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公开(公告)号:US20060272803A1
公开(公告)日:2006-12-07
申请号:US11395900
申请日:2006-03-30
申请人: Borys Senyk , Larry Moresco
发明人: Borys Senyk , Larry Moresco
CPC分类号: G06F1/203 , G06F2200/201
摘要: A heat exchanging system comprising circulating fluid through a tube coupled to an electronic component in a first part of a computing device and to a heat transfer plate in a second part of the computing device.
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公开(公告)号:US06404047B1
公开(公告)日:2002-06-11
申请号:US09637515
申请日:2000-08-11
申请人: Kevin J. Haley , Larry Moresco
发明人: Kevin J. Haley , Larry Moresco
IPC分类号: H01L2304
CPC分类号: H05K3/3478 , H01L21/6835 , H01L24/11 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/303 , H05K2201/035 , H05K2201/10318 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , Y02P70/613
摘要: Socketable balls are mounted to a BGA package by first placing the balls into pockets or holes of a tray that are sized such that when the balls are inserted, an upper portion of the ball protrudes above a planar surface of the tray. A layer of a polymer material is then applied over the balls and a top area of each of the balls is exposed, and plated with solder. During the plating step the polymer provides a solder-tight seal against each of the balls such that, except for the top area, the rest of the surface area of the balls remains solder-free. The solder-plated top area of each of the balls is then bonded to the corresponding plurality of lands of the package by reflowing the solder to establish electrical contact therebetween.
摘要翻译: 可插入球通过首先将球放置在托盘的凹穴或孔中而安装到BGA封装,其尺寸使得当球被插入时,球的上部突出于托盘的平坦表面上方。 然后将一层聚合物材料施加到球上,并且每个球的顶部区域被暴露,并且用焊料镀覆。 在电镀步骤期间,聚合物对每个球提供无阻焊的密封,使得除了顶部区域之外,球的其余表面区域保持无焊料。 然后通过回流焊料以在其间形成电接触,将每个滚珠的焊接的顶部区域结合到封装的对应的多个焊盘。
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公开(公告)号:US06168976A
公开(公告)日:2001-01-02
申请号:US09226782
申请日:1999-01-06
申请人: Kevin J. Haley , Larry Moresco
发明人: Kevin J. Haley , Larry Moresco
IPC分类号: H01L2144
CPC分类号: H05K3/3478 , H01L21/6835 , H01L24/11 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/303 , H05K2201/035 , H05K2201/10318 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , Y02P70/613
摘要: Socketable balls are mounted to a BGA package by first placing the balls into pockets or holes of a tray that are sized such that when the balls are inserted, an upper portion of the ball protrudes above a planar surface of the tray. A layer of a polymer material is then applied over the balls and a top area of each of the balls is exposed, and plated with solder. During the plating step the polymer provides a solder-tight seal against each of the balls such that, except for the top area, the rest of the surface area of the balls remains solder-free. The solder-plated top area of each of the balls is then bonded to the corresponding plurality of lands of the package by reflowing the solder to establish electrical contact therebetween.
摘要翻译: 可插入球通过首先将球放置在托盘的凹穴或孔中而安装到BGA封装,其尺寸使得当球被插入时,球的上部突出在托盘的平坦表面上方。 然后将一层聚合物材料施加到球上,并且每个球的顶部区域被暴露,并且用焊料镀覆。 在电镀步骤期间,聚合物对每个球提供无阻焊的密封,使得除了顶部区域之外,球的其余表面区域保持无焊料。 然后通过回流焊料以在其间形成电接触,将每个滚珠的焊接的顶部区域结合到封装的对应的多个焊盘。
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