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公开(公告)号：US09053390B2
公开(公告)日：2015-06-09
申请号：US13585115
申请日：2012-08-14
Applicant: Mohan Mahadevan , Govind Thattaisundaram , Ajay Gupta , Chien-Huei (Adam) Chen , Jason Kirkwood , Ashok Kulkarni , Songnian Rong , Ernesto Escorcia , Eugene Shifrin
Inventor： Mohan Mahadevan , Govind Thattaisundaram , Ajay Gupta , Chien-Huei (Adam) Chen , Jason Kirkwood , Ashok Kulkarni , Songnian Rong , Ernesto Escorcia , Eugene Shifrin
CPC classification number: G06K9/6254 , G06T7/0004 , G06T2207/30148
Abstract: Methods and systems for determining inspection scenarios without input from a user are presented. Inspection scenarios include at least one acquisition mode, defect detection parameter values, and classification parameter values. In one example, a number of defect events are determined by a hot inspection of a wafer surface. The defect events are classified and attributes associated with each defect event are identified. The defect events are labeled with this information. Based on the identified attributes and classification, inspection scenarios are determined. The inspection scenarios are solutions in a mathematical space formed by the identified attributes. In some examples, a plurality of inspection scenarios are determined and a desired inspection scenario is selected from the plurality based on the number of defects of interest and the number of nuisance events captured by the selected inspection scenario.
Abstract translation: 提出了用于确定用户无需输入的检测情景的方法和系统。 检查场景包括至少一个采集模式，缺陷检测参数值和分类参数值。 在一个示例中，通过晶片表面的热检查来确定多个缺陷事件。 对缺陷事件进行分类，并识别与每个缺陷事件相关的属性。 缺陷事件用此信息标记。 根据确定的属性和分类，确定检验情况。 检查方案是由所识别的属性形成的数学空间中的解决方案。 在一些示例中，确定多个检查情景，并且基于感兴趣的缺陷的数量和由所选择的检查情景捕获的滋扰事件的数量，从多个中选择期望的检查情景。
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2.发明授权Data perturbation for wafer inspection or metrology setup using a model of a difference 有权使用差异模型进行晶圆检测或计量设置的数据扰动公开(公告)号：US09360863B2
公开(公告)日：2016-06-07
申请号：US13258441
申请日：2011-06-09
Applicant: Govind Thattaisundaram , Mohan Mahadevan , Ajay Gupta , Chien-Huei Adam Chen , Ashok Kulkarni , Jason Kirkwood , Kenong Wu , Songnian Rong
Inventor： Govind Thattaisundaram , Mohan Mahadevan , Ajay Gupta , Chien-Huei Adam Chen , Ashok Kulkarni , Jason Kirkwood , Kenong Wu , Songnian Rong
IPC: G06F17/50 , G05B19/418
CPC classification number: G05B19/41875 , G05B2219/32182 , G05B2219/45031 , Y02P90/22
Abstract: Various embodiments for determining parameters for wafer inspection and/or metrology are provided.
Abstract translation: 提供了用于确定晶片检查和/或度量的参数的各种实施例。
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公开(公告)号：US08467047B2
公开(公告)日：2013-06-18
申请号：US13541579
申请日：2012-07-03
Applicant: Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
Inventor： Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
IPC: G01N21/00
CPC classification number: G01N21/9501 , G01N2021/887 , H01L22/12
Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.
Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。
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公开(公告)号：US20120116733A1
公开(公告)日：2012-05-10
申请号：US13258441
申请日：2011-06-09
Applicant: Govind Thattaisundaram , Mohan Mahadevan , Ajay Gupta , Chien-Huei Adam Chen , Ashok Kulkarni , Jason Kirkwood , Kenong Wu , Songnian Rong
Inventor： Govind Thattaisundaram , Mohan Mahadevan , Ajay Gupta , Chien-Huei Adam Chen , Ashok Kulkarni , Jason Kirkwood , Kenong Wu , Songnian Rong
IPC: G06F17/50
CPC classification number: G05B19/41875 , G05B2219/32182 , G05B2219/45031 , Y02P90/22
Abstract: Various embodiments for determining parameters for wafer inspection and/or metrology are provided.
Abstract translation: 提供了用于确定晶片检查和/或度量的参数的各种实施例。
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公开(公告)号：US20100188657A1
公开(公告)日：2010-07-29
申请号：US12359476
申请日：2009-01-26
Applicant: Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
Inventor： Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
IPC: G01N21/88
CPC classification number: G01N21/9501 , G01N2021/887 , H01L22/12
Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.
Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。
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Patent Agency Ranking
公开(公告)号：US20140050389A1
公开(公告)日：2014-02-20
申请号：US13585115
申请日：2012-08-14
Applicant: Mohan Mahadevan , Govind Thattaisundaram , Ajay Gupta , Chien-Huei (Adam) Chen , Jason Kirkwood , Ashok Kulkarni , Songnian Rong , Ernesto Escorcia , Eugene Shifrin
Inventor： Mohan Mahadevan , Govind Thattaisundaram , Ajay Gupta , Chien-Huei (Adam) Chen , Jason Kirkwood , Ashok Kulkarni , Songnian Rong , Ernesto Escorcia , Eugene Shifrin
IPC: G06K9/62
CPC classification number: G06K9/6254 , G06T7/0004 , G06T2207/30148
Abstract: Methods and systems for determining inspection scenarios without input from a user are presented. Inspection scenarios include at least one acquisition mode, defect detection parameter values, and classification parameter values. In one example, a number of defect events are determined by a hot inspection of a wafer surface. The defect events are classified and attributes associated with each defect event are identified. The defect events are labeled with this information. Based on the identified attributes and classification, inspection scenarios are determined. The inspection scenarios are solutions in a mathematical space formed by the identified attributes. In some examples, a plurality of inspection scenarios are determined and a desired inspection scenario is selected from the plurality based on the number of defects of interest and the number of nuisance events captured by the selected inspection scenario.
Abstract translation: 提出了用于确定用户无需输入的检测情景的方法和系统。 检查场景包括至少一个采集模式，缺陷检测参数值和分类参数值。 在一个示例中，通过晶片表面的热检查来确定多个缺陷事件。 对缺陷事件进行分类，并识别与每个缺陷事件相关的属性。 缺陷事件用此信息标记。 根据确定的属性和分类，确定检验情况。 检查方案是由所识别的属性形成的数学空间中的解决方案。 在一些示例中，确定多个检查情景，并且基于感兴趣的缺陷的数量和由所选择的检查情景捕获的滋扰事件的数量，从多个中选择期望的检查情景。
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7.发明授权Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions 有权用于创建晶片持久性数据以及使用持久性数据进行检查相关功能的系统和方法公开(公告)号：US08126255B2
公开(公告)日：2012-02-28
申请号：US12234201
申请日：2008-09-19
Applicant: Kris Bhaskar , Chetana Bhaskar , Ashok Kulkarni , Eliezer Rosengaus , Cecelia Campochiaro , Chris Maher , Brian Duffy , Aneesh Khullar , Alpa Kohli , Lalita A. Balasubramanian , Santosh Bhattacharyya , Mohan Mahadevan
Inventor： Kris Bhaskar , Chetana Bhaskar , Ashok Kulkarni , Eliezer Rosengaus , Cecelia Campochiaro , Chris Maher , Brian Duffy , Aneesh Khullar , Alpa Kohli , Lalita A. Balasubramanian , Santosh Bhattacharyya , Mohan Mahadevan
IPC: G06K9/00
CPC classification number: G06T7/001 , G06T1/20 , G06T2207/30148
Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.
Abstract translation: 提供了用于创建晶片的持久数据并使用持久数据进行检查相关功能的各种系统和方法。 一个系统包括耦合到检查系统的检测器的一组处理器节点。 每个处理器节点被配置为在扫描晶片期间接收由检测器产生的图像数据的一部分。 该系统还包括分开耦合到每个处理器节点的存储介质阵列。 处理器节点被配置为将由处理器节点接收的图像数据的所有图像数据或选定部分发送到存储介质阵列，使得由检测器生成的图像数据或图像数据的所选部分 在扫描晶片期间存储在存储介质的阵列中。
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8.发明申请SYSTEMS AND METHODS FOR CREATING PERSISTENT DATA FOR A WAFER AND FOR USING PERSISTENT DATA FOR INSPECTION-RELATED FUNCTIONS 有权用于创建WAFER的持续数据并使用用于检查相关功能的数据的系统和方法公开(公告)号：US20090080759A1
公开(公告)日：2009-03-26
申请号：US12234201
申请日：2008-09-19
Applicant: Kris Bhaskar , Chetana Bhaskar , Ashok Kulkarni , Eliezer Rosengaus , Cecilia Campochiaro , Chris Maher , Brian Duffy , Aneesh Khullar , Alpa Kohli , Lalita A. Balasubramanian , Santosh Bhattacharyya , Mohan Mahadevan
Inventor： Kris Bhaskar , Chetana Bhaskar , Ashok Kulkarni , Eliezer Rosengaus , Cecilia Campochiaro , Chris Maher , Brian Duffy , Aneesh Khullar , Alpa Kohli , Lalita A. Balasubramanian , Santosh Bhattacharyya , Mohan Mahadevan
IPC: G06K9/00
CPC classification number: G06T7/001 , G06T1/20 , G06T2207/30148
Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.
Abstract translation: 提供了用于创建晶片的持久数据并使用持久数据进行检查相关功能的各种系统和方法。 一个系统包括耦合到检查系统的检测器的一组处理器节点。 每个处理器节点被配置为在扫描晶片期间接收由检测器产生的图像数据的一部分。 该系统还包括分开耦合到每个处理器节点的存储介质阵列。 处理器节点被配置为将由处理器节点接收的图像数据的所有图像数据或选定部分发送到存储介质阵列，使得由检测器生成的图像数据或图像数据的所选部分 在扫描晶片期间存储在存储介质的阵列中。
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公开(公告)号：US20120268735A1
公开(公告)日：2012-10-25
申请号：US13541579
申请日：2012-07-03
Applicant: Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
Inventor： Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
IPC: G01N21/95
CPC classification number: G01N21/9501 , G01N2021/887 , H01L22/12
Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.
Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。
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公开(公告)号：US08223327B2
公开(公告)日：2012-07-17
申请号：US12359476
申请日：2009-01-26
Applicant: Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
Inventor： Lu Chen , Jason Kirkwood , Mohan Mahadevan , James A. Smith , Lisheng Gao , Junqing (Jenny) Huang , Tao Luo , Richard Wallingford
IPC: G01N21/00
CPC classification number: G01N21/9501 , G01N2021/887 , H01L22/12
Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.
Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。
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