公开(公告)号：US08927590B2

公开(公告)日：2015-01-06

申请号：US13593110

申请日：2012-08-23

申请人： Asaf R. Alimardanov ,  Lalitha Krishnan ,  Maotang Zhou ,  Ting-Zhong Wang ,  Jianxin Ren ,  John Leo Considine ,  Charles C. Wu ,  Jason Brazzillo ,  Panolil Raveendranath ,  Karen Sutherland ,  Mahmoud Mirmehrabi ,  Subodh S. Deshmukh ,  Girija Raveendranath ,  Vijay Raveendranath ,  Sanjay Raveendranath

发明人： Asaf R. Alimardanov ,  Lalitha Krishnan ,  Maotang Zhou ,  Ting-Zhong Wang ,  Jianxin Ren ,  John Leo Considine ,  Charles C. Wu ,  Jason Brazzillo ,  Panolil Raveendranath ,  Karen Sutherland ,  Mahmoud Mirmehrabi ,  Subodh S. Deshmukh

IPC分类号： A61K31/40 ,  C07D207/02 ,  C07D207/16

CPC分类号： C07D207/16

摘要： Provided are methods for the preparation of certain substituted pyrrolidine compounds, forms of (2S,4R)-1-(2-aminoacetyl)-4-benzamidopyrrolidine-2-carboxylic acid hydrochloride, and methods for preparing and using these forms.

摘要翻译： 提供制备某些取代的吡咯烷化合物的方法，（2S，4R）-1-（2-氨基乙酰基）-4-苯甲酰基吡咯烷-2-甲酸盐酸盐的形式，以及制备和使用这些形式的方法。

公开(公告)号：US20130224444A1

公开(公告)日：2013-08-29

申请号：US13855100

申请日：2013-04-02

申请人： ALEKSANDAR ALEKSOV ,  RAJASEKARAN SWAMINATHAN ,  TING ZHONG

发明人： ALEKSANDAR ALEKSOV ,  RAJASEKARAN SWAMINATHAN ,  TING ZHONG

IPC分类号： H01F1/01

CPC分类号： H01F1/01 ,  B23K1/0016 ,  B23K1/20 ,  H01L24/05 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05547 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13584 ,  H01L2224/16225 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05552

摘要： The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.

摘要翻译： 本公开涉及制造微电子封装的领域，其中微电子封装的部件可具有包括磁性部件和金属部件的磁性附接结构。 磁性附着结构可能暴露于磁场，通过磁性部件的振动可以加热磁性附着结构，并且当与焊料材料接触时，磁性附着结构可以回流焊料材料并附着微电子部件 微电子封装。

公开(公告)号：US20110278044A1

公开(公告)日：2011-11-17

申请号：US12778313

申请日：2010-05-12

申请人： Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Ting Zhong

发明人： Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Ting Zhong

IPC分类号： H01B5/00 ,  B23K31/02

CPC分类号： H01F1/01 ,  B23K1/0016 ,  B23K1/20 ,  H01L24/05 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05547 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13584 ,  H01L2224/16225 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05552

摘要： The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.

摘要翻译： 本公开涉及制造微电子封装的领域，其中微电子封装的部件可具有包括磁性部件和金属部件的磁性附接结构。 磁性附着结构可能暴露于磁场，通过磁性部件的振动可以加热磁性附着结构，并且当与焊料材料接触时，磁性附着结构可以回流焊料材料并附着微电子部件 微电子封装。

公开(公告)号：US20070123025A1

公开(公告)日：2007-05-31

申请号：US11627812

申请日：2007-01-26

申请人： Ting Zhong ,  Valery Dubin ,  Ming Fang

发明人： Ting Zhong ,  Valery Dubin ,  Ming Fang

IPC分类号： H01L21/4763 ,  H01L23/48

CPC分类号： H01L21/2885 ,  H01L21/7685 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/05099

摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a barrier layer on a substrate, wherein the barrier layer comprises molybdenum; and forming a lead free interconnect structure on the barrier layer.

摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括在衬底上形成阻挡层，其中阻挡层包含钼; 以及在阻挡层上形成无铅互连结构。

公开(公告)号：US20140263588A1

公开(公告)日：2014-09-18

申请号：US13801803

申请日：2013-03-13

申请人： Ting Zhong ,  Rajashree Raji Baskaran ,  Aleksandar Aleks Aleksov

发明人： Ting Zhong ,  Rajashree Raji Baskaran ,  Aleksandar Aleks Aleksov

IPC分类号： B23K1/20 ,  B23K35/02

CPC分类号： B23K1/20 ,  B23K1/0016 ,  B23K1/206 ,  B23K3/0623 ,  B23K3/08 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/26 ,  B23K35/302 ,  B23K35/3033 ,  B23K2101/42

摘要： A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.

摘要翻译： 示出了焊料和形成电互连的方法。 焊料的实例包括镓基焊料。 包括镓的焊料被显示为包括与镓基基质混合的其它焊料的颗粒。 示出了施加焊料的方法，其包括在包括抗蚀剂图案的表面上滑动焊料材料。 还示出了施加焊料的方法，其包括施加浸渍在提供助熔功能以帮助焊料粘附的酸溶液中的焊料。

公开(公告)号：US20080202922A1

公开(公告)日：2008-08-28

申请号：US11678056

申请日：2007-02-22

申请人： Ting Zhong ,  Arnel M. Fajardo ,  Chang-Min Park

发明人： Ting Zhong ,  Arnel M. Fajardo ,  Chang-Min Park

IPC分类号： C05B9/00

CPC分类号： C23C18/1673 ,  C23C18/1669 ,  C23C18/1671 ,  C23C18/34 ,  C25D3/12 ,  C25D3/562 ,  C25D5/006

摘要： A hybrid electro-deposition process for soft magnetic cobalt alloy films comprises providing a plating bath that includes cobalt and a reducing agent, providing a cobalt-containing anode in the plating bath coupled to a power supply, providing a substrate in the plating bath coupled to the power supply, wherein the substrate functions as a cathode, applying a magnetic field across the plating bath, and applying an electrical current to the plating bath by way of the power supply to cause the cobalt to deposit onto the substrate and form a soft magnetic film.

摘要翻译： 用于软磁性钴合金膜的混合电沉积方法包括提供包括钴和还原剂的电镀槽，在与电源相连的电镀槽中提供含钴阳极，在镀浴中提供与 所述电源，其中所述衬底用作阴极，在所述电镀槽上施加磁场，并且通过所述电源将电流施加到所述电镀槽，以使所述钴沉积到所述衬底上并形成软磁体 电影。

公开(公告)号：US06914045B2

公开(公告)日：2005-07-05

申请号：US10131890

申请日：2002-04-25

申请人： Darren Robert Abbanat ,  Valerie Sue Bernan ,  Russell George Dushin ,  Michael Greenstein ,  Haiyin He ,  Stanley Albert Lang ,  Howard Newman ,  Subas Sakya ,  Phaik-Eng Sum ,  Alan Gordon Sutherland ,  Ting-Zhong Wang ,  Jason Arnold Lotvin ,  Mark Edward Ruppen ,  Arthur Emergy Bailey ,  Ping Cai ,  Bo Shen ,  Fangming Kong

发明人： Darren Robert Abbanat ,  Valerie Sue Bernan ,  Russell George Dushin ,  Michael Greenstein ,  Haiyin He ,  Stanley Albert Lang ,  Howard Newman ,  Subas Sakya ,  Phaik-Eng Sum ,  Alan Gordon Sutherland ,  Ting-Zhong Wang ,  Jason Arnold Lotvin ,  Mark Edward Ruppen ,  Arthur Emergy Bailey ,  Ping Cai ,  Bo Shen ,  Fangming Kong

IPC分类号： A61K38/00 ,  C07H15/203 ,  C07H19/04 ,  C07K9/00

CPC分类号： C07H15/203 ,  A61K38/00 ,  C07H19/04 ,  C07K9/008

摘要： The invention provides compounds of formula Wherein R1, R2, R3, R4, R5, R6a, R6b, R6c, R6d, R6e and R7 are defined in the specification. These compounds are useful as antibiotic agents.

公开(公告)号：US09835648B2

公开(公告)日：2017-12-05

申请号：US13173933

申请日：2011-06-30

申请人： Rajashree Baskaran ,  Kimin Jun ,  Ting Zhong ,  Roy E. Swart ,  Paul B. Fischer

发明人： Rajashree Baskaran ,  Kimin Jun ,  Ting Zhong ,  Roy E. Swart ,  Paul B. Fischer

IPC分类号： G01R31/28 ,  G01R1/04 ,  H01R3/08 ,  G01R1/067

CPC分类号： G01R1/0416 ,  G01R1/06783 ,  H01R3/08 ,  Y10T29/49204

摘要： Embodiments of the invention provide methods for forming electrical connections using liquid metals. Electrical connections that employ liquid metals are useful for testing and validation of semiconductor devices. Electrical connections are formed between the probes of a testing interface and the electronic interface of a device under test through a liquid metal region. In embodiments of the invention, liquid metal interconnects are comprised of gallium or liquid metal alloys of gallium. The use of liquid metal contacts does not require a predetermined amount of force be applied in order to reliably make an electrical connection.

公开(公告)号：US08434668B2

公开(公告)日：2013-05-07

申请号：US12778313

申请日：2010-05-12

申请人： Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Ting Zhong

发明人： Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Ting Zhong

IPC分类号： B23K31/02 ,  H01L21/44

CPC分类号： H01F1/01 ,  B23K1/0016 ,  B23K1/20 ,  H01L24/05 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05547 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13584 ,  H01L2224/16225 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05552

摘要： The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.

公开(公告)号：US07416980B2

公开(公告)日：2008-08-26

申请号：US11078611

申请日：2005-03-11

申请人： Ting Zhong ,  Valery Dubin ,  Ming Fang

发明人： Ting Zhong ,  Valery Dubin ,  Ming Fang

IPC分类号： H01L21/44

CPC分类号： H01L21/2885 ,  H01L21/7685 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/05099

摘要： Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a barrier layer on a substrate, wherein the barrier layer comprises molybdenum; and forming a lead free interconnect structure on the barrier layer.

摘要翻译： 描述形成微电子结构的方法。 这些方法的实施例包括在衬底上形成阻挡层，其中阻挡层包含钼; 以及在阻挡层上形成无铅互连结构。