摘要:
The present invention is embodied in a system and method for creating markers on scroll bars of a graphical user interface. Basically, the present invention allows users to reference locations of interest within a document using scroll bars of a user interface by creating graphical halt and pause points on the scroll bar at the locations of interest. In general, the present invention includes a user interface with a digital document of an application being used by a user. The application has at least a vertical scroll bar for moving from one location to another within the digital document. The scroll bar includes a scroll box, stub points and end points. The stub points represent reference points within the digital document that are predefined by the user. The stub points either stop or pause the movement of the scroll box as it moves along the scroll bar. The end points represent the top and bottom portion of the digital document.
摘要:
A multilayer wiring board 10 comprises a substrate having a plurality of layers of reinforced resin material 12,18,19,26,18′,19′,26′, a patterned conductive layer 28,28′ provided on at least one major surface of the substrate, a plurality of via holes 30,32,34,36 provided at least partly through the substrate, and a plurality of signal carrying wires 20,20′. The signal carrying wires 20,20′ are provided between at least two of the layers of reinforced resin material 12,18,19,26,18′,19′,26′. The signal carrying wires 20,20′ can be embedded in a resin layer 21,21′, and the resin layer 21,21′ sandwiched between a pair 18,19,18′,19 of the layers of reinforced resin material. The reinforced resin material 12,18,19,26,18′,19 is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core 22,24,22′,24′, e.g., a copper/ molybdenum/copper laminate, can be provided between a major surface of the substrate and the pair 18,19,18′,19 of reinforced resin layers sandwiching the signal carrying wires 20,20′. The board 10 can be used in a multilayer wiring package wherein a plurality of integrated circuit chips are mounted on a major surface of the board 10. Applications include digital, high-speed digital and RF interconnects.