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公开(公告)号：US20130020689A1
公开(公告)日：2013-01-24
申请号：US13489471
申请日：2012-06-06
申请人： Penglin Mei , Liwei Liu , Dehong Ye
发明人： Penglin Mei , Liwei Liu , Dehong Ye
IPC分类号： H01L21/60 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49551 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45664 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A Quad Flat Pack (QFP) device includes a semiconductor die attached to a flag of a lead frame. Bonding pads of the die are electrically connected to inner and outer rows of leads of the lead frame with bond wires. The die, die flag, bond wires and portions of the inner and outer leads are covered with a mold compound, which defines a package body. The outer leads are similar to the gull-wing leads of a conventional QFP device while the inner leads form contact points at a bottom surface of the package body. A cut is performed on an inner side of the inner leads to separate the inner leads from the die pad.
摘要翻译： 四平坦封装（QFP）器件包括附接到引线框的标志的半导体管芯。 管芯的接合焊盘通过接合线电连接到引线框架的内排和外排引线。 模具，模具标记，接合线和内部和外部引线的部分被模具化合物覆盖，模具化合物限定了包装体。 外引线类似于常规QFP器件的鸥翼引线，而内引线在封装体的底表面处形成接触点。 在内引线的内侧进行切割，以将内引线与管芯焊盘分开。
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公开(公告)号：US09195249B2
公开(公告)日：2015-11-24
申请号：US13332142
申请日：2011-12-20
申请人： Sean S. Chen , Liwei Liu , Yongliang Wang
发明人： Sean S. Chen , Liwei Liu , Yongliang Wang
CPC分类号： G05F1/575
摘要： An adaptive phase-lead compensation (zero) circuit is disclosed that can be added to a circuit (e.g., a CMOS-based LDO) to ease the compensation and increase the phase margin of the circuit. By using the disclosed adaptive phase-lead compensation circuit, an adjustable resistance can be connected to any nodes in the compensated circuit rather than just to the voltage source (VDD) or ground (GND), allowing the Miller Effect to be used via a Miller capacitor.
摘要翻译： 公开了可以添加到电路（例如，基于CMOS的LDO）的自适应相位超前补偿（零）电路，以便于补偿并增加电路的相位裕度。 通过使用所公开的自适应相位 - 引线补偿电路，可调电阻可以连接到补偿电路中的任何节点，而不仅仅是连接到电压源（VDD）或接地（GND），允许米勒效应通过米勒 电容器。
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公开(公告)号：US20130154593A1
公开(公告)日：2013-06-20
申请号：US13332142
申请日：2011-12-20
申请人： Sean S. Chen , Liwei Liu , Yongliang Wang
发明人： Sean S. Chen , Liwei Liu , Yongliang Wang
CPC分类号： G05F1/575
摘要： An adaptive phase-lead compensation (zero) circuit is disclosed that can be added to a circuit (e.g., a CMOS-based LDO) to ease the compensation and increase the phase margin of the circuit. By using the disclosed adaptive phase-lead compensation circuit, an adjustable resistance can be connected to any nodes in the compensated circuit rather than just to the voltage source (VDD) or ground (GND), allowing the Miller Effect to be used via a Miller capacitor.
摘要翻译： 公开了可以添加到电路（例如，基于CMOS的LDO）的自适应相位超前补偿（零）电路，以便于补偿并增加电路的相位裕度。 通过使用所公开的自适应相位 - 引线补偿电路，可调电阻可以连接到补偿电路中的任何节点，而不仅仅是连接到电压源（VDD）或接地（GND），允许米勒效应通过米勒 电容器。
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