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公开(公告)号：US06358125B2
公开(公告)日：2002-03-19
申请号：US09724999
申请日：2000-11-29
IPC分类号： B24B719
摘要： A polishing liquid supply apparatus supplies a polishing liquid to a polishing unit. The polishing liquid supply apparatus includes a supply tank for storing a polishing liquid having a predetermined concentration, and a polishing liquid pipe for delivering the polishing liquid from the supply tank to a polishing liquid supply nozzle in the polishing unit. The polishing liquid supply apparatus further includes an additive tank for storing an additive having a predetermined concentration, and an additive supply pipe for adding the additive supplied from the additive tank to the polishing liquid stored in the supply tank or to the polishing liquid in a polishing liquid passage including the polishing liquid pipe.
摘要翻译： 研磨液供给装置将研磨液供给到研磨单元。 研磨液供给装置具备：储存预定浓度的研磨液的供给槽和将研磨液从供给槽输送到研磨单元的研磨液供给喷嘴的研磨液管。 该研磨液供给装置还具备用于储存规定浓度的添加剂的添加剂槽，以及添加剂供给管，其用于将从添加剂供给的添加剂添加到在供给槽中储存的研磨液或抛光液中的研磨液 液体通道包括抛光液管。
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公开(公告)号：US06280300B1
公开(公告)日：2001-08-28
申请号：US09450269
申请日：1999-11-26
IPC分类号： B24C900
CPC分类号： B24B37/04 , B01D35/12 , B01D61/14 , B01D61/142 , B01D61/18 , B01D61/20 , B01D65/00 , B01D65/02 , B01D2321/164 , B24B57/02
摘要： A filter apparatus provided in a fluid pipeline for conveying a treatment fluid. A regenerating pipeline is provided adjacently to the fluid pipeline to convey a regenerating liquid. At least two filter units are switched between the fluid pipeline and the regenerating pipeline by a switching valve device. The filter apparatus enables a filter replacing operation to be carried out smoothly and reliably and is also capable of reliably trapping solid particles contained in the fluid, e.g. an abrasive liquid, continuously without the need of a filter replacing operation, thereby allowing supply of a fluid of high quality and a stable operation free from clogging.
摘要翻译： 一种设置在流体管道中用于输送处理流体的过滤装置。 与流体管道相邻设置再生管道以输送再生液体。 至少两个过滤器单元通过切换阀装置在流体管道和再生管道之间切换。 过滤装置能够平稳而可靠地进行过滤器更换操作，并且还能够可靠地捕获包含在流体中的固体颗粒，例如， 研磨液体，连续地不需要过滤器更换操作，从而允许供应高质量的流体和稳定的操作而不会堵塞。
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公开(公告)号：US09469013B2
公开(公告)日：2016-10-18
申请号：US13488774
申请日：2012-06-05
申请人： Mutsumi Tanikawa , Takahiro Shimano
发明人： Mutsumi Tanikawa , Takahiro Shimano
IPC分类号： B24B49/00 , B24B53/017 , B24B49/18 , B24B53/02
CPC分类号： B24B53/017 , B24B49/006 , B24B49/18 , B24B53/02
摘要： A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.
摘要翻译： 调整抛光垫的表面的方法用于调理抛光台上的抛光垫，用于抛光形成在基板表面上的薄膜。 调理方法包括使修整器与抛光垫接触，并且通过在抛光垫的中心部分和抛光垫的外圆周部分之间移动修整器来调节抛光垫。 修磨器在抛光垫的预定区域的移动速度高于修整器在抛光垫的预定区域的标准移动速度。
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公开(公告)号：US20120315829A1
公开(公告)日：2012-12-13
申请号：US13488774
申请日：2012-06-05
申请人： Mutsumi TANIKAWA , Takahiro SHIMANO
发明人： Mutsumi TANIKAWA , Takahiro SHIMANO
CPC分类号： B24B53/017 , B24B49/006 , B24B49/18 , B24B53/02
摘要： A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.
摘要翻译： 调整抛光垫的表面的方法用于调理抛光台上的抛光垫，用于抛光形成在基板表面上的薄膜。 调理方法包括使修整器与抛光垫接触，并且通过在抛光垫的中心部分和抛光垫的外圆周部分之间移动修整器来调节抛光垫。 修磨器在抛光垫的预定区域的移动速度高于修整器在抛光垫的预定区域的标准移动速度。
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公开(公告)号：US06508695B2
公开(公告)日：2003-01-21
申请号：US09817206
申请日：2001-03-27
申请人： Mutsumi Tanikawa , Mitsunori Komatsu , Kiyotaka Kawashima , Hiroshi Shimomoto , Katsuya Okumura
发明人： Mutsumi Tanikawa , Mitsunori Komatsu , Kiyotaka Kawashima , Hiroshi Shimomoto , Katsuya Okumura
IPC分类号： B24B100
摘要： A pure water reusing system recovers water discharged from apparatuses in which pure water is used, and regenerates the water to produce pure water. The pure water reusing system has a recovering and regenerating apparatus for recovering water discharged from the apparatuses and regenerating the water by removing impurities from the water to produce pure water, and a regenerated pure water supply line for supplying the regenerated pure water to at least one of the apparatuses. The same process is conducted in the apparatuses in which pure water is used.
摘要翻译： 纯水再利用系统可以回收从使用纯水的设备排出的水，再生水以产生纯净水。 纯水再利用系统具有回收再生装置，用于回收从装置排出的水并通过从水中除去杂质来再生水以产生纯净水;以及再生纯水供应管线，用于将再生的纯水供给到至少一个 的装置。 在使用纯水的装置中进行相同的处理。
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公开(公告)号：US06338671B1
公开(公告)日：2002-01-15
申请号：US09533779
申请日：2000-03-24
IPC分类号： B24G900
摘要： An apparatus for supplying a polishing liquid to a polishing section is used for polishing a surface of a semiconductor substrate in the polishing section. The apparatus comprises a supply tank for storing a polishing liquid having given properties, a supply pipe for supplying the polishing liquid to the polishing section, a sensing device for detecting properties of the polishing liquid flowing through the supply pipe, and a stabilization device for maintaining properties of the polishing liquid stored in the supply tank or flowing through the supply pipe within an allowable range on the basis of an output signal from the sensing device.
摘要翻译： 用于将研磨液供给到研磨部的装置用于研磨研磨部中的半导体基板的表面。 该装置包括用于存储具有给定特性的抛光液的供应罐，用于将抛光液供给到抛光部的供应管，用于检测流过供给管的抛光液的性质的检测装置，以及用于维持 基于来自感测装置的输出信号，存储在供应罐中的抛光液的特性或者通过供给管流动在允许范围内。
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