公开(公告)号：US08300862B2

公开(公告)日：2012-10-30

申请号：US11857283

申请日：2007-09-18

Applicant: James Newton ,  Mark Seel ,  Matthias Müllenborn ,  Per Kokholm Sørensen ,  Garry Richardson

Inventor： James Newton ,  Mark Seel ,  Matthias Müllenborn ,  Per Kokholm Sørensen ,  Garry Richardson

IPC: H04R25/00

CPC classification number: H04R25/70

Abstract: Provided herein is a device for wirelessly communicating with hearing assistance devices. According to various embodiments, the device includes a first interface for communicating with a programmer and a second interface for wirelessly communicating with a hearing assistance device. The second interface is adapted to receive a plurality of communication modules. Each of the modules is adapted for communication with at least one specific type of hearing assistance device. The device includes a housing for the first interface, the second interface, and electrical connections between the interfaces. The housing adapted to be worn around the neck of a person wearing the hearing assistance device.

Abstract translation: 本文提供了一种用于与助听器无线通信的设备。 根据各种实施例，该设备包括用于与编程器通信的第一接口和用于与助听器设备无线通信的第二接口。 第二接口适于接收多个通信模块。 每个模块适于与至少一种特定类型的助听装置进行通信。 该装置包括用于第一接口的壳体，第二接口以及接口之间的电连接。 该房屋适于戴在听力辅助装置的人的颈部周围。

公开(公告)号：US07792315B2

公开(公告)日：2010-09-07

申请号：US11605095

申请日：2006-11-28

Applicant: Matthias Müllenborn ,  Aart Z. van Halteren

Inventor： Matthias Müllenborn ,  Aart Z. van Halteren

IPC: H04R25/00

CPC classification number: H04R19/005 ,  B33Y80/00 ,  H04R25/407 ,  H04R25/48 ,  H04R25/556 ,  H04R25/604 ,  H04R2225/61

Abstract: A silicon-based transducer assembly coupled to a movable structure in a hearing instrument. The transducer assembly includes at least one microphone chip and an ASIC having multiple integrated components such as any combination of a DSP, an A/D converter, an amplifier, a filter, or a wireless interface. The movable structure may be a battery access door, a volume dial, a switch, or a touch pad. A protection strip can be disposed across the battery access door to prevent debris from clogging the silicon-based transducer assembly. The transducer assembly may also include an array of microphone chips to achieve adaptive beam steering or directionality. When equipped with a wireless interface, the hearing instrument wirelessly communicates with another hearing instrument or with a network.

Abstract translation: 耦合到听力仪器中的可移动结构的硅基换能器组件。 换能器组件包括至少一个麦克风芯片和具有多个集成组件的ASIC，例如DSP，A / D转换器，放大器，滤波器或无线接口的任何组合。 可移动结构可以是电池存取门，音量拨盘，开关或触摸板。 保护带可以跨越电池检修门设置，以防止碎屑堵塞硅基换能器组件。 传感器组件还可以包括麦克风芯片的阵列，以实现自适应波束控制或方向性。 当配备无线接口时，听力仪器与另一个听力仪器或网络无线通信。

公开(公告)号：US07466835B2

公开(公告)日：2008-12-16

申请号：US10802803

申请日：2004-03-18

Applicant: Lars Jørn Stenberg ,  Matthias Müllenborn ,  Igor Mucha

Inventor： Lars Jørn Stenberg ,  Matthias Müllenborn ,  Igor Mucha

IPC: H04R25/00

CPC classification number: H04R19/04 ,  H04R19/005 ,  H04R19/016 ,  H04R25/00 ,  H04R2225/49 ,  H04R2430/21

Abstract: The present invention provides a miniature MEMS microphone comprising a single-ended transducer element connected to an amplifier providing a differential electrical output at terminals arranged at a substantially plane exterior surface. The differential or balanced output signal provides a miniature microphone exhibiting a high dynamic range and a reduced susceptibility to EMI. The microphone is adapted for surface mounting thus the extra output terminal required is still suitable for low cost mass production. In preferred embodiments the transducer element and amplifier are silicon-based. The microphone may have a plurality of separate single-ended transducer elements connected to separate amplifiers providing separate differential outputs. The microphones according to the invention are advantageous for applications within for example hearing aids and mobile equipment.

Abstract translation: 本发明提供了一种微型MEMS麦克风，其包括连接到放大器的单端换能器元件，该放大器在布置在基本上平面的外表面处的端子处提供差分电输出。 差分或平衡输出信号提供了一个显示高动态范围和降低的EMI敏感性的微型麦克风。 麦克风适用于表面安装，因此所需的额外输出端子仍然适用于低成本批量生产。 在优选实施例中，换能器元件和放大器是基于硅的。 麦克风可以具有连接到提供单独的差分输出的分离的放大器的多个单独的单端换能器元件。 根据本发明的麦克风对于例如助听器和移动设备中的应用是有利的。

公开(公告)号：USRE42346E1

公开(公告)日：2011-05-10

申请号：US10193055

申请日：2002-07-11

Applicant: Pirmin Rombach ,  Matthias Müllenborn ,  Ole Hansen ,  Matthias Heschel ,  Siebe Bouwstra ,  Maja Amskov Gravad ,  Henrick Laurids Hvims ,  Jørgen B. Elmer, legal representative

Inventor： Pirmin Rombach ,  Matthias Müllenborn ,  Ole Hansen ,  Matthias Heschel ,  Siebe Bouwstra ,  Maja Amskov Gravad ,  Henrick Laurids Hvims

IPC: H04R25/00

CPC classification number: H04R19/005 ,  H04R19/04

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

Abstract translation: 一种固态硅基电容式麦克风，包括硅转换器芯片（1）。 换能器芯片包括背板（13）和隔板（12），隔膜（12）基本上彼此平行地布置有间隙小的气隙，从而形成电容器。 响应于入射声，隔膜（12）可相对于背板（13）移动。 集成电子电路芯片（3）或ASIC电耦合到换能器芯片（1）。 中间层（2）将换能器芯片（1）与中间层（2）和集成电子电路芯片（3）的第一侧上的换能器芯片（1）固定到集成电子电路芯片（3）上， 所述中间层（2）的与所述第一侧相对的第二侧。 中间层（2）在与ASIC相同的侧面上具有声音入口（4），从而提供对隔膜的声音的访问。

公开(公告)号：US07142682B2

公开(公告)日：2006-11-28

申请号：US10326208

申请日：2002-12-20

Applicant: Matthias Müllenborn ,  Aart Z. van Halteren

Inventor： Matthias Müllenborn ,  Aart Z. van Halteren

IPC: H04R25/00

CPC classification number: H04R19/005 ,  B33Y80/00 ,  H04R25/407 ,  H04R25/48 ,  H04R25/556 ,  H04R25/604 ,  H04R2225/61

Abstract: A silicon-based transducer assembly coupled to a movable structure in a hearing instrument. The transducer assembly includes at least one microphone chip and an ASIC having multiple integrated components such as any combination of a DSP, an A/D converter, an amplifier, a filter, or a wireless interface. The movable structure may be a battery access door, a volume dial, a switch, or a touch pad. A protection strip can be disposed across the battery access door to prevent debris from clogging the silicon-based transducer assembly. The transducer assembly may also include an array of microphone chips to achieve adaptive beam steering or directionality. When equipped with a wireless interface, the hearing instrument wirelessly communicates with another hearing instrument or with a network.

Abstract translation: 耦合到听力仪器中的可移动结构的硅基换能器组件。 换能器组件包括至少一个麦克风芯片和具有多个集成组件的ASIC，例如DSP，A / D转换器，放大器，滤波器或无线接口的任何组合。 可移动结构可以是电池存取门，音量拨盘，开关或触摸板。 保护带可以跨越电池检修门设置，以防止碎屑堵塞硅基换能器组件。 传感器组件还可以包括麦克风芯片的阵列，以实现自适应波束控制或方向性。 当配备无线接口时，听力仪器与另一个听力仪器或网络无线通信。

公开(公告)号：US06622368B1

公开(公告)日：2003-09-23

申请号：US09719208

申请日：2001-01-05

Applicant: Matthias Müllenborn ,  Pirmin Rombach

Inventor： Matthias Müllenborn ,  Pirmin Rombach

IPC: H04R3100

CPC classification number: H04R31/003 ,  Y10T29/43 ,  Y10T29/49005 ,  Y10T29/49007

Abstract: A method of manufacturing a transducer of the type having a diaphragm (11) with a predetermined tension. After the transducer has been manufactured with its basic structure the diaphragm is adjusted to have a predetermined tension, which is preferably low in order to obtain a high sensitivity. Two embodiments are disclosed. One embodiment includes heating the transducer to a temperature above the glass transition temperature of the material (12, 14) retaining the diaphragm. Another embodiment includes measuring the actual tension of the diaphragm, which can be used to calculate an adjustment of the thickness of the diaphragm resulting in the desired tension.

Abstract translation: 一种制造具有预定张力的隔膜（11）的类型的换能器的方法。 在传感器已经被制造成其基本结构之后，将膜片调整到具有预定的张力，其优选地低以获得高灵敏度。 公开了两个实施例。 一个实施例包括将换能器加热到高于保持隔膜的材料（12,14）的玻璃化转变温度的温度。 另一个实施例包括测量隔膜的实际张力，其可用于计算隔膜厚度的调节，导致所需张力。

公开(公告)号：US08300864B2

公开(公告)日：2012-10-30

申请号：US12474860

申请日：2009-05-29

Applicant: Matthias Müllenborn ,  Morlen Kjær Johansen

Inventor： Matthias Müllenborn ,  Morlen Kjær Johansen

IPC: H04R25/00

CPC classification number: H04R25/554 ,  H04M1/72591 ,  Y02D70/144 ,  Y02D70/166

Abstract: The invention relates to wireless communication between listening devices, in particular to a hearing aid system comprising a hearing instrument and a telephone apparatus. The invention further relates to a method of receiving a telephone call and to the use of a hearing aid system. The object of the present invention is to provide a relatively simple, reliable scheme for receiving a telephone call in a hearing instrument. The problem is solved in that the telephone apparatus comprises a transmitter for establishing a short range digital, low-power link to a hearing instrument comprising a corresponding receiver. This has the advantage of providing a relatively simple and low power solution, where at least the incoming part of a telephone conversation is wirelessly transmitted via a low-power link. The invention may e.g. be used for the communication between a hearing instrument and a telephone, where a standard wireless interface for local connectivity, such as a Bluetooth interface, is not technically feasible or not available for other reasons.

Abstract translation: 本发明涉及听音装置之间的无线通信，特别涉及包括听力仪器和电话设备的助听器系统。 本发明还涉及一种接收电话呼叫和使用助听器系统的方法。 本发明的目的是提供一种用于在听力仪器中接收电话呼叫的相对简单且可靠的方案。 解决的问题在于，电话设备包括用于建立到包括对应接收机的听力仪器的短距离数字低功率链路的发射机。 这具有提供相对简单和低功率解决方案的优点，其中至少电话会话的进入部分经由低功率链路无线传输。 本发明可以例如 用于听力仪器和电话之间的通信，其中用于本地连接的标准无线接口（例如蓝牙接口）在技术上不可行或由于其他原因不可用。

公开(公告)号：USRE42347E1

公开(公告)日：2011-05-10

申请号：US11903207

申请日：2007-09-20

Applicant: Pirmin Rombach ,  Matthias Müllenborn ,  Ole Hansen ,  Matthias Heschel ,  Siebe Bouwstra ,  Maja Amskov Gravad ,  Henrik Laurids Hvims ,  Jorgen B. Elmer, legal representative

Inventor： Pirmin Rombach ,  Matthias Müllenborn ,  Ole Hansen ,  Matthias Heschel ,  Siebe Bouwstra ,  Maja Amskov Gravad ,  Henrik Laurids Hvims

IPC: H04R25/00

CPC classification number: H04R19/005 ,  H04R19/04

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

公开(公告)号：US07592964B2

公开(公告)日：2009-09-22

申请号：US11600743

申请日：2006-11-17

Applicant: Matthias Müllenborn ,  Frank Engel Rasmussen ,  Mohamad Essabar ,  Mogens Øllgaard ,  Christian Nielsen

Inventor： Matthias Müllenborn ,  Frank Engel Rasmussen ,  Mohamad Essabar ,  Mogens Øllgaard ,  Christian Nielsen

IPC: H01Q7/08

CPC classification number: H01Q5/40 ,  B33Y80/00 ,  H01F27/292 ,  H01F27/362 ,  H01F38/14 ,  H01Q1/273 ,  H01Q1/44 ,  H01Q1/52 ,  H01Q7/08 ,  H04R2225/51

Abstract: The present invention relates to a surface mounted coil (200) for wireless communication. The coil (200) comprises a wire (202) wounded about a core (204) thereby establishing a plurality of windings and having its ends terminated on mounting sections (208) at each end of the core (204). The coil (200) further comprises a shielding layer (212, 300) wound about a central part of the core (204) thereby covering said windings. The shielding layer (212, 300) comprises a shielding pattern and a contact section (214) for connecting to a ground level and to the shielding pattern.

Abstract translation: 本发明涉及一种用于无线通信的表面安装线圈（200）。 线圈（200）包括围绕铁心（204）缠绕的线（202），由此建立多个绕组，并且其端部终止于芯部（204）的每个端部处的安装部分（208）上。 线圈（200）还包括缠绕在芯（204）的中心部分上的遮蔽层（212,300），从而覆盖所述绕组。 屏蔽层（212,300）包括屏蔽图案和用于连接到地平面和屏蔽图案的接触部分（214）。