公开(公告)号：US06372999B1

公开(公告)日：2002-04-16

申请号：US09295037

申请日：1999-04-20

申请人： William D. Bjorndahl ,  M. David Saferstein ,  Alexander Krayner ,  Cindy S. Fietze ,  Kenneth C. Selk ,  Rene R. Martinez ,  William E. McMullen

发明人： William D. Bjorndahl ,  M. David Saferstein ,  Alexander Krayner ,  Cindy S. Fietze ,  Kenneth C. Selk ,  Rene R. Martinez ,  William E. McMullen

IPC分类号： H01R1204

CPC分类号： H05K3/103 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/10287

摘要： A multilayer wiring board 10 comprises a substrate having a plurality of layers of reinforced resin material 12,18,19,26,18′,19′,26′, a patterned conductive layer 28,28′ provided on at least one major surface of the substrate, a plurality of via holes 30,32,34,36 provided at least partly through the substrate, and a plurality of signal carrying wires 20,20′. The signal carrying wires 20,20′ are provided between at least two of the layers of reinforced resin material 12,18,19,26,18′,19′,26′. The signal carrying wires 20,20′ can be embedded in a resin layer 21,21′, and the resin layer 21,21′ sandwiched between a pair 18,19,18′,19 of the layers of reinforced resin material. The reinforced resin material 12,18,19,26,18′,19 is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core 22,24,22′,24′, e.g., a copper/ molybdenum/copper laminate, can be provided between a major surface of the substrate and the pair 18,19,18′,19 of reinforced resin layers sandwiching the signal carrying wires 20,20′. The board 10 can be used in a multilayer wiring package wherein a plurality of integrated circuit chips are mounted on a major surface of the board 10. Applications include digital, high-speed digital and RF interconnects.

摘要翻译： 多层布线板10包括具有多层增强树脂材料12,18,19,26,18'，19'，26'的基板，设置在至少一个主表面上的图案化导电层28,28' 基板，至少部分地设置在基板上的多个通孔30,32,34,36以及多个信号承载线20,20'。 信号承载线20,20'设置在增强树脂材料层12,18,19,26,18'，19'，26'的至少两层之间。 信号承载线20,20'可以嵌入在树脂层21,21'中，树脂层21,21'夹在强化树脂材料层之间的一对18,19,18'，19之间。 增强树脂材料12,18,19,26,18'，19优选为纤维增强树脂材料，例如玻璃纤维增​​强环氧树脂或聚酰亚胺材料。 在一些应用中，可以在基材的主表面和增强的基体的对18,19,18'，19之间提供约束芯22,24,22'，24'，例如铜/钼/铜层压板 夹着信号承载线20,20'的树脂层。 板10可用于多层布线封装，其中多个集成电路芯片安装在板10的主表面上。应用包括数字，高速数字和RF互连。

公开(公告)号：US06194669B1

公开(公告)日：2001-02-27

申请号：US09245317

申请日：1999-02-05

申请人： William D. Bjorndahl ,  D. Ian Stones ,  Kenneth C. Selk ,  Roger A. Davidheiser ,  Alfred E. Lee

发明人： William D. Bjorndahl ,  D. Ian Stones ,  Kenneth C. Selk ,  Roger A. Davidheiser ,  Alfred E. Lee

IPC分类号： H01R1204

CPC分类号： H01L23/66 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/045 ,  H05K1/0243 ,  H05K2201/09809 ,  H05K2201/10734 ,  H01L2924/00

摘要： A high frequency coaxial interconnection solder ball grid array produces a low loss, reproducible electrical interconnection at the circuit board level for mounting one or more high frequency components, such as high frequency IMA modules. Since the coaxial interconnection ball grid array can be and is generally implemented as part of a larger ball grid array, high frequency signal generation, signal reception and digital processing can be combined in a single electronic component, such as a circuit board. A coaxial-like interconnection is formed from a plurality of solder balls configured in a three-by-three square array. The coaxial interconnection solder ball grid array includes a single centrally disposed solder ball for interconnecting with a centrally disposed conductor of a coaxial line and a plurality of solder balls surrounding the single centrally disposed solder ball, some balls of which interconnect with a coaxial ground shield of the coaxial line. When soldered together, the centrally disposed solder ball and the central conductor of the coaxial line have the appearance of a rod with a diameter having a standard 50 ohm impedance. The outer conductive shield or ground signal path of the coaxial line is connected with multiple solder balls, to achieve a lower inductance ground-to-ground connection.

摘要翻译： 高频同轴互连焊球栅格阵列在电路板级产生低损耗，可再现的电互连，用于安装一个或多个高频部件，例如高频IMA模块。 由于同轴互连球栅阵列可以并且通常被实现为较大的球栅阵列的一部分，所以高频信号产生，信号接收和数字处理可以组合在诸如电路板的单个电子部件中。 由三个方形阵列构成的多个焊球形成同轴状的互连。 同轴互连焊球栅格阵列包括单个中心布置的焊球，用于与同轴线的中心布置的导体和围绕单个中心布置的焊球的多个焊球相互连接，其中一些球与同轴接地屏蔽 同轴线。 当焊接在一起时，中心布置的焊球和同轴线的中心导体具有直径为标准50欧姆阻抗的棒的外观。 同轴线的外部导电屏蔽或接地信号路径与多个焊球相连，以实现较低的电感接地连接。