摘要:
The present invention provides a pressure-sensitive adhesive tape for battery, which includes a substrate and a pressure-sensitive adhesive applied on at least one surface of the substrate, in which the pressure-sensitive adhesive is applied on a part of the substrate, and in which either one of a portion at which the pressure-sensitive adhesive is applied and a portion at which the pressure-sensitive adhesive is not applied has a degree of haze of more than 15%, and the other one of said portions has a degree of haze of 15% or less.
摘要:
The present invention relates to a pressure-sensitive adhesive tape for a non-aqueous battery, containing: a substrate and a pressure-sensitive adhesive layer on at least one side of the substrate, in which the pressure-sensitive adhesive layer contains 90 wt % or more of a polyisobutylene rubber, and in which a content of a polyisobutylene rubber having a molecular weight of 800,000 to 2,200,000 is in the range of 15 to 50 wt % based on the entire pressure-sensitive adhesive layer, a content of a polyisobutylene rubber having a molecular weight of 10,000 to 700,000 is in the range of 35 to 70 wt % based on the entire pressure-sensitive adhesive layer, and a content of a component having a molecular weight of 10,000 or less is 5 wt % or less based on the entire pressure-sensitive adhesive layer.
摘要:
The present invention provides a pressure-sensitive adhesive tape for battery, which includes a substrate and a pressure-sensitive adhesive applied on at least one surface of the substrate, in which the pressure-sensitive adhesive is applied on a part of the substrate, and in which either one of a portion at which the pressure-sensitive adhesive is applied and a portion at which the pressure-sensitive adhesive is not applied has a degree of haze of more than 15%, and the other one of said portions has a degree of haze of 15% or less.
摘要:
The present invention relates to a pressure-sensitive adhesive tape for protecting an electrode plate, containing: a substrate, and a pressure-sensitive adhesive layer provided on at least one side of a the substrate, in which the pressure-sensitive adhesive tape has a piercing resistance, obtained by the following calculation method, of 300 gf·mm or more; and has a heat shrinkage ratio, when heating is performed at 260° C. for 1 hour, of 1.0% or less in both of TD (width) direction and MD (length) direction, and in which the calculation method contains fixing the pressure-sensitive adhesive tape to a fixing plate in which a circular hole having a diameter of 11.28 mm is formed, piercing a needle of which the end of has a curvature radius of 0.5 mm to the pressure-sensitive adhesive tape at a speed of 2 mm/s under condition of 23±2° C., and measuring a maximum load (gf) and a maximum elongation (mm) of the pressure-sensitive adhesive tape when the needle penetrates the pressure-sensitive adhesive tape; and the piercing resistance is calculated by the following equation (1): Piercing resistance=[Maximum load (gf)]×[Maximum elongation (mm) of the pressure-sensitive adhesive tape]×½ (1).