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    Micromechanical microphone
    1.
    发明授权
    Micromechanical microphone 失效
    微机麦克风

    公开(公告)号：US6075867A

    公开(公告)日：2000-06-13

    申请号：US981714

    申请日：1998-03-19

    申请人： Jesper Bay ,  Siebe Bouwstra ,  Ole Hansen

    发明人： Jesper Bay ,  Siebe Bouwstra ,  Ole Hansen

    IPC分类号： H04R1/22 ,  H04R19/00 ,  H04R19/04 ,  H04R25/00

    CPC分类号： H04R19/00

    摘要： A Micromechanical Microphone is formed with a housing and a transducer therein. The housing has a sound inlet on one side of the transducer and a pressure compensation hole on the opposite side. A sealing diaphragm is placed on each side of the transducer to seal it against humidity, dust and dirt. The transducer may be a capacitive transducer with an external bias or an electret based transducer. The microphone is useful in small devices such as hearing aides.

    摘要翻译： PCT No.PCT / DK96 / 00276 Sec。 371日期：1998年3月19日 102（e）1998年3月19日PCT PCT 1996年6月21日PCT公布。 第WO97 / 01258号公报 日期1997年1月9日Micromechanical麦克风在其中形成有壳体和换能器。 外壳在换能器一侧有一个声音入口，另一侧有一个压力补偿孔。 在传感器的每一侧放置一个密封隔膜以将其密封以防止湿度，灰尘和污垢。 换能器可以是具有外部偏置或基于驻极体的换能器的电容式换能器。 麦克风在小型设备（如助听器）中非常有用。

    Solid state silicon-based condenser microphone
    2.
    再颁专利
    Solid state silicon-based condenser microphone 有权
    固态硅基电容麦克风

    公开(公告)号：USRE42346E1

    公开(公告)日：2011-05-10

    申请号：US10193055

    申请日：2002-07-11

    申请人： Pirmin Rombach ,  Matthias Müllenborn ,  Ole Hansen ,  Matthias Heschel ,  Siebe Bouwstra ,  Maja Amskov Gravad ,  Henrick Laurids Hvims ,  Jørgen B. Elmer, legal representative

    发明人： Pirmin Rombach ,  Matthias Müllenborn ,  Ole Hansen ,  Matthias Heschel ,  Siebe Bouwstra ,  Maja Amskov Gravad ,  Henrick Laurids Hvims

    IPC分类号： H04R25/00

    CPC分类号： H04R19/005 ,  H04R19/04

    摘要： A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

    摘要翻译： 一种固态硅基电容式麦克风，包括硅转换器芯片（1）。 换能器芯片包括背板（13）和隔板（12），隔膜（12）基本上彼此平行地布置有间隙小的气隙，从而形成电容器。 响应于入射声，隔膜（12）可相对于背板（13）移动。 集成电子电路芯片（3）或ASIC电耦合到换能器芯片（1）。 中间层（2）将换能器芯片（1）与中间层（2）和集成电子电路芯片（3）的第一侧上的换能器芯片（1）固定到集成电子电路芯片（3）上， 所述中间层（2）的与所述第一侧相对的第二侧。 中间层（2）在与ASIC相同的侧面上具有声音入口（4），从而提供对隔膜的声音的访问。

    Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, systems and related methods
    3.
    发明授权
    Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, systems and related methods 有权
    微机电系统（MEMS）可变电容器装置，系统及相关方法

    公开(公告)号：US07586164B2

    公开(公告)日：2009-09-08

    申请号：US11313300

    申请日：2005-12-20

    申请人： Francois-Xavier Musalem ,  Siebe Bouwstra ,  Arthur S. Morris

    发明人： Francois-Xavier Musalem ,  Siebe Bouwstra ,  Arthur S. Morris

    IPC分类号： H01G5/01

    CPC分类号： H01G5/16 ,  H01G5/04 ,  H01G5/08 ,  H01G5/10 ,  H01G5/18 ,  H01G5/38 ,  H01P1/127

    摘要： Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided. According to one embodiment, a method for varying the capacitance of two conductive plates is provided. The method can include providing a micro-electro-mechanical system (MEMS) variable capacitor. The variable capacitor can include first and second actuation electrodes wherein one of the actuation electrodes is movable with respect to the other actuation electrode when a voltage is applied across the first and second actuation electrodes. Further, the variable capacitor can include first and second capacitive electrodes. The method can include applying a voltage to the first and second actuation electrodes for movement of at least one of the capacitive electrodes in a substantially straight direction with respect to the other capacitive electrode upon application of voltage across the first and second actuation electrodes to change the capacitance between the first and second capacitive electrodes.

    摘要翻译： 提供微机电系统（MEMS）可变电容器装置，系统及相关方法。 根据一个实施例，提供了一种用于改变两个导电板的电容的方法。 该方法可以包括提供微机电系统（MEMS）可变电容器。 可变电容器可以包括第一和第二致动电极，其中当跨越第一和第二致动电极施加电压时，其中一个致动电极可相对于另一个致动电极移动。 此外，可变电容器可以包括第一和第二电容电极。 该方法可以包括将电压施加到第一和第二致动电极，用于在施加电压跨越第一和第二致动电极时使电容电极中的至少一个在相对于另一个电容电极的基本上直的方向上移动，以改变 第一和第二电容电极之间的电容。

    Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, systems and related methods
    4.
    发明授权
    Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, systems and related methods 有权
    微机电系统（MEMS）可变电容器装置，系统及相关方法

    公开(公告)号：US07388316B2

    公开(公告)日：2008-06-17

    申请号：US11122379

    申请日：2005-05-05

    申请人： Francois-Xavier Musalem ,  Arthur S. Morris, III ,  John Richard Gilbert ,  Siebe Bouwstra ,  Randy J. Richards

    发明人： Francois-Xavier Musalem ,  Arthur S. Morris, III ,  John Richard Gilbert ,  Siebe Bouwstra ,  Randy J. Richards

    IPC分类号： H01G5/01

    CPC分类号： H01G5/16 ,  H01G5/04 ,  H01G5/08 ,  H01G5/10 ,  H01G5/18 ,  H01G5/38 ,  H01P1/127

    摘要： Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided. According to one embodiment, a method for varying the capacitance of two conductive plates is provided. The method can include providing a micro-electro-mechanical system (MEMS) variable capacitor. The variable capacitor can include first and second actuation electrodes wherein one of the actuation electrodes is movable with respect to the other actuation electrode when a voltage is applied across the first and second actuation electrodes. Further, the variable capacitor can include first and second capacitive electrodes. The method can include applying a voltage to the first and second actuation electrodes for movement of at least one of the capacitive electrodes in a substantially straight direction with respect to the other capacitive electrode upon application of voltage across the first and second actuation electrodes to change the capacitance between the first and second capacitive electrodes.

    摘要翻译： 提供微机电系统（MEMS）可变电容器装置，系统及相关方法。 根据一个实施例，提供了一种用于改变两个导电板的电容的方法。 该方法可以包括提供微机电系统（MEMS）可变电容器。 可变电容器可以包括第一和第二致动电极，其中当跨越第一和第二致动电极施加电压时，其中一个致动电极可相对于另一个致动电极移动。 此外，可变电容器可以包括第一和第二电容电极。 该方法可以包括将电压施加到第一和第二致动电极，用于在施加电压跨越第一和第二致动电极时使电容电极中的至少一个在相对于另一个电容电极的基本上直的方向上移动，以改变 第一和第二电容电极之间的电容。

    Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, systems and related methods
    7.
    发明申请
    Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, systems and related methods 有权

    公开(公告)号：US20060291135A1

    公开(公告)日：2006-12-28

    申请号：US11313300

    申请日：2005-12-20

    申请人： Francois-Xavier Musalem ,  Siebe Bouwstra ,  Arthur Morris

    发明人： Francois-Xavier Musalem ,  Siebe Bouwstra ,  Arthur Morris

    IPC分类号： H01G7/00

    CPC分类号： H01G5/16 ,  H01G5/04 ,  H01G5/08 ,  H01G5/10 ,  H01G5/18 ,  H01G5/38 ,  H01P1/127

    摘要： Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided. According to one embodiment, a method for varying the capacitance of two conductive plates is provided. The method can include providing a micro-electro-mechanical system (MEMS) variable capacitor. The variable capacitor can include first and second actuation electrodes wherein one of the actuation electrodes is movable with respect to the other actuation electrode when a voltage is applied across the first and second actuation electrodes. Further, the variable capacitor can include first and second capacitive electrodes. The method can include applying a voltage to the first and second actuation electrodes for movement of at least one of the capacitive electrodes in a substantially straight direction with respect to the other capacitive electrode upon application of voltage across the first and second actuation electrodes to change the capacitance between the first and second capacitive electrodes.

    Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, systems and related methods
    8.
    发明申请
    Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, systems and related methods 有权
    微机电系统（MEMS）可变电容器装置，系统及相关方法

    公开(公告)号：US20050224916A1

    公开(公告)日：2005-10-13

    申请号：US11122379

    申请日：2005-05-05

    申请人： Francois-Xavier Musalem ,  Arthur Morris ,  John Gilbert ,  Siebe Bouwstra ,  Randy Richards

    发明人： Francois-Xavier Musalem ,  Arthur Morris ,  John Gilbert ,  Siebe Bouwstra ,  Randy Richards

    IPC分类号： A63H13/16 ,  H01G5/01 ,  H01G5/011 ,  H01G5/04 ,  H01G5/08 ,  H01G5/10 ,  H01G5/16 ,  H01G5/18 ,  H01G5/38 ,  H01L21/20 ,  H01L29/93 ,  H01P1/10

    CPC分类号： H01G5/16 ,  H01G5/04 ,  H01G5/08 ,  H01G5/10 ,  H01G5/18 ,  H01G5/38 ,  H01P1/127

    摘要： Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided. According to one embodiment, a method for varying the capacitance of two conductive plates is provided. The method can include providing a micro-electro-mechanical system (MEMS) variable capacitor. The variable capacitor can include first and second actuation electrodes wherein one of the actuation electrodes is movable with respect to the other actuation electrode when a voltage is applied across the first and second actuation electrodes. Further, the variable capacitor can include first and second capacitive electrodes. The method can include applying a voltage to the first and second actuation electrodes for movement of at least one of the capacitive electrodes in a substantially straight direction with respect to the other capacitive electrode upon application of voltage across the first and second actuation electrodes to change the capacitance between the first and second capacitive electrodes.

    摘要翻译： 提供微机电系统（MEMS）可变电容器装置，系统及相关方法。 根据一个实施例，提供了一种用于改变两个导电板的电容的方法。 该方法可以包括提供微机电系统（MEMS）可变电容器。 可变电容器可以包括第一和第二致动电极，其中当跨越第一和第二致动电极施加电压时，其中一个致动电极可相对于另一个致动电极移动。 此外，可变电容器可以包括第一和第二电容电极。 该方法可以包括将电压施加到第一和第二致动电极，用于在施加电压跨越第一和第二致动电极时使电容电极中的至少一个在相对于另一个电容电极的基本上直的方向上移动，以改变 第一和第二电容电极之间的电容。

    Solid state silicon-based condenser microphone
    9.
    发明授权
    Solid state silicon-based condenser microphone 有权
    固态硅基电容麦克风

    公开(公告)号：US6088463A

    公开(公告)日：2000-07-11

    申请号：US182668

    申请日：1998-10-30

    申请人： Pirmin Rombach ,  Matthias Mullenborn ,  Ole Hansen ,  Matthias Heschel ,  Siebe Bouwstra ,  Maja Amskov Gravad ,  Henrik Laurids Hvims

    发明人： Pirmin Rombach ,  Matthias Mullenborn ,  Ole Hansen ,  Matthias Heschel ,  Siebe Bouwstra ,  Maja Amskov Gravad ,  Henrik Laurids Hvims

    IPC分类号： H04R19/00 ,  H04R25/00

    CPC分类号： H04R19/005 ,  H04R19/04

    摘要： A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

    摘要翻译： 一种固态硅基电容式麦克风，包括硅转换器芯片（1）。 换能器芯片包括背板（13）和隔板（12），隔膜（12）基本上彼此平行地布置有间隙小的气隙，从而形成电容器。 响应于入射声，隔膜（12）可相对于背板（13）移动。 集成电子电路芯片（3）或ASIC电耦合到换能器芯片（1）。 中间层（2）将换能器芯片（1）与中间层（2）和集成电子电路芯片（3）的第一侧上的换能器芯片（1）固定到集成电子电路芯片（3）上， 所述中间层（2）的与所述第一侧相对的第二侧。 中间层（2）在与ASIC相同的侧面上具有声音入口（4），从而提供对隔膜的声音的访问。