摘要:
A novel Land Grid Array (LGA) interposer with adhesive-retained contacts and method of manufacture provide improved reliability in LGA mounting applications. A flexible adhesive is used to secure LGA interposer contacts to the walls of voids through an interposer frame. The contacts may be spring contacts or “fuzz button” type contacts. The use of a flexible adhesive provides for floating movement of the contacts within the voids so that thermal expansion stresses do not cause unbalanced compression of the contacts that could otherwise occur with a fixed attachment of the contacts to the frame. The resulting interposer can provide reliable electrical connection from LGA lands on an integrated circuit package to lands on an electronic assembly that is highly tolerant of thermal expansion differences, while eliminating migration of the contacts out of the voids that could otherwise cause shorting or disconnection.
摘要:
An electrical connector includes contact pads on a printed circuit board and contact members on a substrate. The contact members are pressed against the contact pads by a compression mat having compressor fingers. A clamping arrangement forces the compressor fingers against the substrate and thereby presses the contact members against the connector pads. The compression mat is made of elastomeric material, which has a tendency to relax and thus reduce the pressure after the clamping arrangement is tightened. A restrainer member is used to offset this tendency of the polymer to relax. The restrainer member has holes through which the compressor fingers of the compression mat extend.
摘要:
Disclosed are enhanced methods and elastomeric compression structures utilizing embedded gas-filled gas-filled polymeric microspheres that are expanded in predefined conditions that are usable in electrical components for reducing stress relaxation.
摘要:
Disclosed are heat management method, and system, and computer program product that include at least one optical strain gauge that is mounted on a printed board in proximity to an object being monitored for temperature changes. Power for controlling heat to the object is modified in response to changes in the optical reference signal of the gauge, whereby such changes are correlated to the rate of strain change in the object as measured relative to predefined temperature changes of the object being monitored.