公开(公告)号：US06831772B2

公开(公告)日：2004-12-14

申请号：US10198316

申请日：2002-07-18

申请人： Timothy Spooner ,  Lewis Long

发明人： Timothy Spooner ,  Lewis Long

IPC分类号： G02F129

CPC分类号： G02B6/3582 ,  G02B6/3518 ,  G02B6/3526 ,  G02B6/355 ,  G02B26/0841

摘要： An optical mirror module has an interface port that is spaced from a corresponding die. More specifically, the optical mirror module includes a substrate and a die having at least one mirror and circuitry to control the at least one mirror. The optical mirror module defines a plane that is substantially parallel to the die. The optical mirror module further includes the noted interface port, which is adapted to electrically couple the circuitry with a device external to the optical mirror module. As suggested above, the interface port is located on the substrate and spaced from the die on the plane.

摘要翻译： 光学镜模块具有与相应的模具间隔开的接口端口。 更具体地，光学镜模块包括具有至少一个反射镜的基板和裸片，以及用于控制至少一个反射镜的电路。 光学镜模块限定了基本上平行于模具的平面。 光学镜模块还包括所述接口端口，其适于将电路与光学镜模块外部的设备电耦合。 如上所述，接口端口位于基板上并与平面上的管芯间隔开。

公开(公告)号：US07166911B2

公开(公告)日：2007-01-23

申请号：US10952424

申请日：2004-09-28

申请人： Maurice S. Karpman ,  Nicole Hablutzel ,  Peter W. Farrell ,  Michael W. Judy ,  Lawrence E. Felton ,  Lewis Long

发明人： Maurice S. Karpman ,  Nicole Hablutzel ,  Peter W. Farrell ,  Michael W. Judy ,  Lawrence E. Felton ,  Lewis Long

IPC分类号： H01L23/12

CPC分类号： B81B7/0048 ,  H01L2224/32014 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00

摘要： A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.

摘要翻译： MEMS惯性传感器固定在至少部分由低透湿成型材料形成的预成型包装中。 因此，这种运动检测器应该能够比使用陶瓷封装的那些更经济地生产。 为了达到这些目的，包装件具有从引线框架延伸以形成空腔的至少一个壁（具有低的透湿性），并且在该空腔内具有隔离器（具有顶部表面）。 MEMS惯性传感器具有悬挂在具有底表面的基底上方的可移动结构。 衬底底表面在接触区域处固定到隔离器顶表面。 在说明性实施例中，接触面积小于衬底的底表面的表面积。 因此，隔离器在底部基板表面的至少一部分和封装之间形成空间。 因此，这个空间没有隔离器。 此外，由于封装的透湿性低，可以避免进一步的生产步骤，同时确保水分不会对空腔内的MEMS惯性传感器产生不利影响。

公开(公告)号：US20050035446A1

公开(公告)日：2005-02-17

申请号：US10952424

申请日：2004-09-28

申请人： Maurice Karpman ,  Nicole Hablutzel ,  Peter Farrell ,  Michael Judy ,  Lawrence Felton ,  Lewis Long

发明人： Maurice Karpman ,  Nicole Hablutzel ,  Peter Farrell ,  Michael Judy ,  Lawrence Felton ,  Lewis Long

IPC分类号： B81B7/00 ,  H01L23/06

CPC分类号： B81B7/0048 ,  H01L2224/32014 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00

摘要： A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.

摘要翻译： MEMS惯性传感器固定在至少部分由低透湿成型材料形成的预成型包装中。 因此，这种运动检测器应该能够比使用陶瓷封装的那些更经济地生产。 为了达到这些目的，包装件具有从引线框架延伸以形成空腔的至少一个壁（具有低的透湿性），并且在该空腔内具有隔离器（具有顶部表面）。 MEMS惯性传感器具有悬挂在具有底表面的基底上方的可移动结构。 衬底底表面在接触区域处固定到隔离器顶表面。 在说明性实施例中，接触面积小于衬底的底表面的表面积。 因此，隔离器在底部基板表面的至少一部分和封装之间形成空间。 因此，这个空间没有隔离器。 此外，由于封装的透湿性低，可以避免进一步的生产步骤，同时确保水分不会对空腔内的MEMS惯性传感器产生不利影响。

公开(公告)号：US07040922B2

公开(公告)日：2006-05-09

申请号：US10454999

申请日：2003-06-05

申请人： Kieran P. Harney ,  Lawrence E. Felton ,  Lewis Long

发明人： Kieran P. Harney ,  Lawrence E. Felton ,  Lewis Long

IPC分类号： H01R11/01 ,  H01R9/00 ,  H01R13/00 ,  G01D11/00

CPC分类号： G01C21/16 ,  B81B7/0074 ,  Y10S439/913

摘要： An electrical interconnect apparatus has a mounting member with a plurality of sides. The mounting member is formed from an insulator as a cuboid. Moreover, the mounting member also may be formed from a flexible circuit. Among other things, the plurality of sides includes an interface side. At least two of the plurality of sides are in electrical communication with the interface side.

摘要翻译： 电互连装置具有多个侧面的安装构件。 安装构件由作为长方体的绝缘体形成。 此外，安装构件也可以由柔性电路形成。 其中，多个侧面包括界面侧。 多个侧面中的至少两个与接口侧电连通。

公开(公告)号：US06768196B2

公开(公告)日：2004-07-27

申请号：US10234215

申请日：2002-09-04

申请人： Kieran Harney ,  Lewis Long

发明人： Kieran Harney ,  Lewis Long

IPC分类号： H01L2306

CPC分类号： B81B7/0048 ,  H01L23/16 ,  H01L23/562 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A packaged microchip has a stress sensitive microchip having a microchip coefficient of thermal expansion, a package having a package coefficient of thermal expansion, and an isolator having an isolator coefficient of thermal expansion. The isolator is connected between the stress sensitive microchip and the package. The microchip coefficient of thermal expansion illustratively is closer to the isolator coefficient of thermal expansion than it is to the package coefficient of thermal expansion.

摘要翻译： 封装的微芯片具有具有微芯片热膨胀系数的应力敏感微芯片，具有封装热膨胀系数的封装以及具有隔离器热膨胀系数的隔离器。 隔离器连接在应力敏感微芯片和封装之间。 微芯片的热膨胀系数比封装热膨胀系数更接近绝缘子热膨胀系数。