公开(公告)号：US20060019480A1

公开(公告)日：2006-01-26

申请号：US10896831

申请日：2004-07-22

申请人： Chia-Jen Cheng ,  Hui-Mei Yu ,  Li-Hsin Tseng ,  Tzu-Han Lin ,  Ching-Chiang Wu ,  Chun-Yen Lo ,  Li-Chuan Huang ,  Boe Su

发明人： Chia-Jen Cheng ,  Hui-Mei Yu ,  Li-Hsin Tseng ,  Tzu-Han Lin ,  Ching-Chiang Wu ,  Chun-Yen Lo ,  Li-Chuan Huang ,  Boe Su

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L23/525 ,  H01L23/53238 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/00014

摘要： A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier layer and a seed layer are then formed over the first passivation layer and the bonding pad. A patterned mask layer is then formed over the seed layer to expose a portion thereof over the bonding pad, and a metal layer is then formed thereon. A sacrificial layer is then formed over the substrate and the sacrificial layer over the patterned mask layer is removed. The conductive film exposed by the metal layer and the remaining sacrificial layer is then removed, leaving a pad redistribution layer for the bonding pad.

公开(公告)号：US07122458B2

公开(公告)日：2006-10-17

申请号：US10896831

申请日：2004-07-22

申请人： Chia-Jen Cheng ,  Hui-Mei Yu ,  Li-Hsin Tseng ,  Tzu-Han Lin ,  Ching-Chiang Wu ,  Chun-Yen Lo ,  Li-Chuan Huang ,  Boe Su

发明人： Chia-Jen Cheng ,  Hui-Mei Yu ,  Li-Hsin Tseng ,  Tzu-Han Lin ,  Ching-Chiang Wu ,  Chun-Yen Lo ,  Li-Chuan Huang ,  Boe Su

IPC分类号： H01L21/44

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L23/525 ,  H01L23/53238 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/00014

摘要： A method for fabricating a pad redistribution layer. First, at least one bonding pad exposed by a first passivation layer is provided. A diffusion barrier layer and a seed layer are then formed over the first passivation layer and the bonding pad. A patterned mask layer is then formed over the seed layer to expose a portion thereof over the bonding pad, and a metal layer is then formed thereon. A sacrificial layer is then formed over the substrate and the sacrificial layer over the patterned mask layer is removed. The conductive film exposed by the metal layer and the remaining sacrificial layer is then removed, leaving a pad redistribution layer for the bonding pad.

摘要翻译： 一种制造衬垫再分布层的方法。 首先，提供由第一钝化层暴露的至少一个接合焊盘。 然后在第一钝化层和接合焊盘上形成扩散阻挡层和种子层。 然后在种子层上形成图案化的掩模层，以将其部分暴露在焊盘上，然后在其上形成金属层。 然后在衬底上形成牺牲层，并去除图案化掩模层上的牺牲层。 然后去除由金属层和剩余的牺牲层暴露的导电膜，留下用于焊盘的焊盘再分布层。