公开(公告)号：US07215891B1

公开(公告)日：2007-05-08

申请号：US10456386

申请日：2003-06-06

申请人： Min-Wen Chiang ,  Wenbin Jiang ,  David K. Lewis ,  Hsing-Chung Lee

发明人： Min-Wen Chiang ,  Wenbin Jiang ,  David K. Lewis ,  Hsing-Chung Lee

IPC分类号： H04B10/24

CPC分类号： H04B10/40

摘要： An optical transceiver includes a single integrated circuit chip to integrate the drive, receive, control, and monitoring functions of the optical transceiver. The single chip may further have an advance replacement algorithm and monitoring algorithm for the opto-electronic devices of the optical transmitter and receiver to generate flags and/or an advance replacement indication. Methods, apparatus, and systems are disclosed.

摘要翻译： 光收发器包括集成光收发器的驱动，接收，控制和监视功能的单个集成电路芯片。 单芯片还可以具有用于光发射器和接收器的光电器件的预先替换算法和监视算法以产生标志和/或提前替换指示。 公开了方法，装置和系统。

公开(公告)号：US5514838A

公开(公告)日：1996-05-07

申请号：US314461

申请日：1994-09-27

申请人： Cheng P. Wen ,  Wah S. Wong ,  Min-Wen Chiang

发明人： Cheng P. Wen ,  Wah S. Wong ,  Min-Wen Chiang

IPC分类号： H01L23/485 ,  H01L23/498 ,  H01L23/66 ,  H05K1/09

CPC分类号： H01L24/10 ,  H01L23/49816 ,  H01L23/49866 ,  H01L23/66 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/1423

摘要： An integrated circuit assembly that prevents silver migration by providing conductive rims around oxidizable silver contacts that contact a substrate. Typically the silver contacts are supported by respective metal pads on the substrate with a contact potential existing at each contact-pad junction. In many applications an electrical circuit transmits electrical signals via the contacts to produce potential differences between the contacts and create electrical fields at their surfaces. The conductive rims have a work function that is sufficiently small to reduce the electric fields and contact potentials so as to inhibit the ionization of the oxidized contacts' surfaces and prevent silver migration across the metal pads and the substrate.

摘要翻译： 一种集成电路组件，其通过在与基板接触的可氧化银触点周围设置导电边框来防止银迁移。 通常，银触点由衬底上的相应金属焊盘支撑，每个触点焊点处存在接触电位。 在许多应用中，电路经由触点传输电信号，以产生触点之间的电位差并在其表面产生电场。 导电边缘具有足够小的功函数以减小电场和接触电位，从而抑制氧化的接触表面的电离，并防止银迁移穿过金属焊盘和衬底。