公开(公告)号：US07887665B2

公开(公告)日：2011-02-15

申请号：US10532815

申请日：2003-10-27

申请人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

发明人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

IPC分类号： B32B15/00

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L2221/68327 ,  H01L2221/68336

摘要： An adhesive sheet (S) is expanded by expanding means (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by expansion maintaining means (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W) after the dicing to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance to cause chipping or microcracks in the edges.

摘要翻译： 粘合片（S）通过扩张装置（20）膨胀，板状制品（W）在切割板状制品（W）之后安装到框架（F）上以增加单个芯片之间的间隔（T ），通过膨胀保持机构（10）保持粘合片（S）的膨胀状态，使得板状制品（W）能够与框架（F）一起以芯片之间的间隔 （T），从而防止相邻的切屑（T）在输送过程中相互干扰。 这样，切片后的板状物（W）与框架（F）一起被输送，相邻的切屑（T）的边缘在输送过程中通过振动而相互接触，从而引起切屑或微裂纹 边缘。

公开(公告)号：US07886798B2

公开(公告)日：2011-02-15

申请号：US11962319

申请日：2007-12-21

申请人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

发明人： Yuichi Kubo ,  Masateru Osada ,  Masayuki Azuma ,  Yasuyuki Sakaya ,  Yuusuke Arai ,  Tomohiro Tamaki

IPC分类号： B32B15/00

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T156/1702

摘要： An adhesive sheet (S) is expanded by an expanding mechanism (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by an expansion maintaining device (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W), after the dicing, to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance, thereby avoiding the causing of chipping or microcracks in the edges.

摘要翻译： 粘合片（S）通过扩张机构（20）膨胀，板状制品（W）在切割板状制品（W）之后安装到框架（F）上以增加单个芯片之间的间隔 T），通过膨胀维持装置（10）保持粘合片（S）的膨胀状态，使得板状制品（W）能够与框架（F）一起以 保持芯片（T），从而防止相邻的芯片（T）在传送期间相互干扰。 这样，在切割之后，板状物（W）能够与框架（F）一起被输送，相邻的切屑（T）的边缘在输送过程中通过振动而相互接触，从而避免了引起 在边缘处有碎裂或微裂纹。

公开(公告)号：US20060005911A1

公开(公告)日：2006-01-12

申请号：US10532815

申请日：2003-10-27

申请人： Yuichi Kubo ,  Masateru Osada ,  Yuusuke Arai ,  Tomohiro Tamaki

发明人： Yuichi Kubo ,  Masateru Osada ,  Yuusuke Arai ,  Tomohiro Tamaki

IPC分类号： B32B37/00 ,  B29C65/00

CPC分类号： H01L21/6836 ,  H01L21/67132 ,  H01L2221/68327 ,  H01L2221/68336

摘要： An adhesive sheet (S) is expanded by expanding means (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by expansion maintaining means (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W) after the dicing to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance to cause chipping or microcracks in the edges.

摘要翻译： 粘合片（S）通过扩张装置（20）膨胀，板状制品（W）在切割板状制品（W）之后安装到框架（F）上以增加单个芯片之间的间隔（T ），通过膨胀保持机构（10）保持粘合片（S）的膨胀状态，使得板状制品（W）能够与框架（F）一起以芯片之间的间隔 （T），从而防止相邻的切屑（T）在输送过程中相互干扰。 这样，切片后的板状物（W）与框架（F）一起被输送，相邻的切屑（T）的边缘在输送过程中通过振动而相互接触，从而引起切屑或微裂纹 边缘。

公开(公告)号：US06354912B1

公开(公告)日：2002-03-12

申请号：US09203611

申请日：1998-12-02

申请人： Masateru Osada ,  Masayuki Azuma ,  Hirofumi Shimoda ,  Felix Cohen

发明人： Masateru Osada ,  Masayuki Azuma ,  Hirofumi Shimoda ,  Felix Cohen

IPC分类号： B28D104

CPC分类号： B28D5/029 ,  B28D5/023

摘要： Two blades are arranged oppositely at a predetermined interval along the Y-axis. The two blades cut a wafer along two cutting lines at the same time while the two blades are moving along the X-axis. After the wafer is cut along these two cutting lines, the two blades are moved along the Y-axis by one pitch of the cutting lines so that the wafer can be cut along the next two cutting lines. This action is repeated to cut the wafer along the cutting lines continuously. This wafer cutting method can hold the movement of the blades along the X-axis to a minimum because of the oppositely-arranged two blades. Consequently, the wafer can be cut in a short period of time.

摘要翻译： 两个叶片沿着Y轴以预定的间隔相对布置。 两个刀片同时沿着两条切割线切割晶片，同时两个刀片沿X轴移动。 在沿着这两条切割线切割晶片之后，两个刀片沿着Y轴移动一个切割线的间距，使得可以沿着接下来的两条切割线切割晶片。 重复该操作以连续切割切割线上的晶片。 这种晶片切割方法可以将刀片沿着X轴移动到最小限度，因为相对布置的两个刀片。 因此，可以在短时间内切割晶片。

公开(公告)号：US20080105383A1

公开(公告)日：2008-05-08

申请号：US11962319

申请日：2007-12-21

申请人： Yuichi KUBO ,  Masateru OSADA ,  Masayuki AZUMA ,  Yasuyuki SAKAYA ,  Yuusuke ARAI ,  Tomohiro TAMAKI

发明人： Yuichi KUBO ,  Masateru OSADA ,  Masayuki AZUMA ,  Yasuyuki SAKAYA ,  Yuusuke ARAI ,  Tomohiro TAMAKI

IPC分类号： B32B38/18

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  Y10T156/1702

摘要： An adhesive sheet (S) is expanded by an expanding mechanism (20) with a plate-like article (W) being mounted to a frame (F) after dicing of the plate-like article (W) to increase spacings between individual chips (T), an expanded state of the adhesive sheet (S) is maintained by an expansion maintaining device (10), so that the plate-like article (W) is able to be conveyed together with the frame (F) with the spacings between the chips (T) being maintained, thereby preventing adjacent chips (T) from interfering with each other during the conveyance. This allows the plate-like article (W), after the dicing, to be conveyed together with the frame (F) without edges of the adjacent chips (T) coming into contact with each other by vibration during the conveyance, thereby avoiding the causing of chipping or microcracks in the edges.

摘要翻译： 粘合片（S）通过扩张机构（20）膨胀，板状制品（W）在切割板状制品（W）之后安装到框架（F）上以增加单个芯片之间的间隔 T），通过膨胀维持装置（10）保持粘合片（S）的膨胀状态，使得板状制品（W）能够与框架（F）一起以 保持芯片（T），从而防止相邻的芯片（T）在传送期间相互干扰。 这样，在切割之后，板状物（W）能够与框架（F）一起被输送，相邻的切屑（T）的边缘在输送过程中通过振动而相互接触，从而避免了引起 在边缘处有碎裂或微裂纹。