公开(公告)号：US20050056870A1

公开(公告)日：2005-03-17

申请号：US10952330

申请日：2004-09-28

申请人： Maurice Karpman ,  Nicole Hablutzel ,  Peter Farrell ,  Michael Judy ,  Lawrence Felton

发明人： Maurice Karpman ,  Nicole Hablutzel ,  Peter Farrell ,  Michael Judy ,  Lawrence Felton

IPC分类号： B81B7/00 ,  G01P1/02 ,  H01L23/48

CPC分类号： G01P1/023 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2207/012 ,  H01L24/32 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099

摘要： A packaged microchip has a microchip attach region with a lower modulus of elasticity than other portions of the package base. Specifically, the packaged microchip includes a stress sensitive microchip, and a package having a base with a primary region and an attach region. A surface of the microchip is coupled to the attach region of the package. The attach region has a modulus of elasticity that is less than the modulus of elasticity of the primary region.

摘要翻译： 封装的微芯片具有微芯片附着区域，其具有比包装基底的其它部分更低的弹性模量。 具体地，封装的微芯片包括应力敏感微芯片，以及具有主区域和附着区域的基底的封装。 微芯片的表面耦合到封装的附接区域。 附着区域的弹性模量小于初级区域的弹性模量。

公开(公告)号：US07166911B2

公开(公告)日：2007-01-23

申请号：US10952424

申请日：2004-09-28

申请人： Maurice S. Karpman ,  Nicole Hablutzel ,  Peter W. Farrell ,  Michael W. Judy ,  Lawrence E. Felton ,  Lewis Long

发明人： Maurice S. Karpman ,  Nicole Hablutzel ,  Peter W. Farrell ,  Michael W. Judy ,  Lawrence E. Felton ,  Lewis Long

IPC分类号： H01L23/12

CPC分类号： B81B7/0048 ,  H01L2224/32014 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00

摘要： A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.

摘要翻译： MEMS惯性传感器固定在至少部分由低透湿成型材料形成的预成型包装中。 因此，这种运动检测器应该能够比使用陶瓷封装的那些更经济地生产。 为了达到这些目的，包装件具有从引线框架延伸以形成空腔的至少一个壁（具有低的透湿性），并且在该空腔内具有隔离器（具有顶部表面）。 MEMS惯性传感器具有悬挂在具有底表面的基底上方的可移动结构。 衬底底表面在接触区域处固定到隔离器顶表面。 在说明性实施例中，接触面积小于衬底的底表面的表面积。 因此，隔离器在底部基板表面的至少一部分和封装之间形成空间。 因此，这个空间没有隔离器。 此外，由于封装的透湿性低，可以避免进一步的生产步骤，同时确保水分不会对空腔内的MEMS惯性传感器产生不利影响。

公开(公告)号：US20050035446A1

公开(公告)日：2005-02-17

申请号：US10952424

申请日：2004-09-28

申请人： Maurice Karpman ,  Nicole Hablutzel ,  Peter Farrell ,  Michael Judy ,  Lawrence Felton ,  Lewis Long

发明人： Maurice Karpman ,  Nicole Hablutzel ,  Peter Farrell ,  Michael Judy ,  Lawrence Felton ,  Lewis Long

IPC分类号： B81B7/00 ,  H01L23/06

CPC分类号： B81B7/0048 ,  H01L2224/32014 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00

摘要： A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.

摘要翻译： MEMS惯性传感器固定在至少部分由低透湿成型材料形成的预成型包装中。 因此，这种运动检测器应该能够比使用陶瓷封装的那些更经济地生产。 为了达到这些目的，包装件具有从引线框架延伸以形成空腔的至少一个壁（具有低的透湿性），并且在该空腔内具有隔离器（具有顶部表面）。 MEMS惯性传感器具有悬挂在具有底表面的基底上方的可移动结构。 衬底底表面在接触区域处固定到隔离器顶表面。 在说明性实施例中，接触面积小于衬底的底表面的表面积。 因此，隔离器在底部基板表面的至少一部分和封装之间形成空间。 因此，这个空间没有隔离器。 此外，由于封装的透湿性低，可以避免进一步的生产步骤，同时确保水分不会对空腔内的MEMS惯性传感器产生不利影响。