公开(公告)号：US09469013B2

公开(公告)日：2016-10-18

申请号：US13488774

申请日：2012-06-05

申请人： Mutsumi Tanikawa ,  Takahiro Shimano

发明人： Mutsumi Tanikawa ,  Takahiro Shimano

IPC分类号： B24B49/00 ,  B24B53/017 ,  B24B49/18 ,  B24B53/02

CPC分类号： B24B53/017 ,  B24B49/006 ,  B24B49/18 ,  B24B53/02

摘要： A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.

摘要翻译： 调整抛光垫的表面的方法用于调理抛光台上的抛光垫，用于抛光形成在基板表面上的薄膜。 调理方法包括使修整器与抛光垫接触，并且通过在抛光垫的中心部分和抛光垫的外圆周部分之间移动修整器来调节抛光垫。 修磨器在抛光垫的预定区域的移动速度高于修整器在抛光垫的预定区域的标准移动速度。

公开(公告)号：US20120315829A1

公开(公告)日：2012-12-13

申请号：US13488774

申请日：2012-06-05

申请人： Mutsumi TANIKAWA ,  Takahiro SHIMANO

发明人： Mutsumi TANIKAWA ,  Takahiro SHIMANO

IPC分类号： B24B53/00 ,  B24B53/12 ,  B24B1/00 ,  B24B29/00 ,  B24B7/00

CPC分类号： B24B53/017 ,  B24B49/006 ,  B24B49/18 ,  B24B53/02

摘要： A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.

摘要翻译： 调整抛光垫的表面的方法用于调理抛光台上的抛光垫，用于抛光形成在基板表面上的薄膜。 调理方法包括使修整器与抛光垫接触，并且通过在抛光垫的中心部分和抛光垫的外圆周部分之间移动修整器来调节抛光垫。 修磨器在抛光垫的预定区域的移动速度高于修整器在抛光垫的预定区域的标准移动速度。

公开(公告)号：US09156122B2

公开(公告)日：2015-10-13

申请号：US13479575

申请日：2012-05-24

申请人： Hiroyuki Shinozaki ,  Takahiro Shimano ,  Akira Imamura ,  Nakamura Akira

发明人： Hiroyuki Shinozaki ,  Takahiro Shimano ,  Akira Imamura ,  Nakamura Akira

IPC分类号： B24B49/02 ,  B24B49/18 ,  B24B37/04 ,  B24B53/08

CPC分类号： B24B37/005 ,  B24B37/042 ,  B24B49/02 ,  B24B49/04 ,  B24B49/18 ,  B24B49/186 ,  B24B53/005 ,  B24B53/017 ,  B24B53/08

摘要： A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.

摘要翻译： 一种方法能够监测抛光垫的抛光表面，而无需从研磨台上移除抛光垫。 该方法包括：通过使旋转的修整器在抛光表面上振荡来调节抛光垫的抛光表面; 当执行抛光表面的调理时，测量抛光表面的高度; 计算在所述抛光表面上限定的二维表面上的所述高度的测量点的位置; 并且重复测量抛光表面的高度和计算测量点的位置以在抛光表面中产生高度分布。

公开(公告)号：US20120309267A1

公开(公告)日：2012-12-06

申请号：US13479575

申请日：2012-05-24

申请人： Hiroyuki SHINOZAKI ,  Takahiro SHIMANO ,  Akira IMAMURA ,  Akira NAKAMURA

发明人： Hiroyuki SHINOZAKI ,  Takahiro SHIMANO ,  Akira IMAMURA ,  Akira NAKAMURA

IPC分类号： B24B1/00 ,  B24B53/02 ,  B24B49/00

CPC分类号： B24B37/005 ,  B24B37/042 ,  B24B49/02 ,  B24B49/04 ,  B24B49/18 ,  B24B49/186 ,  B24B53/005 ,  B24B53/017 ,  B24B53/08

摘要： The present invention provides a method capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.

摘要翻译： 本发明提供一种能够在不从研磨台移除抛光垫的情况下监测抛光垫的抛光表面的方法。 该方法包括：通过使旋转的修整器在抛光表面上振荡来调节抛光垫的抛光表面; 当执行抛光表面的调理时，测量抛光表面的高度; 计算在所述抛光表面上限定的二维表面上的所述高度的测量点的位置; 并且重复测量抛光表面的高度和计算测量点的位置以在抛光表面中产生高度分布。