Lamp with an integrated flasher device
    2.
    发明授权
    Lamp with an integrated flasher device 失效
    带有集成闪光灯装置的灯

    公开(公告)号:US3975659A

    公开(公告)日:1976-08-17

    申请号:US557783

    申请日:1975-03-12

    CPC分类号: H01K1/625 H01C7/04

    摘要: A lamp for installation in the flashers or winkers of motor vehicles, with a flasher device integrated into the lamp itself, is provided. The flashing is produced, in the case of the invention, by the utilization of substances which exhibit a sudden change in resistivity at a certain temperature. This is the case with powdered V O.sub.2 when formed into an aglomerate by the use of an organic binder. A block assembled in the bulb of the lamp and in electrical parallel with the filament, does not effect the incandescent state of the latter as long as a temperature of 68.degree. C is not exceeded, but effectively short-circuits the filament beyond this temperature. In this fashion, successive extinctions and relightings take place by a process of relaxation. In the case of a C.sub.36 H.sub.74 wax filled with conductive powder, the phenomena are reversed and the block must be connected in series with the filament.

    摘要翻译: 提供一种用于安装在机动车辆的闪光灯或方向指示灯中的灯,其具有集成到灯本身中的闪光灯装置。 在本发明的情况下,通过利用在一定温度下表现出电阻率突然变化的物质产生闪光。 当通过使用有机粘合剂形成凝聚物时,这是粉状V 2 O的情况。 只要不超过68℃的温度,组装在灯泡中并且与灯丝电并联的块不会影响后者的白炽状态,而是有效地将灯丝短路超过该温度。 以这种方式,连续的灭绝和重击是通过放松的过程进行的。 在填充有导电粉末的C36H74蜡的情况下,这种现象是相反的,块必须与灯丝串联。

    Method for forming a multilayered metal network for bonding components
of a high-density integrated circuit using a spin on glass layer
    3.
    发明授权
    Method for forming a multilayered metal network for bonding components of a high-density integrated circuit using a spin on glass layer 失效
    用于形成用于使用玻璃上的自旋键合高密度集成电路的部件的多层金属网络的方法

    公开(公告)号:US4906592A

    公开(公告)日:1990-03-06

    申请号:US323049

    申请日:1989-03-14

    摘要: In a high-density integrated circuit having a multilayered metal interconnection network, a planarization layer is formed over a lower metal layer which includes conductors having steep edges by chemically depositing a dielectric layer in the vapor phase over the lower metal layer so as to fill up hollows formed in the dielectric layer in intervals between the conductors, spreading a viscous layer of spin-on-glass over the dielectric layer, annealing the spin-on-glass layer to form a compact mass, forming vias through the spin-on-glass and dielectric layers to the conductors, and applying an upper metal layer over the spin-on-glass layer so as to fill the vias and provide electrical contacts to the conductors of the lower metal layer.

    摘要翻译: 在具有多层金属互连网络的高密度集成电路中,在下金属层上形成平坦化层,该下金属层包括具有陡边的导体,通过在气相中在下金属层上化学沉积介电层以填满 在电介质层之间以导体之间的间隔形成凹槽,在电介质层上铺展一层粘合的玻璃玻璃层,使旋涂玻璃层退火以形成紧凑的质量,通过旋涂玻璃形成通孔 和电介质层,并且在旋涂玻璃层上施加上金属层,以便填充通孔并且向下金属层的导体提供电接触。