公开(公告)号：US6116423A

公开(公告)日：2000-09-12

申请号：US359524

申请日：1999-07-23

申请人： Clessie A. Troxtell, Jr. ,  Laura A. Hnilo ,  Michael L. Hayden ,  Charles M. Hess ,  Daniel R. Wikander ,  Lee A. Lewis

发明人： Clessie A. Troxtell, Jr. ,  Laura A. Hnilo ,  Michael L. Hayden ,  Charles M. Hess ,  Daniel R. Wikander ,  Lee A. Lewis

IPC分类号： B65D5/24 ,  B65D5/46 ,  B65D81/127 ,  B65D85/90

CPC分类号： B65D5/248 ,  B65D5/46008 ,  B65D81/127

摘要： A multifunctional shipping container for integrated circuits, and methods of using and reusing the container are described. The compact container coupled with foam inserts is dimensioned to securely ship and store integrated circuits in either tray or reel format. The container with an expandable cavity allows ease of access for loading and unloading the contents at multiple work stations, and may be converted to an in-house "tote". Multifunctionality of the container supports use as a shipping system from the tray or reel supplier, to the IC assembly and test site, to distribution centers, and to the IC customer, thus eliminating multiple costs of disposal, inventory and new shipping materials.

摘要翻译： 描述了用于集成电路的多功能运输容器，以及使用和再使用容器的方法。 与泡沫插件相结合的紧凑型容器的尺寸被设计成以托盘或卷盘格式安全地运输和存储集成电路。 具有可扩张腔的容器允许容易地进入用于在多个工作站上装载和卸载内容物，并且可以转换为内部“手提箱”。 容器的多功能性支持从托盘或卷轴供应商，IC组装和测试现场，配送中心和IC客户用作运输系统，从而消除了处理，库存和新运输材料的多项成本。

公开(公告)号：US06465898B1

公开(公告)日：2002-10-15

申请号：US09911557

申请日：2001-07-23

申请人： Laura A. Hnilo ,  Mike P. Pierce ,  Roy A. Hastings ,  David Grant

发明人： Laura A. Hnilo ,  Mike P. Pierce ,  Roy A. Hastings ,  David Grant

IPC分类号： H01L23544

CPC分类号： H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54473 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip bearing an alignment mark, particularly useful for wire bonder alignment on chips having bonding surfaces over the active circuits. The marks are fabricated on diagonal corners of the chip, and each mark consists of a pair of touching squares which are rotated about 90 degrees from each other in the opposite chip corners. The unique positioning of the marks, as well as the rotation provides both gross chip position features useful in mounting the chip on a lead frame, as well as fine alignment set-up or teaching aids for wire bonding. The small, high visual contrast features of the alignment mark are fabricated simultaneously with the top active metallization of the IC chip, and are not covered by passivation coating or additional metal layers.

摘要翻译： 具有对准标记的半导体芯片，特别适用于在有源电路上具有接合表面的芯片上的引线接合器对准。 标记在芯片的对角线上制造，并且每个标记由在相对的芯片角中彼此旋转大约90度的一对触摸正方形组成。 标记的独特定位以及旋转提供了可用于将芯片安装在引线框架上的总芯片位置特征，以及用于引线接合的精细对准设置或辅助设备。 对准标记的小，高视觉对比特征与IC芯片的顶部有源金属化同时制造，并且不被钝化涂层或附加金属层覆盖。