公开(公告)号：US06313987B1

公开(公告)日：2001-11-06

申请号：US09165006

申请日：1998-09-30

申请人： Michael O'Connor ,  Kevin J. Haley

发明人： Michael O'Connor ,  Kevin J. Haley

IPC分类号： G06F120

CPC分类号： G06F1/1632

摘要： A heat exchanger adapated for heat dissipation. A first heat transfer element has an end which forms an engaging surface. A second heat transfer element has a receptacle portion which is integrally formed and has an engaging surface that is urged against the engaging surface of the first heat transfer element when the first heat transfer element and the second heat transfer element are mated.

摘要翻译： 适合散热的热交换器。 第一传热元件具有形成接合表面的端部。 第二传热元件具有一体形成的接纳部，并且具有在第一传热元件和第二传热元件配合时被推靠在第一传热元件的接合表面上的接合表面。

公开(公告)号：US5290735A

公开(公告)日：1994-03-01

申请号：US011944

申请日：1993-02-01

申请人： Kevin J. Haley

发明人： Kevin J. Haley

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49558 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10T29/49121

摘要： A high leadcount surface mount IC package. The IC package of the present invention includes a plastic molded compound which is localized over the surface of the die, such that it covers the interconnections of the die. The package includes a leadframe having many leads. The leads are supported using a ring support structure.

摘要翻译： 高铅笔表面贴装IC封装。 本发明的IC封装包括位于模具表面上的塑料模制化合物，从而覆盖模具的互连。 该封装包括具有许多引线的引线框架。 使用环形支撑结构支撑引线。

公开(公告)号：US06667548B2

公开(公告)日：2003-12-23

申请号：US09828617

申请日：2001-04-06

申请人： Michael O'Connor ,  Kevin J. Haley ,  Biswajit Sur

发明人： Michael O'Connor ,  Kevin J. Haley ,  Biswajit Sur

IPC分类号： H01L2324

CPC分类号： H01L23/3735 ,  H01L23/3732 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/10253 ,  Y10S257/93 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at a higher frequency for a given upper threshold temperature. Also shown is a method of manufacturing such a semiconductor chip, and the associated method of cooling a semiconductor chip.

公开(公告)号：US06404047B1

公开(公告)日：2002-06-11

申请号：US09637515

申请日：2000-08-11

申请人： Kevin J. Haley ,  Larry Moresco

发明人： Kevin J. Haley ,  Larry Moresco

IPC分类号： H01L2304

CPC分类号： H05K3/3478 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/303 ,  H05K2201/035 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  Y02P70/613

摘要： Socketable balls are mounted to a BGA package by first placing the balls into pockets or holes of a tray that are sized such that when the balls are inserted, an upper portion of the ball protrudes above a planar surface of the tray. A layer of a polymer material is then applied over the balls and a top area of each of the balls is exposed, and plated with solder. During the plating step the polymer provides a solder-tight seal against each of the balls such that, except for the top area, the rest of the surface area of the balls remains solder-free. The solder-plated top area of each of the balls is then bonded to the corresponding plurality of lands of the package by reflowing the solder to establish electrical contact therebetween.

摘要翻译： 可插入球通过首先将球放置在托盘的凹穴或孔中而安装到BGA封装，其尺寸使得当球被插入时，球的上部突出于托盘的平坦表面上方。 然后将一层聚合物材料施加到球上，并且每个球的顶部区域被暴露，并且用焊料镀覆。 在电镀步骤期间，聚合物对每个球提供无阻焊的密封，使得除了顶部区域之外，球的其余表面区域保持无焊料。 然后通过回流焊料以在其间形成电接触，将每个滚珠的焊接的顶部区域结合到封装的对应的多个焊盘。

公开(公告)号：US06168976A

公开(公告)日：2001-01-02

申请号：US09226782

申请日：1999-01-06

申请人： Kevin J. Haley ,  Larry Moresco

发明人： Kevin J. Haley ,  Larry Moresco

IPC分类号： H01L2144

CPC分类号： H05K3/3478 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/303 ,  H05K2201/035 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  Y02P70/613

摘要： Socketable balls are mounted to a BGA package by first placing the balls into pockets or holes of a tray that are sized such that when the balls are inserted, an upper portion of the ball protrudes above a planar surface of the tray. A layer of a polymer material is then applied over the balls and a top area of each of the balls is exposed, and plated with solder. During the plating step the polymer provides a solder-tight seal against each of the balls such that, except for the top area, the rest of the surface area of the balls remains solder-free. The solder-plated top area of each of the balls is then bonded to the corresponding plurality of lands of the package by reflowing the solder to establish electrical contact therebetween.

摘要翻译： 可插入球通过首先将球放置在托盘的凹穴或孔中而安装到BGA封装，其尺寸使得当球被插入时，球的上部突出在托盘的平坦表面上方。 然后将一层聚合物材料施加到球上，并且每个球的顶部区域被暴露，并且用焊料镀覆。 在电镀步骤期间，聚合物对每个球提供无阻焊的密封，使得除了顶部区域之外，球的其余表面区域保持无焊料。 然后通过回流焊料以在其间形成电接触，将每个滚珠的焊接的顶部区域结合到封装的对应的多个焊盘。

公开(公告)号：US5359225A

公开(公告)日：1994-10-25

申请号：US972754

申请日：1992-11-06

申请人： Kevin J. Haley

发明人： Kevin J. Haley

IPC分类号： H01L23/495 ,  H01L23/28

CPC分类号： H01L23/49558 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10T29/49121

摘要： A high leadcount surface mount IC package. The IC package of the present invention includes a plastic molded compound which is localized over the surface of the die, such that it covers the interconnections of the die. The package includes a leadframe having many leads. The leads are supported using a ring support structure.

公开(公告)号：US5359768A

公开(公告)日：1994-11-01

申请号：US92747

申请日：1993-07-16

申请人： Kevin J. Haley

发明人： Kevin J. Haley

IPC分类号： H01L23/367 ,  H05K3/30 ,  H05K3/34

CPC分类号： H05K3/305 ,  H01L23/367 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/3025 ,  H05K2201/0125 ,  H05K2201/09918 ,  H05K2201/10734 ,  H05K3/303 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144

摘要： A very small integrated circuit package. The package of the present invention includes a substrate or die coupled to a heatsink. The substrate or die has solder bumps for being directly mounted to a circuit board. The heatsink is coupled to the die before the die is mounted to the circuit board. The heatsink is mounted using adhesive. By mounting the heatsink before the die is mounted, the heatsink may be used to handle of the substrate or die during the manufacturing and testing process, thereby increasing the reliability of the die by increased protection.

摘要翻译： 一个非常小的集成电路封装。 本发明的封装包括耦合到散热器的衬底或管芯。 衬底或裸片具有用于直接安装到电路板的焊料凸块。 在将管芯安装到电路板之前，将散热器耦合到管芯。 使用粘合剂安装散热器。 通过在安装模具之前安装散热器，散热器可以在制造和测试过程中用于处理基板或模具，从而通过增加保护来提高模具的可靠性。

公开(公告)号：US07132313B2

公开(公告)日：2006-11-07

申请号：US10721722

申请日：2003-11-25

申请人： Michael O'Connor ,  Kevin J. Haley ,  Biswajit Sur

发明人： Michael O'Connor ,  Kevin J. Haley ,  Biswajit Sur

IPC分类号： H01L21/50 ,  H01L21/00

CPC分类号： H01L23/3735 ,  H01L23/3732 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/10253 ,  Y10S257/93 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at a higher frequency for a given upper threshold temperature. Also shown is a method of manufacturing such a semiconductor chip, and the associated method of cooling a semiconductor chip.

公开(公告)号：US6043560A

公开(公告)日：2000-03-28

申请号：US984428

申请日：1997-12-03

申请人： Kevin J. Haley ,  Niel C. Delaplane ,  Ravindranath V. Mahajan ,  Robert Starkston ,  Charles A. Gealer ,  Joseph C. Krauskopf

发明人： Kevin J. Haley ,  Niel C. Delaplane ,  Ravindranath V. Mahajan ,  Robert Starkston ,  Charles A. Gealer ,  Joseph C. Krauskopf

IPC分类号： H01L23/40 ,  H01L23/42 ,  H01L23/30 ,  H01L23/28 ,  H01L23/34

CPC分类号： H01L23/42 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4087 ,  H01L2924/0002

摘要： A method and apparatus for controlling the thickness of a thermal interface between a processor die and a thermal plate in a microprocessor assembly are provided. The apparatus includes a generally rectangular shaped thermal top cover having a recessed portion of predetermined depth and aperture therein. The thermal top cover fits over the processor die. A thermal interface layer fills the recessed portion of the thermal top cover covering the processor die. The depth of the recessed portion is greater than the thickness of the processor die so that the thickness of the thermal interface layer is controlled. A thermal plate is placed over the thermal top cover in contact with the thermal grease so as to form a thermal path from the processor die to the thermal plate.

摘要翻译： 提供了一种用于控制微处理器组件中的处理器管芯和热板之间的热界面的厚度的方法和装置。 该装置包括大致矩形的热顶盖，其具有预定深度和孔中的凹部。 热顶盖装在处理器模具上。 热界面层填充覆盖处理器管芯的热顶盖的凹陷部分。 凹部的深度大于处理器管芯的厚度，从而控制热界面层的厚度。 将热板放置在与热油脂接触的热顶盖上，以形成从处理器管芯到热板的热路径。