公开(公告)号：US5229360A

公开(公告)日：1993-07-20

申请号：US831006

申请日：1992-02-06

申请人： Shoji Shiga ,  Koki Sato ,  Nakahiro Harada ,  Kiyoshi Yamamoto

发明人： Shoji Shiga ,  Koki Sato ,  Nakahiro Harada ,  Kiyoshi Yamamoto

IPC分类号： H01L39/24

CPC分类号： H01L39/2464 ,  Y10S505/701 ,  Y10S505/73 ,  Y10S505/731

摘要： A method for forming a superconducting circuit is disclosed, comprising the steps of forming a mask pattern on a superconducting layer, forming a covering layer, containing a modifying element for superconductor, on the resultant structure, diffusing the modifying element for a superconductor, which is contained in the covering layer, into the superconducting layer to modify a corresponding location to a nonsuperconducting layer. A method for forming a multi-layer superconducting circuit is also disclosed, comprising sequentially repeating the same steps as set forth above over a substrate.

摘要翻译： 公开了一种用于形成超导电路的方法，包括以下步骤：在超导层上形成掩模图案，在所得结构上形成包含用于超导体的修饰元件的覆盖层，扩散用于超导体的修饰元件，其为 包含在覆盖层中，进入超导层，以将对应的位置修改为非超导层。 还公开了一种用于形成多层超导电路的方法，包括在衬底上顺序地重复与上述相同的步骤。

公开(公告)号：US4994435A

公开(公告)日：1991-02-19

申请号：US256763

申请日：1988-10-11

申请人： Shoji Shiga ,  Masanori Ozaki ,  Ton-Chi Chang ,  Nakahiro Harada ,  Masanao Mimura

发明人： Shoji Shiga ,  Masanori Ozaki ,  Ton-Chi Chang ,  Nakahiro Harada ,  Masanao Mimura

IPC分类号： H01L39/12 ,  H01L39/24

CPC分类号： H01L39/2461 ,  H01L39/126 ,  Y10S505/701 ,  Y10S505/704 ,  Y10T29/49014 ,  Y10T428/12618

摘要： This invention discloses an oxide superconductor shaped body including a noble metal layer formed on at least one surface of an oxide superconductor layer formed on a substrate, and a method of manufacturing oxide superconductor shaped body.

公开(公告)号：US5194419A

公开(公告)日：1993-03-16

申请号：US555061

申请日：1990-07-18

申请人： Shoji Shiga ,  Nakahiro Harada ,  Kiyoshi Yamamoto ,  Koki Sato

发明人： Shoji Shiga ,  Nakahiro Harada ,  Kiyoshi Yamamoto ,  Koki Sato

IPC分类号： H05K3/46 ,  H01B12/06 ,  H01L39/24

CPC分类号： H01L39/2464 ,  H01L39/249 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/73 ,  Y10S505/731 ,  Y10S505/732 ,  Y10S505/742

摘要： A method for manufacturing a superconductive multilayer circuit has a first thin film forming step for forming a thin film, which is composed of superconductive material or a similar material thereto, on a substrate, a first circuit layer forming step for forming a superconductive circuit by discharging a specific component from a predetermined part of the thin film or implanting the component in the thin film, a second thin film forming step for forming a thin film, which is composed of a superconducting material or the simulant thereto, on the first circuit layer, and a second circuit layer forming step for forming a superconductive circuit by removing a specific component from a predetermined part of the thin film or implanting the component in the thin film.