-
公开(公告)号：US20220298617A1
公开(公告)日：2022-09-22
申请号：US17832250
申请日：2022-06-03
申请人： Micromaterials LLC
发明人： Bernard FREY , Subramanya P. HERLE
摘要： A web coating platform for depositing molten metal on flexible substrates is provided. The web coating platform can be used for manufacturing solid lithium anodes for use in energy storage devices, for example, rechargeable batteries. The coating platform can be designed for double-sided coating of a continuous flexible substrate (e.g., a copper foil) with molten lithium followed by double-sided lamination or passivation. The coating platform integrates novel coating elements unique to handling and processing molten metals. For example, some implementations of the present disclosure incorporate double-sided molten metal coating elements, which include at least one of a molten metal application assembly (e.g., kiss roller, slot-die, Meyer bar, and/or gravure roller), a primary melt pool assembly, a secondary melt pool assembly, and an engagement mechanism.
-
公开(公告)号：US20210305091A1
公开(公告)日：2021-09-30
申请号：US17345683
申请日：2021-06-11
申请人： Micromaterials LLC
发明人： He Ren , Amrita B. Mullick , Regina Freed , Mehul Naik , Uday Mitra
IPC分类号： H01L21/768
摘要： Methods of etching a metal layer and a metal-containing barrier layer to a predetermined depth are described. In some embodiments, the metal layer and metal-containing barrier layer are formed on a substrate with a first dielectric and a second dielectric thereon. The metal layer and the metal-containing barrier layer formed within a feature in the first dielectric and the second dielectric. In some embodiments, the metal layer and metal-containing barrier layer can be sequentially etched from a feature formed in a dielectric material. In some embodiments, the sidewalls of the feature formed in a dielectric material are passivated to change the adhesion properties of the dielectric material.
-
公开(公告)号：US11049695B2
公开(公告)日：2021-06-29
申请号：US16777538
申请日：2020-01-30
申请人： Micromaterials LLC
发明人： Sung Kwan Kang , Kyung-Ha Kim , Gill Lee
IPC分类号： H01J37/32 , H01L21/02 , H01L21/3065
摘要： Processing methods may be performed to form semiconductor structures that may include three-dimensional memory structures. The methods may include forming a plasma of a fluorine-containing precursor in a remote plasma region of a processing chamber. The methods may include contacting a semiconductor substrate with effluents of the plasma. The semiconductor substrate may be housed in a processing region of the processing chamber. The methods may include selectively cleaning exposed nitride materials with the effluents of the plasma. The methods may also include subsequently depositing a cap material over the cleaned nitride material. The cap material may be selectively deposited on the nitride material relative to exposed regions of a dielectric material.
-
公开(公告)号：US11037825B2
公开(公告)日：2021-06-15
申请号：US17002402
申请日：2020-08-25
申请人： Micromaterials LLC
发明人： Amrita B. Mullick , Madhur Sachan , He Ren , Swaminathan Srinivasan , Regina Freed , Uday Mitra
IPC分类号： H01L21/768 , H01L23/522 , H01L21/311
摘要： Apparatuses and methods to provide a fully self-aligned via are described. Some embodiments of the disclosure utilize a cap layer to protect an insulating layer in order to minimize bowing of the side walls during metal recess in a fully self-aligned via. The cap layer can be selectively removed, thus increasing the aspect ratio, by exposing the substrate to a hot phosphoric acid solution.
-
公开(公告)号：US10790191B2
公开(公告)日：2020-09-29
申请号：US16403946
申请日：2019-05-06
申请人： Micromaterials LLC
发明人： Amrita B. Mullick , Madhur Sachan , He Ren , Swaminathan Srinivasan , Regina Freed , Uday Mitra
IPC分类号： H01L21/768 , H01L21/311 , H01L23/522
摘要： Apparatuses and methods to provide a fully self-aligned via are described. Some embodiments of the disclosure utilize a cap layer to protect an insulating layer in order to minimize bowing of the side walls during metal recess in a fully self-aligned via. The cap layer can be selectively removed, thus increasing the aspect ratio, by exposing the substrate to a hot phosphoric acid solution.
-
公开(公告)号：US10720341B2
公开(公告)日：2020-07-21
申请号：US16182612
申请日：2018-11-07
申请人： Micromaterials, LLC
发明人： Qiwei Liang , Srinivas D. Nemani , Sean S. Kang , Adib Khan , Ellie Y. Yieh
IPC分类号： G01R31/26 , H01L21/67 , H01L21/66 , H01L21/324 , C23C16/44 , C23C16/455
摘要： A high-pressure processing system for processing a layer on a substrate includes a first chamber, a support to hold the substrate in the first chamber, a second chamber adjacent the first chamber, a foreline to remove gas from the second chamber, a vacuum processing system configured to lower a pressure within the second chamber to near vacuum, a valve assembly between the first chamber and the second chamber to isolate the pressure within the first chamber from the pressure within the second chamber, a gas delivery system configured to increase the pressure within the first chamber to at least 10 atmospheres while the first chamber is isolated from the second chamber, an exhaust system comprising an exhaust line to remove gas from the first chamber, and a common housing surrounding both the first gas delivery module and the second gas delivery module.
-
公开(公告)号：US10522404B2
公开(公告)日：2019-12-31
申请号：US16520546
申请日：2019-07-24
申请人： Micromaterials LLC
发明人： Ying Zhang , Abhijit Basu Mallick , Regina Freed , Nitin K. Ingle , Uday Mitra , Ho-yung Hwang
IPC分类号： H01L21/768 , H01L23/48 , H01L23/528 , H01L23/532
摘要： A first metallization layer comprising a set of first conductive lines that extend along a first direction on a first insulating layer on a substrate. A second insulating layer is on the first insulating layer. A second metallization layer comprises a set of second conductive lines on a third insulating layer and on the second insulating layer above the first metallization layer. The set of second conductive lines extend along a second direction that crosses the first direction at an angle. A via between the first metallization layer and the second metallization layer. The via is self-aligned along the second direction to one of the first conductive lines.
-
公开(公告)号：US20190198367A1
公开(公告)日：2019-06-27
申请号：US16292289
申请日：2019-03-04
申请人： Micromaterials, LLC
发明人： Qiwei LIANG , Srinivas D. NEMANI , Adib M. KHAN , Venkata Ravishankar KASIBHOTLA , Sultan MALIK , Sean KANG , Keith Tatseun WONG
IPC分类号： H01L21/67 , C23C16/52 , H01L21/768 , H01L21/687 , H01L21/324
摘要： A high-pressure processing system for processing a substrate includes a first chamber, a pedestal positioned within the first chamber to support the substrate, a second chamber adjacent the first chamber, a vacuum processing system configured to lower a pressure within the second chamber to near vacuum, a valve assembly between the first chamber and the second chamber to isolate the pressure within the first chamber from the pressure within the second chamber, and a gas delivery system configured to introduce a processing gas into the first chamber and to increase the pressure within the first chamber to at least 10 atmospheres while the processing gas is in the first chamber and while the first chamber is isolated from the second chamber.
-
公开(公告)号：US11597988B2
公开(公告)日：2023-03-07
申请号：US17832139
申请日：2022-06-03
申请人： Micromaterials LLC
发明人： Bernard Frey , Subramanya P. Herle
摘要： A web coating platform for depositing molten metal on flexible substrates is provided. The web coating platform can be used for manufacturing solid lithium anodes for use in energy storage devices, for example, rechargeable batteries. The coating platform can be designed for double-sided coating of a continuous flexible substrate (e.g., a copper foil) with molten lithium followed by double-sided lamination or passivation. The coating platform integrates novel coating elements unique to handling and processing molten metals. For example, some implementations of the present disclosure incorporate double-sided molten metal coating elements, which include at least one of a molten metal application assembly (e.g., kiss roller, slot-die, Meyer bar, and/or gravure roller), a primary melt pool assembly, a secondary melt pool assembly, and an engagement mechanism.
-
公开(公告)号：US20220298616A1
公开(公告)日：2022-09-22
申请号：US17832139
申请日：2022-06-03
申请人： Micromaterials LLC
发明人： Bernard FREY , Subramanya P. HERLE
摘要： A web coating platform for depositing molten metal on flexible substrates is provided. The web coating platform can be used for manufacturing solid lithium anodes for use in energy storage devices, for example, rechargeable batteries. The coating platform can be designed for double-sided coating of a continuous flexible substrate (e.g., a copper foil) with molten lithium followed by double-sided lamination or passivation. The coating platform integrates novel coating elements unique to handling and processing molten metals. For example, some implementations of the present disclosure incorporate double-sided molten metal coating elements, which include at least one of a molten metal application assembly (e.g., kiss roller, slot-die, Meyer bar, and/or gravure roller), a primary melt pool assembly, a secondary melt pool assembly, and an engagement mechanism.
-
-
-
-
-
-
-
-
-
搜索结果
62 条记录 (耗时 0.019 秒)
