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公开(公告)号:US20140263588A1
公开(公告)日:2014-09-18
申请号:US13801803
申请日:2013-03-13
CPC分类号: B23K1/20 , B23K1/0016 , B23K1/206 , B23K3/0623 , B23K3/08 , B23K35/0244 , B23K35/025 , B23K35/24 , B23K35/26 , B23K35/302 , B23K35/3033 , B23K2101/42
摘要: A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.
摘要翻译: 示出了焊料和形成电互连的方法。 焊料的实例包括镓基焊料。 包括镓的焊料被显示为包括与镓基基质混合的其它焊料的颗粒。 示出了施加焊料的方法,其包括在包括抗蚀剂图案的表面上滑动焊料材料。 还示出了施加焊料的方法,其包括施加浸渍在提供助熔功能以帮助焊料粘附的酸溶液中的焊料。
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公开(公告)号:US20180088724A1
公开(公告)日:2018-03-29
申请号:US15280060
申请日:2016-09-29
摘要: A multi-function input interface for an electronic device. The multi-function input interface including a conductive portion to transceive a signal through the input interface. The input interface includes a positional element to detect a user input to the input interface.
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