公开(公告)号：US20080236871A1

公开(公告)日：2008-10-02

申请号：US11694188

申请日：2007-03-30

申请人： Richard C. Schaefer ,  Steven Pollock ,  Charles M. Bailley ,  Mike Lowe ,  Andrew J. Balk ,  John G. Oldendorf

发明人： Richard C. Schaefer ,  Steven Pollock ,  Charles M. Bailley ,  Mike Lowe ,  Andrew J. Balk ,  John G. Oldendorf

IPC分类号： H05K1/02 ,  H05K3/20

CPC分类号： H05K1/111 ,  H05K3/341 ,  H05K2201/09063 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49128

摘要： Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.

摘要翻译： 用于表面贴装电路板的部件安装焊盘的通风允许在焊接期间从电气部件及其相关联的安装焊盘之间的接合处逸出气体，并且有助于组件基座和焊盘之间更完整和有效的焊接接头。 排气可以通过板中的一个或多个通孔来实现，以允许不期望的气体逸出到板的下侧，或者通过在衬垫中形成的一个或多个无焊料通道来允许气体逸出 垫的周边。

公开(公告)号：US07709744B2

公开(公告)日：2010-05-04

申请号：US11694188

申请日：2007-03-30

申请人： Richard C. Schaefer ,  Steven Pollock ,  Charles M. Bailley ,  Mike Lowe ,  Andrew J. Balk ,  John G. Oldendorf

发明人： Richard C. Schaefer ,  Steven Pollock ,  Charles M. Bailley ,  Mike Lowe ,  Andrew J. Balk ,  John G. Oldendorf

IPC分类号： H05K1/00

CPC分类号： H05K1/111 ,  H05K3/341 ,  H05K2201/09063 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49128

摘要： Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.

摘要翻译： 用于表面贴装电路板的部件安装焊盘的通风允许在焊接期间从电气部件及其相关联的安装焊盘之间的接合处逸出气体，并且有助于组件基座和焊盘之间更完整和有效的焊接接头。 排气可以通过板中的一个或多个通孔来实现，以允许不期望的气体逸出到板的下侧，或者通过在衬垫中形成的一个或多个无焊料通道来允许气体逸出 垫的周边。