摘要:
By use of an ion plating apparatus having an ionizing means which can be operated independently of the electric potential of a substrate, at the initial and final stages of the process of ion plating, a negative potential relative to that of a vapor source is applied to the substrate in order to facilitate the bombardment effect and at the intermediate stage of the process, the potential of the substrate is left floating while the ionization means is being driven in order to control the bombardment effect. In a preferred example, the apparatus has thermoelectron emitting filaments located near the substrate and a pair of anodes located on the side of the vapor source with respect to the substrate and on the opposite side of the substrate. This process permits producing relatively thick and adherent coatings.
摘要:
A diamond-like carbon (DLC) film is formed on a portion of a reed blade in a high-speed loom which requires the highest wear resistance. When a stainless steel is used as the base material of the reed blade, the DLC film is formed through an intermediate layer comprising, e.g., a titanium carbide layer. Reed blades coated with a DLC film are arranged at the side portions of the reed where wear progresses quickly, while reed blades coated with hard films requiring a relatively low cost, or non-coated reed blades, are arranged in the central portion of the reed, thereby uniforming the blade wear throughout the entire reed. The reed is suitable to many types of fibers, ranging from natural to synthetic and new material fibers.
摘要:
A method of sensing the amount of a thin film deposited during an ion plating process, based upon either fixing the value of voltage applied to a plasma-generating probe and measuring the current which flows through the probe into the plasma, this current varying in proportion to the rate of formation of the thin film, or fixing the level of current which flows through the probe into the plasma at a fixed value and measuring the voltage which develops at the probe, this voltage varying in proportion to the rate of formation of the thin film. The results of such measurement can be used to control the thickness of a deposited thin film to a desired value.