Surface form measuring apparatus and stress measuring apparatus and surface form measuring method and stress measuring method
    1.
    发明申请
    Surface form measuring apparatus and stress measuring apparatus and surface form measuring method and stress measuring method 有权
    表面形状测量装置及应力测量装置及表面形状测量方法及应力测量方法

    公开(公告)号:US20080111987A1

    公开(公告)日:2008-05-15

    申请号:US11979116

    申请日:2007-10-31

    IPC分类号: G01B11/16 G01B11/25

    CPC分类号: G01B11/0625 G01L5/0047

    摘要: In a stress measuring apparatus, reflected light of light emitted to a substrate through an objective lens is received by a light shielding pattern imaging part, to acquire an image of a light shielding pattern positioned at an aperture stop part of an optical system. A control part obtains gradient vectors of the substrate in a plurality of gradient vector measurement areas and surface form of the substrate on the basis of outputs of the light shielding pattern imaging part, to obtain a stress in a film formed on the substrate. Since light directed through the objective lens becomes approximately parallel rays of light on the substrate, measurement can be performed without focusing on each gradient vector measurement area and the surface form of the substrate can be obtained easily and rapidly. Consequently, it is possible to obtain a stress in the film formed on the substrate easily and rapidly.

    摘要翻译: 在应力测量装置中,通过遮光图案成像部分接收通过物镜发射到基板的光的反射光,以获取位于光学系统的孔径光阑部分的遮光图案的图像。 控制部分基于遮光图案成像部的输出,在多个梯度矢量测量区域和基板的表面形式中获得衬底的梯度向量,以获得在衬底上形成的膜中的应力。 由于通过物镜引导的光在基板上变成大致平行的光线,因此可以在不关注各梯度矢量测量区域的情况下进行测量,并且可以容易且快速地获得基板的表面形状。 因此,可以容易且快速地获得在基板上形成的膜的应力。

    Apparatus for measuring film thickness formed on object, apparatus and method of measuring spectral reflectance of object, and apparatus and method of inspecting foreign material on object
    2.
    发明授权
    Apparatus for measuring film thickness formed on object, apparatus and method of measuring spectral reflectance of object, and apparatus and method of inspecting foreign material on object 失效
    用于测量物体上形成的膜厚的装置,测量物体的光谱反射率的装置和方法,以及检测物体上的异物的装置和方法

    公开(公告)号:US06937333B2

    公开(公告)日:2005-08-30

    申请号:US10652071

    申请日:2003-09-02

    摘要: A film thickness measurement apparatus (1) comprises an ellipsometer (3) for acquiring a polarization state of a film on a substrate (9) and a light interference unit (4) for acquiring spectral intensity of the film on the substrate (9). In an optical system (45) of the light interference unit (4), a light shielding pattern (453a) is disposed in an aperture stop part (453), and an illumination light from a light source (41) is emitted to the substrate (9) through the optical system (45). A reflected light from the substrate (9) is guided to a light shielding pattern imaging part (43), where an image of the light shielding pattern (453a) is acquired. When the ellipsometer (3) performs a film thickness measurement, a tilt angle of the substrate (9) is obtained on the basis of the image of the light shielding pattern (453a) and a light receiving unit (32) acquires a polarization state of the reflected light. An calculation part (51) obtains a thickness of a film with high precision from the polarization state of the reflected light by using the obtained tilt angle.

    摘要翻译: 膜厚测量装置(1)包括用于获取基板(9)上的胶片的偏振态的椭圆偏振仪(3)和用于获取基板(9)上的胶片的光谱强度的光干涉单元(4)。 在光干涉单元(4)的光学系统(45)中,在孔径光阑部(453)中设置有遮光图案(453a),将来自光源(41)的照明光发射到 基板(9)通过光学系统(45)。 来自基板(9)的反射光被引导到获取了遮光图案(453a)的图像的遮光图案成像部(43)。 当椭圆光度计(3)进行膜厚测量时,基于遮光图案(453a)的图像获得基板(9)的倾斜角,并且光接收单元(32)获取偏振状态 的反射光。 计算部件(51)通过使用所获得的倾斜角度从反射光的偏振状态获得高精度的胶片的厚度。

    Film forming apparatus and film forming method
    3.
    发明申请
    Film forming apparatus and film forming method 审中-公开
    成膜装置及成膜方法

    公开(公告)号:US20050006560A1

    公开(公告)日:2005-01-13

    申请号:US10884973

    申请日:2004-07-07

    CPC分类号: G01B11/0641

    摘要: A film forming apparatus (1) comprises a stage (2) for supporting a substrate (9), a light emitting part (3) for guiding polarized light used for forming an oxide film on the substrate (9) by light energy to a predetermined irradiation region on the substrate (9), a light receiving part (4) for receiving the polarized light reflected on the irradiation region and a calculation part (61) for obtaining a thickness of the film in the irradiation region on the basis of an output from the light receiving part (4). In the film forming apparatus (1), the light emitting part (3) and the light receiving part (4) constitute part of an ellipsometer, and the light emitting part (3) emits a light beam to form a film in the irradiation region on the substrate (9) while the light receiving part (4) acquires the polarization state of the reflected light from the substrate (9) and the calculation part (61) analyzes it to measure the thickness of the film. It is thereby possible to improve the accuracy of film thickness.

    摘要翻译: 一种成膜设备(1)包括用于支撑基板(9)的台(2),用于将用于在基板(9)上形成氧化膜的偏振光用光引导到预定的光源的发光部分(3) 基板(9)上的照射区域,用于接收在照射区域上反射的偏振光的光接收部分(4)和用于基于输出获得照射区域中的膜的厚度的计算部分(61) 从光接收部分(4)。 在成膜装置(1)中,发光部(3)和受光部(4)构成椭圆计的一部分,发光部(3)在照射区域发射光束而形成膜 在光接收部分(4)获得来自基板(9)的反射光的偏振态的同时,在基板(9)上,并且计算部分(61)对其进行分析以测量膜的厚度。 从而可以提高膜厚度的精度。

    Surface form measuring apparatus and stress measuring apparatus and surface form measuring method and stress measuring method
    4.
    发明授权
    Surface form measuring apparatus and stress measuring apparatus and surface form measuring method and stress measuring method 有权
    表面形状测量装置及应力测量装置及表面形状测量方法及应力测量方法

    公开(公告)号:US07612873B2

    公开(公告)日:2009-11-03

    申请号:US11979116

    申请日:2007-10-31

    IPC分类号: G01B11/16

    CPC分类号: G01B11/0625 G01L5/0047

    摘要: In a stress measuring apparatus, reflected light of light emitted to a substrate through an objective lens is received by a light shielding pattern imaging part, to acquire an image of a light shielding pattern positioned at an aperture stop part of an optical system. A control part obtains gradient vectors of the substrate in a plurality of gradient vector measurement areas and surface form of the substrate on the basis of outputs of the light shielding pattern imaging part, to obtain a stress in a film formed on the substrate. Since light directed through the objective lens becomes approximately parallel rays of light on the substrate, measurement can be performed without focusing on each gradient vector measurement area and the surface form of the substrate can be obtained easily and rapidly. Consequently, it is possible to obtain a stress in the film formed on the substrate easily and rapidly.

    摘要翻译: 在应力测量装置中,通过遮光图案成像部分接收通过物镜发射到基板的光的反射光,以获取位于光学系统的孔径光阑部分的遮光图案的图像。 控制部分基于遮光图案成像部的输出,在多个梯度矢量测量区域和基板的表面形式中获得衬底的梯度向量,以获得在衬底上形成的膜中的应力。 由于通过物镜引导的光在基板上变成大致平行的光线,因此可以在不关注各梯度矢量测量区域的情况下进行测量,并且可以容易且快速地获得基板的表面形状。 因此,可以容易且快速地获得在基板上形成的膜的应力。