Gunnable adhesive composition for use in construction membrane applications
    1.
    发明授权
    Gunnable adhesive composition for use in construction membrane applications 有权
    可用于建筑膜应用的可胶粘剂组合物

    公开(公告)号:US08889261B2

    公开(公告)日:2014-11-18

    申请号:US13376115

    申请日:2010-06-04

    IPC分类号: B32B9/04 C09J183/04 E04B1/62

    摘要: A gunnable adhesive composition includes a silicone resin and an organopolysiloxane, or a reaction product thereof; as well as a filler and a solvent. The silicone resin and the organopolysiloxane are present in amounts to provide a resin/polymer ratio ranging from 58% to 64%. The gunnable adhesive composition may be applied to low surface energy substrates at ambient temperatures without primer or other surface treatment. The gunnable adhesive composition and adhesive product thereof are useful in weather barrier applications, such as building wraps.

    摘要翻译: 可喷涂的粘合剂组合物包括硅树脂和有机聚硅氧烷,或其反应产物; 以及填料和溶剂。 有机硅树脂和有机聚硅氧烷的存在量可以提供从58%到64%的树脂/聚合物比例。 可涂覆的粘合剂组合物可以在环境温度下施加到低表面能基材上,而无需底漆或其它表面处理。 可喷涂的粘合剂组合物和粘合剂产品可用于天气屏障应用,例如建筑物包装。

    Pressure sensitive adhesives and methods for their preparation
    8.
    发明申请
    Pressure sensitive adhesives and methods for their preparation 失效
    压敏粘合剂及其制备方法

    公开(公告)号:US20090294023A1

    公开(公告)日:2009-12-03

    申请号:US11921283

    申请日:2006-07-06

    摘要: A pressure sensitive adhesive composition includes (A) a bodied MQ resin containing (i) a resinous core and (ii) a nonresinous polyorganosiloxane group, where the nonresinous polyorganosiloxane group is terminated with a silicon-bonded hydroxyl group; (B) a treated MQ resin, where (B)/(A) ratio has a value of 0.3 to 5.0, and (C) a polydiorganosiloxane terminated with a condensation reactable group; where resin/polymer ratio has a value of 2.0 to 3.0; optionally (D) a crosslinker; optionally (E) a catalyst; and optionally (F) a solvent. A pressure sensitive adhesive product prepared by curing the pressure sensitive adhesive composition is useful in structural attachment applications such as structural glazing applications.

    摘要翻译: 压敏粘合剂组合物包含(A)含有(i)树脂核心和(ii)非共聚聚有机硅氧烷基团的稠合MQ树脂,其中非共聚聚有机硅氧烷基团与硅键合的羟基封端; (B)处理的MQ树脂,其中(B)/(A)比值为0.3〜5.0,(C)以缩合反应性基团封端的聚二有机硅氧烷; 其中树脂/聚合物比值为2.0-3.0; (D)交联剂; 任选地(E)催化剂; 和任选的(F)溶剂。 通过固化压敏粘合剂组合物制备的压敏粘合剂产品可用于结构附着应用,例如结构玻璃应用。