公开(公告)号：US06793759B2

公开(公告)日：2004-09-21

申请号：US09973498

申请日：2001-10-09

Applicant: Manoj Kumar Chaudhury ,  Andrew James Goodwin ,  Yeong Joo Lee ,  Bhukandas Parbhoo

Inventor： Manoj Kumar Chaudhury ,  Andrew James Goodwin ,  Yeong Joo Lee ,  Bhukandas Parbhoo

IPC: B32B3112

CPC classification number: H01L24/83 ,  C09J5/02 ,  C09J2400/226 ,  C09J2483/006 ,  H01L21/481 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30107 ,  H05K3/305 ,  H05K3/381 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semiconductor.

Abstract translation: 用于产生粘合的方法包括等离子体处理两个基板，然后接触基板。 该方法可用于各种干燥表面。 该方法用于粘附非粘附表面，例如具有陶瓷或半导体的固化的硅氧烷。