System and method for creating markers on scroll bars of a graphical user interface
    1.
    发明授权
    System and method for creating markers on scroll bars of a graphical user interface 失效
    用于在图形用户界面的滚动条上创建标记的系统和方法

    公开(公告)号:US06778192B2

    公开(公告)日:2004-08-17

    申请号:US09826703

    申请日:2001-04-05

    IPC分类号: G09G500

    摘要: The present invention is embodied in a system and method for creating markers on scroll bars of a graphical user interface. Basically, the present invention allows users to reference locations of interest within a document using scroll bars of a user interface by creating graphical halt and pause points on the scroll bar at the locations of interest. In general, the present invention includes a user interface with a digital document of an application being used by a user. The application has at least a vertical scroll bar for moving from one location to another within the digital document. The scroll bar includes a scroll box, stub points and end points. The stub points represent reference points within the digital document that are predefined by the user. The stub points either stop or pause the movement of the scroll box as it moves along the scroll bar. The end points represent the top and bottom portion of the digital document.

    摘要翻译: 本发明体现在用于在图形用户界面的滚动条上创建标记的系统和方法。 基本上,本发明允许用户通过在感兴趣的位置处在滚动条上创建图形停止和暂停点来引用用户界面的滚动条来引用文档内的感兴趣的位置。 通常,本发明包括具有用户使用的应用的数字文档的用户界面。 应用程序至少有一个用于在数字文档中从一个位置移动到另一个位置的垂直滚动条。 滚动条包括一个滚动框,存根点和终点。 存根点表示数字文档中由用户预定义的参考点。 存根点在滚动条移动时停止或暂停滚动框的移动。 终点表示数字文档的顶部和底部。

    Multilayer wiring board and multilayer wiring package
    2.
    发明授权
    Multilayer wiring board and multilayer wiring package 有权
    多层布线板和多层布线封装

    公开(公告)号:US06372999B1

    公开(公告)日:2002-04-16

    申请号:US09295037

    申请日:1999-04-20

    IPC分类号: H01R1204

    摘要: A multilayer wiring board 10 comprises a substrate having a plurality of layers of reinforced resin material 12,18,19,26,18′,19′,26′, a patterned conductive layer 28,28′ provided on at least one major surface of the substrate, a plurality of via holes 30,32,34,36 provided at least partly through the substrate, and a plurality of signal carrying wires 20,20′. The signal carrying wires 20,20′ are provided between at least two of the layers of reinforced resin material 12,18,19,26,18′,19′,26′. The signal carrying wires 20,20′ can be embedded in a resin layer 21,21′, and the resin layer 21,21′ sandwiched between a pair 18,19,18′,19 of the layers of reinforced resin material. The reinforced resin material 12,18,19,26,18′,19 is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core 22,24,22′,24′, e.g., a copper/ molybdenum/copper laminate, can be provided between a major surface of the substrate and the pair 18,19,18′,19 of reinforced resin layers sandwiching the signal carrying wires 20,20′. The board 10 can be used in a multilayer wiring package wherein a plurality of integrated circuit chips are mounted on a major surface of the board 10. Applications include digital, high-speed digital and RF interconnects.

    摘要翻译: 多层布线板10包括具有多层增强树脂材料12,18,19,26,18',19',26'的基板,设置在至少一个主表面上的图案化导电层28,28' 基板,至少部分地设置在基板上的多个通孔30,32,34,36以及多个信号承载线20,20'。 信号承载线20,20'设置在增强树脂材料层12,18,19,26,18',19',26'的至少两层之间。 信号承载线20,20'可以嵌入在树脂层21,21'中,树脂层21,21'夹在强化树脂材料层之间的一对18,19,18',19之间。 增强树脂材料12,18,19,26,18',19优选为纤维增强树脂材料,例如玻璃纤维增​​强环氧树脂或聚酰亚胺材料。 在一些应用中,可以在基材的主表面和增强的基体的对18,19,18',19之间提供约束芯22,24,22',24',例如铜/钼/铜层压板 夹着信号承载线20,20'的树脂层。 板10可用于多层布线封装,其中多个集成电路芯片安装在板10的主表面上。应用包括数字,高速数字和RF互连。