公开(公告)号：US5334306A

公开(公告)日：1994-08-02

申请号：US973611

申请日：1992-11-19

申请人： William C. Dautremont-Smith ,  Leonard C. Feldman ,  Rafael Kalish ,  Avishay Katz ,  Barry Miller ,  Netzer Moriya

发明人： William C. Dautremont-Smith ,  Leonard C. Feldman ,  Rafael Kalish ,  Avishay Katz ,  Barry Miller ,  Netzer Moriya

IPC分类号： C01B31/06 ,  H01L21/203 ,  H01L21/48 ,  H01L21/52 ,  H01L23/12 ,  H01L23/373 ,  H01S3/00 ,  H05K3/10 ,  C25D5/02 ,  C25D5/54 ,  C25D7/12

CPC分类号： H05K3/105 ,  H01L21/4803 ,  H01L21/486 ,  H01L23/3732 ,  H01L2924/0002 ,  H01L2924/3011

摘要： A graphite path is formed along the surface of a diamond plate, preferably a CVD diamond plate, by means of a laser or ion-implantation induced conductivity. The path advantageously can be the surface of a sidewall of a via hole drilled by the laser through the plate or a path running along a side surface of the plate from top to bottom opposed major surfaces of the plate. The graphite path is metallized, as by electroplating or electroless plating. In this way, for example, an electrically conducting connection can be made between a metallized backplane located on the bottom surface of the plate and a wire-bonding pad located on the top surface of the plate.

摘要翻译： 通过激光或离子注入诱导的导电性，沿着金刚石板的表面，优选为CVD金刚石板形成石墨路径。 该路径有利地可以是激光穿过板钻出的通孔的侧壁的表面或沿着板的侧表面从板的顶部到底部相对的主表面延伸的路径。 石墨路径被金属化，如通过电镀或化学镀。 以这种方式，例如，可以在位于板的底表面上的金属化背板和位于板的顶表面上的引线焊盘之间形成导电连接。