摘要:
A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The planarization layer is of substantially uniform thickness and/or its outer surface has a peak to valley distance of less than 10 μm. The planarization layer may be formed by applying two solutions of different concentration. A surface treatment may be applied to the burls to repel a solution of the planarization layer material.
摘要:
A new and distinct cultivar of Caryopteris plant named ‘Summer Sorbet’, characterized by its compact and mounded plant habit; freely branching growth habit; and green and yellow variegated leaves.
摘要:
A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The planarization layer is of substantially uniform thickness and/or its outer surface has a peak to valley distance of less than 10 μm. The planarization layer may be formed by applying two solutions of different concentration. A surface treatment may be applied to the burls to repel a solution of the planarization layer material.
摘要:
A new and distinct white-flowered Pyracantha plant is provided that is a spontaneous whole plant mutation of the ‘Cadrou’ cultivar (non-patented in the United States). The new cultivar readily forms white flowers and red berries and can be readily distinguished from the ‘Cadrou’ cultivar by presence of attractive variegated leaves. A broad-bushy to flat-bushy growth habit with robustness and abundant branching commonly is displayed. Good resistance to scab and fire blight is provided to the grower. During observations to date less fructification than the ‘Cadrou’ cultivar has been noted.
摘要:
A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The planarization layer is of substantially uniform thickness and/or its outer surface has a peak to valley distance of less than 10 μm. The planarization layer may be formed by applying two solutions of different concentration. A surface treatment may be applied to the burls to repel a solution of the planarization layer material.