club member to be a first-degree upper-tier member of said each club member; b) when one of the club members makes a purchase of a transaction amount from one of the alliance members, configuring the allocation module to allocate a predetermined percentage of the transaction amount as a rebate; and c) configuring the rebate module to distribute a portion of the rebate to the club member who made the purchase and another portion of the rebate to the first-degree upper-tier member thereof.

Abstract translation: 商业交易方法使得客户能够从供应商处购买产品，并且使用包括会员模块，分配模块和回扣模块的商业交易系统来实现。 业务交易方法包括：a）配置会员模块，使供应商成为联盟成员和客户成为俱乐部成员，并设置每个俱乐部成员的招聘者为所述每个俱乐部成员的一级上层成员 俱乐部会员 b）当其中一个俱乐部成员从其中一个联盟成员购买交易金额时，配置分配模块以分配交易金额的预定百分比作为回扣; 以及c）配置所述回扣模块以将所述回扣的一部分分配给进行所述购买的俱乐部成员，并且将所述回扣的另一部分分配给所述第一级上层成员。

公开(公告)号：US20070052905A1

公开(公告)日：2007-03-08

申请号：US11516341

申请日：2006-09-06

Applicant: Kuan-Hsin Chen ,  Keng-Ming Lai ,  Chih-Hung Hsiao ,  Min-Cheng Wang

Inventor： Kuan-Hsin Chen ,  Keng-Ming Lai ,  Chih-Hung Hsiao ,  Min-Cheng Wang

IPC: G02F1/1345

CPC classification number: H05K3/323 ,  G02F1/13452 ,  H05K1/142 ,  H05K3/361 ,  H05K2201/10674

Abstract: An exemplary liquid crystal panel (100) includes a first substrate (110), a second substrate (120) opposite to the first substrate, a liquid crystal layer (130) sandwiched between the first and second substrates, a plurality of drive integrated circuits (ICs) (114), and a plurality of anisotropic conductive film (ACF) units (115). The first substrate includes a source bonding region (117) and a gate bonding region (118) at the periphery thereof. Each of the source bonding region and the gate bonding region includes a plurality of connecting regions and a plurality of spacing regions each between two connecting regions. The ACF units are disposed on the connecting regions of the source bonding region and the gate bonding region, and are configured for bonding the drive ICs onto the first substrate.

Abstract translation: 示例性液晶面板（100）包括第一基板（110），与第一基板相对的第二基板（120），夹在第一和第二基板之间的液晶层（130），多个驱动集成电路 IC）（114）和多个各向异性导电膜（ACF）单元（115）。 第一基板在其周边包括源极接合区域（117）和栅极接合区域（118）。 源极接合区域和栅极接合区域中的每一个包括在两个连接区域之间的多个连接区域和多个间隔区域。 ACF单元设置在源极接合区域和栅极接合区域的连接区域上，并被配置为将驱动IC接合到第一基板上。