METHOD TO IMPROVE SEMICONDUCTOR SURFACES AND POLISHING
    2.
    发明申请
    METHOD TO IMPROVE SEMICONDUCTOR SURFACES AND POLISHING 有权
    改善半导体表面和抛光的方法

    公开(公告)号:US20140073131A1

    公开(公告)日:2014-03-13

    申请号:US13609292

    申请日:2012-09-11

    IPC分类号: H01L21/768

    摘要: A method of forming a semiconductor device is disclosed. The method including providing a substrate with at least one insulating layer disposed thereon, the at least one insulating layer including a trench; forming at least one liner layer on the at least one insulating layer; forming a nucleation layer on the at least one liner layer; forming a first metal film on a surface of the nucleation layer; etching the first metal film; and depositing a second metal film on the etched surface of the first metal film, the second metal film substantially forming an overburden above the trench.

    摘要翻译: 公开了一种形成半导体器件的方法。 所述方法包括提供其上设置有至少一个绝缘层的衬底,所述至少一个绝缘层包括沟槽; 在所述至少一个绝缘层上形成至少一个衬垫层; 在所述至少一个衬垫层上形成成核层; 在成核层的表面上形成第一金属膜; 蚀刻第一金属膜; 以及在所述第一金属膜的蚀刻表面上沉积第二金属膜,所述第二金属膜基本上形成在所述沟槽上方的覆盖层。