公开(公告)号：US07034652B2

公开(公告)日：2006-04-25

申请号：US10192034

申请日：2002-07-10

Applicant: Stephen J. Whitney ,  Hugh Hyatt ,  Louis Rector

Inventor： Stephen J. Whitney ,  Hugh Hyatt ,  Louis Rector

IPC: H01C8/00

CPC classification number: H05K1/0246 ,  H01C7/105 ,  H01C7/118 ,  H01C7/12 ,  H05K1/0259 ,  H05K1/095 ,  H05K1/167 ,  H05K3/284 ,  H05K2201/0738 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611

Abstract: The present invention provides a multifunction resistor having an improved voltage variable material (“VVM”). More specifically, the present invention provides a polymer VVM that has been formulated with a high percentage loading of conductive and/or semiconductive particles. A known length of the relatively conductive VVM is placed between adjacent electrodes to produce a desired Ohmic normal state resistance. When an electrostatic discharge event occurs, the VVM of the multifunctional resistor becomes highly conductive and dissipates the ESD threat. One application for this “resistor” is the termination of a transmission line, which prevents unwanted reflections and distortion of high frequency signals.

公开(公告)号：US06251513B1

公开(公告)日：2001-06-26

申请号：US09136507

申请日：1998-08-19

Applicant: Louis Rector ,  Hugh M. Hyatt

Inventor： Louis Rector ,  Hugh M. Hyatt

IPC: B23B516

CPC classification number: H01C7/12 ,  H01C7/105 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/259

Abstract: A composition and devices utilizing these compositions for providing protection against electrical overstress including a matrix formed of a mixture of an insulating binder, conductive particles having an average particle size of less than 10 microns, and semiconductive particles having an average particle size of less than 10 microns. The compositions exhibit improved clamping voltages in a range of about 30 volts to greater than 2,000 volts.

Abstract translation: 使用这些组合物的组合物和装置，用于提供防止电过载的保护，包括由绝缘粘合剂，平均粒度小于10微米的导电颗粒和平均粒径小于10微米的半导体颗粒形成的基质 微米。 该组合物在约30伏特至大于2000伏特的范围内表现出改善的钳位电压。

公开(公告)号：US06549114B2

公开(公告)日：2003-04-15

申请号：US09379422

申请日：1999-08-19

Applicant: Stephen J. Whitney ,  Louis Rector ,  Hugh M. Hyatt ,  Anthony D. Minervini ,  Honorio S. Luciano

Inventor： Stephen J. Whitney ,  Louis Rector ,  Hugh M. Hyatt ,  Anthony D. Minervini ,  Honorio S. Luciano

IPC: H01L710

CPC classification number: H05K1/0257 ,  H01C1/14 ,  H01C7/10 ,  H01L2224/48091 ,  H01L2924/07811 ,  H05K1/0259 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/10189 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members. In response to a high voltage EOS transient, the voltage variable material essentially instantaneously switches to a low resistance state, channeling the potentially harmful EOS transient to the ground plane and away from the integrated circuit.

Abstract translation: 用于保护电气部件免受电力过载（EOS）瞬变的电压可变材料的布置。 具有多个电引线，接地平面和电压可变材料层的器件。 电压可变材料将多个电引线彼此物理地接合，并且在多个电引线和接地平面之间提供电连接。 具有集成在其中的电路的管芯附接到接地平面。 导电构件将多个电引线电连接到集成电路。 在正常工作电压下，电压可变材料具有高电阻，从而通过导电构件将电流从电引线引导到集成电路。 响应于高电压EOS瞬态，电压可变材料基本上瞬间切换到低电阻状态，将潜在有害的EOS瞬态引导到接地平面并远离集成电路。

公开(公告)号：US06693508B2

公开(公告)日：2004-02-17

申请号：US09500622

申请日：2000-02-09

Applicant: Stephen J. Whitney ,  Louis Rector ,  Hugh M. Hyatt ,  Anthony D. Minervini ,  Honorio S. Luciano

Inventor： Stephen J. Whitney ,  Louis Rector ,  Hugh M. Hyatt ,  Anthony D. Minervini ,  Honorio S. Luciano

IPC: H01L713

CPC classification number: H05K1/0257 ,  H01C1/14 ,  H01C7/10 ,  H01L2224/48091 ,  H01L2924/07811 ,  H05K1/0259 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/10189 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An arrangement of voltage variable materials for the protection of electrical components from electrical overstress (EOS) transients. A device having a plurality of electrical leads, a ground plane and a layer of voltage variable material. The voltage variable material physically bonds the plurality of electrical leads to one another as well as provides an electrical connection between the plurality of electrical leads and the ground plane. A die having a circuit integrated therein is attached to the ground plane. Conductive members electrically connect the plurality of electrical leads to the integrated circuit. At normal operating voltages, the voltage variable material has a high resistance, thus channeling current from the electrical leads to the integrated circuit via the conductive members. In response to a high voltage EOS transient, the voltage variable material essentially instantaneously switches to a low resistance state, channeling the potentially harmful EOS transient to the ground plane and away from the integrated circuit.

Abstract translation: 用于保护电气部件免受电力过载（EOS）瞬变的电压可变材料的布置。 具有多个电引线，接地平面和电压可变材料层的器件。 电压可变材料将多个电引线彼此物理地接合，并且在多个电引线和接地平面之间提供电连接。 具有集成在其中的电路的管芯附接到接地平面。 导电构件将多个电引线电连接到集成电路。 在正常工作电压下，电压可变材料具有高电阻，从而通过导电构件将电流从电引线引导到集成电路。 响应于高电压EOS瞬态，电压可变材料基本上瞬间切换到低电阻状态，将潜在有害的EOS瞬态引导到接地平面并远离集成电路。

公开(公告)号：US06191928B1

公开(公告)日：2001-02-20

申请号：US09256604

申请日：1999-02-23

Applicant: Louis Rector ,  Hugh M. Hyatt ,  Anthony Minervini ,  Robert Swensen ,  Andrew J. Neuhalfen ,  Andrew W. S. Elliott

Inventor： Louis Rector ,  Hugh M. Hyatt ,  Anthony Minervini ,  Robert Swensen ,  Andrew J. Neuhalfen ,  Andrew W. S. Elliott

IPC: H02H100

CPC classification number: H01T4/10 ,  H01C7/006 ,  H01C7/028 ,  H01C7/1013 ,  H01C7/12 ,  H01C17/08 ,  H01H69/022 ,  H01H85/0411 ,  H01H85/046 ,  H01H85/11 ,  H01H2085/0414 ,  H01T4/08

Abstract: The thin film, electrical device is an subminiature overvoltage circuit protection device in a surface mountable configuration for use in printed circuit board or thick film hybrid circuit technology. The surface mountable device (SMD) is designed to protect against electrostatic discharge (ESD) damage to electronic components. The circuit protection device comprises three material subassemblies. The first subassembly generally includes a substrate carrier, electrodes, and terminal pads for connecting the protection device 60 to a PC board. The second subassembly includes a voltage variable polymer material with nonlinear resistance characteristics, and the third subassembly includes a cover coat for protecting other elements of the circuit protection device. The devices of the present invention employ various electrode configurations and profiles to control the electrical field created between the electrodes and increase the active area of the electrodes in contact with the voltage variable material to enhance the electrical characteristics of the device.

Abstract translation: 薄膜电气装置是用于印刷电路板或厚膜混合电路技术的表面可安装配置的超小型过电压电路保护装置。 表面贴装设备（SMD）设计用于防止电子元件的静电放电（ESD）损坏。 电路保护装置包括三个材料组件。 第一子组件通常包括用于将保护装置60连接到PC板的衬底载体，电极和端子衬垫。 第二子组件包括具有非线性电阻特性的电压可变聚合物材料，第三子组件包括用于保护电路保护装置的其它元件的覆盖层。 本发明的器件采用各种电极结构和轮廓来控制在电极之间产生的电场，并增加与电压可变材料接触的电极的有效面积，以增强器件的电气特性。