公开(公告)号：US06331680B1

公开(公告)日：2001-12-18

申请号：US08689164

申请日：1996-08-07

申请人： David John Klassen ,  Morgan Merritt Whitney, Jr. ,  Thomas Randall Peterman ,  Paul Earl Pergande ,  David Robert Collins

发明人： David John Klassen ,  Morgan Merritt Whitney, Jr. ,  Thomas Randall Peterman ,  Paul Earl Pergande ,  David Robert Collins

IPC分类号： H01R1204

CPC分类号： C23C4/02 ,  C23C4/01 ,  H05K3/143 ,  H05K3/467 ,  Y10S428/901

摘要： A multilayer, monolithic electrical interconnection device includes a substrate and a plurality of overlaying, alternating conducting and insulating layers deposited atop the substrate and one another. The layers are deposited by thermal spraying of respective insulating or conducting material through defined apertures in respective spray masks. Interlayer electrical connections are intrinsically formed by direct metallurgical bonding between the conducting material of an overlaying layer and the conducting material of a previously sprayed layer.

摘要翻译： 多层单片电互连器件包括衬底和沉积在衬底上彼此之上的多个重叠的交替导电绝缘层。 通过相应的绝缘或导电材料的热喷涂通过相应喷雾掩模中的限定的孔沉积这些层。 层间电连接通过在覆盖层的导电材料和预先喷涂层的导电材料之间的直接冶金结合本质上形成。

公开(公告)号：US6085413A

公开(公告)日：2000-07-11

申请号：US16913

申请日：1998-02-02

申请人： David John Klassen ,  Morgan Merritt Whitney, Jr. ,  Thomas Randall Peterman ,  Paul Earl Pergande ,  David Robert Collins

发明人： David John Klassen ,  Morgan Merritt Whitney, Jr. ,  Thomas Randall Peterman ,  Paul Earl Pergande ,  David Robert Collins

IPC分类号： H01L21/48 ,  H05K3/14 ,  H05K3/46 ,  H05K3/34

CPC分类号： H05K3/143 ,  H01L21/4857 ,  H05K3/467 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155

摘要： A multilayer, monolithic electrical interconnection device includes a substrate and a plurality of overlaying, alternating conducting and insulating layers deposited atop the substrate and one another. The layers are deposited by thermal spraying of respective insulating or conducting material through defined apertures in respective spray masks. Interlayer electrical connections are intrinsically formed by direct metallurgical bonding between the conducting material of an overlaying layer and the conducting material of a previously sprayed layer.

摘要翻译： 多层单片电互连器件包括衬底和沉积在衬底上彼此之上的多个重叠的交替导电绝缘层。 通过相应的绝缘或导电材料的热喷涂通过相应喷雾掩模中的限定的孔沉积这些层。 层间电连接通过在覆盖层的导电材料和预先喷涂层的导电材料之间的直接冶金结合本质上形成。