公开(公告)号：US06488158B1

公开(公告)日：2002-12-03

申请号：US09659826

申请日：2000-09-11

申请人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

发明人： Mohammad Khan ,  Raj N. Master ,  Maria G. Guardado ,  Loo L. Teoh ,  Ahmad Juwanda

IPC分类号： A47G1908

CPC分类号： H01L21/67333 ,  H01L21/67336 ,  H01L21/6835 ,  H01L2221/68313

摘要： A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.

摘要翻译： 船形成有多个通孔，其尺寸设计成在组装期间可靠地将陶瓷或有机倒装芯片半导体封装保持在适当的位置。 实施例包括具有具有四面通孔阵列的底层和具有从通孔侧面延伸的通孔阵列的顶层的船。 实施例还包括具有底层的船，该底层具有通孔小于顶层中的基本上对准的覆盖通孔，基本对准的通孔形成倒装芯片封装保持袋。 对准机构确保组件准确地定位在组装期间保持在船中的倒装芯片封装上。