Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture
    1.
    发明申请
    Land grid array (LGA) interposer with adhesive-retained contacts and method of manufacture 失效
    带有粘合剂保持触点的焊盘阵列(LGA)插入件和制造方法

    公开(公告)号:US20050208785A1

    公开(公告)日:2005-09-22

    申请号:US10803634

    申请日:2004-03-18

    摘要: A novel Land Grid Array (LGA) interposer with adhesive-retained contacts and method of manufacture provide improved reliability in LGA mounting applications. A flexible adhesive is used to secure LGA interposer contacts to the walls of voids through an interposer frame. The contacts may be spring contacts or “fuzz button” type contacts. The use of a flexible adhesive provides for floating movement of the contacts within the voids so that thermal expansion stresses do not cause unbalanced compression of the contacts that could otherwise occur with a fixed attachment of the contacts to the frame. The resulting interposer can provide reliable electrical connection from LGA lands on an integrated circuit package to lands on an electronic assembly that is highly tolerant of thermal expansion differences, while eliminating migration of the contacts out of the voids that could otherwise cause shorting or disconnection.

    摘要翻译: 具有粘合剂保持触点和制造方法的新型Land Grid Array(LGA)插入器在LGA安装应用中提供了更高的可靠性。 使用柔性粘合剂通过插入框架将LGA插入件触点固定在空隙壁上。 触点可以是弹簧触点或“模糊按钮”型触点。 柔性粘合剂的使用提供了触点在空隙内的浮动运动,使得热膨胀应力不会导致触头的不平衡压缩,否则可能会由触头固定在框架上。 所得到的内插器可以提供从集成电路封装上的LGA焊盘到位于电子组件上的高度耐热膨胀差异的可靠的电连接,同时消除触点脱离可能引起短路或断开的空隙之外的迁移。

    System and method for optimizing heat management
    4.
    发明申请
    System and method for optimizing heat management 有权
    优化热管理系统和方法

    公开(公告)号:US20060170904A1

    公开(公告)日:2006-08-03

    申请号:US11050053

    申请日:2005-02-03

    IPC分类号: G01B11/16

    摘要: Disclosed are heat management method, and system, and computer program product that include at least one optical strain gauge that is mounted on a printed board in proximity to an object being monitored for temperature changes. Power for controlling heat to the object is modified in response to changes in the optical reference signal of the gauge, whereby such changes are correlated to the rate of strain change in the object as measured relative to predefined temperature changes of the object being monitored.

    摘要翻译: 公开了热管理方法,系统和计算机程序产品,其包括安装在印刷板上的至少一个光学应变计,所述光学应变计附近被监测用于温度变化的物体。 响应于计量器的光学参考信号的变化来修改对对象的热控制的功率,由此这种变化与被测物体相对于被监视物体的预定温度变化测量的物体中的应变变化速率相关。