公开(公告)号：US20100110527A1

公开(公告)日：2010-05-06

申请号：US12264996

申请日：2008-11-05

申请人： Jane Qian Liu ,  Frank Armstrong ,  Edward Carl Fisher ,  Scott Patrick Overmann ,  Leatrice Lea Gallman Adams

发明人： Jane Qian Liu ,  Frank Armstrong ,  Edward Carl Fisher ,  Scott Patrick Overmann ,  Leatrice Lea Gallman Adams

IPC分类号： G02B26/00 ,  H01L21/56 ,  H01L23/31

CPC分类号： G02B7/008 ,  B81B3/0081 ,  B81B7/0077 ,  B81B2201/047 ,  G02B26/0833 ,  H01L21/56 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

摘要： A packaged electronic device includes a substrate with an upper surface interrupted by a well formed in the substrate. The well has a substrate bottom surface and a substrate sidewall. An electronic device is located in the well over the substrate bottom surface and has a device top surface and a device sidewall. A trench is bounded by the substrate bottom surface, the substrate sidewall and the device sidewall. An encapsulant at least partially fills the trench and contacts the substrate sidewall and the device sidewall. The encapsulant has a first elevation on the substrate sidewall with respect to the substrate bottom surface and a second elevation on the substrate device sidewall with respect to the substrate bottom surface that is at least about 35% greater than the first elevation.

摘要翻译： 封装的电子器件包括具有被衬底中形成的阱中断的上表面的衬底。 阱具有衬底底表面和衬底侧壁。 电子器件位于衬底底部表面的阱中，并且具有器件顶表面和器件侧壁。 沟槽由衬底底表面，衬底侧壁和器件侧壁限定。 密封剂至少部分地填充沟槽并且接触衬底侧壁和器件侧壁。 该密封剂在衬底侧壁上相对于衬底底表面具有第一高度，相对于衬底底表面的衬底装置侧壁上的第二高度比第一高度至少大约35％。

公开(公告)号：US07898724B2

公开(公告)日：2011-03-01

申请号：US12264996

申请日：2008-11-05

申请人： Jane Qian Liu ,  Frank Armstrong ,  Edward Carl Fisher ,  Scott Patrick Overmann ,  Leatrice Lea Gallman Adams

发明人： Jane Qian Liu ,  Frank Armstrong ,  Edward Carl Fisher ,  Scott Patrick Overmann ,  Leatrice Lea Gallman Adams

IPC分类号： G02B26/00 ,  H01L23/48

CPC分类号： G02B7/008 ,  B81B3/0081 ,  B81B7/0077 ,  B81B2201/047 ,  G02B26/0833 ,  H01L21/56 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3121 ,  H01L2924/0002 ,  H01L2924/00

摘要： A packaged electronic device includes a substrate with an upper surface interrupted by a well formed in the substrate. The well has a substrate bottom surface and a substrate sidewall. An electronic device is located in the well over the substrate bottom surface and has a device top surface and a device sidewall. A trench is bounded by the substrate bottom surface, the substrate sidewall and the device sidewall. An encapsulant at least partially fills the trench and contacts the substrate sidewall and the device sidewall. The encapsulant has a first elevation on the substrate sidewall with respect to the substrate bottom surface and a second elevation on the substrate device sidewall with respect to the substrate bottom surface that is at least about 35% greater than the first elevation.

摘要翻译： 封装的电子器件包括具有被衬底中形成的阱中断的上表面的衬底。 阱具有衬底底表面和衬底侧壁。 电子器件位于衬底底部表面的阱中，并且具有器件顶表面和器件侧壁。 沟槽由衬底底表面，衬底侧壁和器件侧壁限定。 密封剂至少部分地填充沟槽并且接触衬底侧壁和器件侧壁。 该密封剂在衬底侧壁上相对于衬底底表面具有第一高度，相对于衬底底表面的衬底装置侧壁上的第二高度比第一高度至少大约35％。