公开(公告)号：US5232463A

公开(公告)日：1993-08-03

申请号：US946723

申请日：1992-09-18

申请人： Lyubomir Micic ,  Gunter Gartlein ,  Eberhard Schmitt ,  Axel Muller ,  Egon Seng ,  Siegfried Spindler

发明人： Lyubomir Micic ,  Gunter Gartlein ,  Eberhard Schmitt ,  Axel Muller ,  Egon Seng ,  Siegfried Spindler

IPC分类号： H01L21/48 ,  H01L23/04 ,  H01L23/24 ,  H01L23/49

CPC分类号： H01L24/35 ,  H01L21/4885 ,  H01L23/041 ,  H01L23/24 ,  H01L24/36 ,  H01L24/41 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/41 ,  Y10T29/49171 ,  Y10T29/51

摘要： An apparatus for manufacturing a semiconductor device having two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and having one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between the sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can. The manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).

摘要翻译： 一种用于制造半导体器件的装置，其具有位于同一轴线上的两个引线（3），预制塑料罐（1），其填充有塑料化合物并且其中一个引线通过其底部（1a），并且预制 模具（4）安装在引线（3）的彼此面对的内端（60,70）的侧面之间，引线插入并具有偏移在罐内。 引线的制造开始于从卷轴（39）展开的导线（30），其穿过未分离的制造阶段的主要部分，并且仅在安装罐（1）之后被分离成单独的半导体器件， 。

公开(公告)号：US5023702A

公开(公告)日：1991-06-11

申请号：US399667

申请日：1989-08-04

申请人： Lyubomir Micic ,  Gunter Gartlein ,  Eberhard Schmitt ,  Axel Muller ,  Egon Seng ,  Siegfried Spindler

发明人： Lyubomir Micic ,  Gunter Gartlein ,  Eberhard Schmitt ,  Axel Muller ,  Egon Seng ,  Siegfried Spindler

IPC分类号： H01L21/56 ,  H01L21/48 ,  H01L21/50 ,  H01L23/04 ,  H01L23/24 ,  H01L23/28 ,  H01L23/49

CPC分类号： H01L24/01 ,  H01L21/4885 ,  H01L23/041 ,  H01L23/24 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082

摘要： This semiconductor device has two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and has one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between those sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can.In the manufacturing method the manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).

摘要翻译： 该半导体器件具有位于同一轴线上的两根引线（3），一个装有塑料化合物的预制塑料罐（1），其中一根引线通过其底部（1a），一个预制模具（4） 连接在彼此面对的引线（3）的内端（60,70）的两侧之间，引线插入并具有位于罐内的偏移。 在制造方法中，引线的制造开始于从卷轴（39）展开的导线（30），其穿过大部分未分离的制造阶段，并且仅在安装之后分离成各个半导体器件 罐（1）。

公开(公告)号：US5166098A

公开(公告)日：1992-11-24

申请号：US652967

申请日：1991-03-11

申请人： Lyubomir Micic ,  Gunter Gartlein ,  Eberhard Schmitt ,  Axel Muller ,  Egon Seng ,  Siegfried Spindler

发明人： Lyubomir Micic ,  Gunter Gartlein ,  Eberhard Schmitt ,  Axel Muller ,  Egon Seng ,  Siegfried Spindler

IPC分类号： H01L21/48 ,  H01L23/04 ,  H01L23/24 ,  H01L23/49

CPC分类号： H01L24/01 ,  H01L21/4885 ,  H01L23/041 ,  H01L23/24 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/49171

摘要： This semiconductor device has two leads (3) lying in the same axis, a prefabricated plastic can (1) which is filled with a plastic compound and has one of the leads passed through its bottom (1a), and a prefabricated die (4) attached between those sides of the inner ends (60, 70) of the leads (3) facing each other, the leads being inserted into, and having an offset within, the can. The manufacture of the leads starts with a wire (30) which unwinds from a spool (39), passes through a major part of the manufacturing stages unseparated, and is separated into the individual semiconductor devices only after the mounting of the cans (1).

摘要翻译： 该半导体器件具有位于同一轴线上的两根引线（3），一个装有塑料化合物的预制塑料罐（1），其中一根引线通过其底部（1a），一个预制模具（4） 连接在彼此面对的引线（3）的内端（60,70）的两侧之间，引线插入并具有位于罐内的偏移。 引线的制造开始于从卷轴（39）展开的导线（30），其穿过未分离的制造阶段的主要部分，并且仅在安装罐（1）之后被分离成单独的半导体器件， 。