公开(公告)号：US4877175A

公开(公告)日：1989-10-31

申请号：US292048

申请日：1988-12-30

申请人： Marshall G. Jones ,  Prem N. Batra

发明人： Marshall G. Jones ,  Prem N. Batra

IPC分类号： B23K1/00 ,  B23K1/018 ,  B23K26/00 ,  B23K26/08 ,  B23K26/38 ,  H01L23/525 ,  H05K3/22 ,  H05K3/34

CPC分类号： H01L23/5258 ,  B23K1/018 ,  B23K26/0006 ,  B23K26/0081 ,  H05K3/225 ,  B23K2203/56 ,  H01L2924/0002 ,  H05K2203/046 ,  H05K2203/107 ,  H05K2203/175 ,  H05K3/3421

摘要： A solder bridge between leads of a microelectronic circuit is removed by projecting a laser beam onto the solder bridge with sufficient power to cause the solder forming the bridge to melt and to flow onto a wicking tool placed into contact with the solder bridge. The wicking tool is removed during the heating to remove the solder and debridge the leads. Microelectronic leads having a width of the order of 4 mils and a pitch of the order of 8 mils may be debridged easily using the invention.