公开(公告)号：US20100210189A1

公开(公告)日：2010-08-19

申请号：US12370662

申请日：2009-02-13

申请人： Kun-Ku Hung ,  Zin-Chang Wei ,  Huang Soon Kang ,  Chyi-Shyuan Chern

发明人： Kun-Ku Hung ,  Zin-Chang Wei ,  Huang Soon Kang ,  Chyi-Shyuan Chern

IPC分类号： B24B57/02 ,  B24B7/20 ,  B24B29/00

CPC分类号： B24B57/02 ,  B24B37/04

摘要： A chemical mechanical polishing method and apparatus provides a deformable, telescoping slurry dispenser arm coupled to a dispenser head that may be arcuate in shape and may also be a bendable telescoping member that can be adjusted to vary the number of slurry dispenser ports and the degree of curvature of the dispenser head. The dispenser arm may additionally include slurry dispenser ports therein. The dispenser arm may advantageously be formed of a plurality of nested tubes that are slidable with respect to one another. The adjustable dispenser arm may pivot about a pivot point and can be variously positioned to accommodate different sized polishing pads used to polish substrates of different dimensions and the bendable, telescoping slurry dispenser arm and dispenser head provide uniform slurry distribution to any of various wafer polishing locations, effective slurry usage and uniform polishing profiles in each case.

摘要翻译： 化学机械抛光方法和装置提供了可变形的，可伸缩的浆料分配器臂，其联接到分配器头部，其可以是弓形的形状，并且还可以是可弯曲的伸缩构件，其可以被调节以改变浆料分配器端口的数量和 分配头的曲率。 分配器臂可以另外包括其中的浆料分配器端口。 分配器臂可以有利地由可相对于彼此滑动的多个嵌套管形成。 可调节的分配器臂可围绕枢转点枢转并且可以被不同地定位以适应用于抛光不同尺寸的基板的不同尺寸的抛光垫，并且可弯曲的可伸缩浆料分配器臂和分配器头部向各种晶片抛光位置 ，有效的浆料使用和均匀的抛光轮廓在每种情况下。

公开(公告)号：US20100291840A1

公开(公告)日：2010-11-18

申请号：US12464223

申请日：2009-05-12

申请人： Soon Kang HUANG ,  Kun-Ku HUNG ,  Zin-Chang WEI ,  Chyi Shyuan CHERN

发明人： Soon Kang HUANG ,  Kun-Ku HUNG ,  Zin-Chang WEI ,  Chyi Shyuan CHERN

IPC分类号： B24B1/00 ,  B24B7/07

CPC分类号： B24B53/003 ,  B24B53/017

摘要： A chemical mechanical polishing (CMP) apparatus provides for polishing semiconductor wafers and for conditioning the polishing pad of the CMP apparatus using multiple conditioning disks at the same time. The conditioning disks may be moved together or independently along the surface of polishing pad to condition the entire surface of the rotating polishing pad.

摘要翻译： 化学机械抛光（CMP）装置提供用于抛光半导体晶片并且同时使用多个调节盘来调节CMP设备的抛光垫。 调理盘可以沿着抛光垫的表面一起移动或独立地移动，以调节旋转抛光垫的整个表面。

公开(公告)号：US06638868B1

公开(公告)日：2003-10-28

申请号：US10141221

申请日：2002-05-07

申请人： Tsu Shih ,  Kun Ku Hung ,  Wen-Hun Tung ,  Wen-Chin Chiou

发明人： Tsu Shih ,  Kun Ku Hung ,  Wen-Hun Tung ,  Wen-Chin Chiou

IPC分类号： H01L21302

CPC分类号： B24B37/046 ,  B24B37/042 ,  H01L21/02071 ,  H01L21/3212 ,  H01L21/7684

摘要： A method and apparatus for implementing the method for preventing or reducing corrosion of copper containing features included in a semiconductor wafer in a chemical mechanical polishing (CMP) process the method providing at least one semiconductor wafer polishing surface including copper filled anisotropically etched features; polishing the at least one semiconductor wafer polishing surface according to a CMP process having a polishing pad surface contacting the at least one it semiconductor wafer polishing surface at least a portion of the polishing pad in electrically conductive communication with a conductive polishing platen; and, providing at least one electrically conductive pathway from the conductive polishing platen.

摘要翻译： 一种用于在化学机械抛光（CMP）工艺中实现用于防止或减少包含在半导体晶片中的含铜特征的腐蚀的方法和装置，该方法提供至少一个包括铜填充的各向异性蚀刻特征的半导体晶片抛光表面的方法; 根据CMP工艺抛光所述至少一个半导体晶片抛光表面，所述CMP工艺具有抛光垫表面，所述抛光垫表面与所述至少一个半导体晶片抛光表面接触，所述至少一部分所述抛光垫与导电抛光平台导电连通; 以及从所述导电抛光平台提供至少一个导电通路。

公开(公告)号：US08277286B2

公开(公告)日：2012-10-02

申请号：US12370662

申请日：2009-02-13

申请人： Kun-Ku Hung ,  Zin-Chang Wei ,  Huang Soon Kang ,  Chyi-Shyuan Chern

发明人： Kun-Ku Hung ,  Zin-Chang Wei ,  Huang Soon Kang ,  Chyi-Shyuan Chern

IPC分类号： B24B1/00 ,  B24B57/02 ,  B24B29/00

CPC分类号： B24B57/02 ,  B24B37/04

摘要： A chemical mechanical polishing method and apparatus provides a deformable, telescoping slurry dispenser arm coupled to a dispenser head that may be arcuate in shape and may also be a bendable telescoping member that can be adjusted to vary the number of slurry dispenser ports and the degree of curvature of the dispenser head. The dispenser arm may additionally include slurry dispenser ports therein. The dispenser arm may advantageously be formed of a plurality of nested tubes that are slidable with respect to one another. The adjustable dispenser arm may pivot about a pivot point and can be variously positioned to accommodate different sized polishing pads used to polish substrates of different dimensions and the bendable, telescoping slurry dispenser arm and dispenser head provide uniform slurry distribution to any of various wafer polishing locations, effective slurry usage and uniform polishing profiles in each case.

摘要翻译： 化学机械抛光方法和装置提供了可变形的，可伸缩的浆料分配器臂，其联接到分配器头部，其可以是弓形的形状，并且还可以是可弯曲的伸缩构件，其可以被调节以改变浆料分配器端口的数量和 分配头的曲率。 分配器臂可以另外包括其中的浆料分配器端口。 分配器臂可以有利地由可相对于彼此滑动的多个嵌套管形成。 可调节的分配器臂可围绕枢转点枢转并且可以被不同地定位以适应用于抛光不同尺寸的基板的不同尺寸的抛光垫，并且可弯曲的可伸缩浆料分配器臂和分配器头部向各种晶片抛光位置 ，有效的浆料使用和均匀的抛光轮廓在每种情况下。